CN110729223A - Silicon chip laying device - Google Patents
Silicon chip laying device Download PDFInfo
- Publication number
- CN110729223A CN110729223A CN201810786235.6A CN201810786235A CN110729223A CN 110729223 A CN110729223 A CN 110729223A CN 201810786235 A CN201810786235 A CN 201810786235A CN 110729223 A CN110729223 A CN 110729223A
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- Prior art keywords
- tray
- silicon wafer
- laying
- bearing plate
- assembly
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 47
- 239000010703 silicon Substances 0.000 title claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 25
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a silicon wafer laying device, and relates to the technical field of solar cell manufacturing. The method comprises the following steps: a bearing table; the tray feeding mechanism comprises a driving assembly, a clamping assembly and a bearing plate, wherein the bearing plate is arranged on the bearing table through the driving assembly, the driving assembly is used for driving the bearing plate to move along a first direction, and the clamping assembly is arranged on the bearing plate and used for clamping a tray on the bearing plate; and the laying mechanism is arranged on the bearing platform and used for laying the silicon wafer on the tray on the bearing plate. The silicon wafer laying device provided by the invention can avoid the relative displacement between the tray and the conveying device in the moving process of the tray.
Description
Technical Field
The invention relates to the field of solar cell manufacturing, in particular to a silicon wafer laying device.
Background
In the production process of the solar cell, the silicon wafer is required to be laid on the corresponding placement position on the tray. In the existing production process, a tray is conveyed to a designated position by using a conveyor belt, and a silicon wafer is laid on a corresponding placing position on the tray by using a manipulator. Meanwhile, the tray is often large in laying area, the movable range of the manipulator is limited, and all silicon wafers cannot be laid on one station, so that the conveyor belt can move the station in a small distance after the manipulator lays a part of the positions of the tray in the process of laying the silicon wafers, and the manipulator can lay other positions of the tray. In this process, the conveyor belt may move the tray multiple times. However, because the friction between the conveyor belt and the tray is limited, when the conveyor belt drives the tray to move, the conveyor belt and the tray move relatively at the starting moment and the stopping moment, and a position error is generated. And the error is continuously increased in multiple movements, which affects the radiation precision of the silicon chip.
Disclosure of Invention
The invention provides a silicon wafer laying device, aiming at solving the problem that a conveyor belt and a tray generate relative displacement to generate position error in the existing silicon wafer laying process.
The invention is realized by the following steps:
a silicon wafer laying apparatus comprising:
a bearing table;
the tray feeding mechanism comprises a driving assembly, a clamping assembly and a bearing plate, wherein the bearing plate is arranged on the bearing table through the driving assembly, the driving assembly is used for driving the bearing plate to move along a first direction, and the clamping assembly is arranged on the bearing plate and used for clamping a tray on the bearing plate;
and the laying mechanism is arranged on the bearing platform and used for laying the silicon wafer on the tray on the bearing plate.
Further, in a preferred embodiment of the present invention, the silicon wafer laying apparatus further includes a first conveyor belt disposed on the carrier for conveying the tray onto the carrier.
Further, in a preferred embodiment of the present invention, a guide groove is formed on the upper surface of the carrier plate along the first direction, two ends of the first conveyor belt are disposed on the carrier table through a lifting assembly, the first conveyor belt is located in the guide groove, and the lifting assembly is configured to drive the first conveyor belt to ascend or descend.
Further, in a preferred embodiment of the present invention, the guide rail groove is provided in a plurality of and parallel to each other.
Further, in a preferred embodiment of the present invention, the first conveyor belts are disposed in parallel, and end portions of the same side of the first conveyor belts are disposed on the same lifting assembly.
Further, in a preferred embodiment of the present invention, the clamping assembly includes at least one group of electric cylinders, each group of electric cylinders includes two electric cylinders, the two electric cylinders in the same group are respectively disposed on two opposite sides of the bearing plate, and a clamping member is disposed on a cylinder rod of each electric cylinder.
Further, in a preferred embodiment of the present invention, the driving assembly includes a screw guide and a servo motor, and the servo motor drives the carrier plate to move along the first direction through the screw guide.
Further, in a preferred embodiment of the invention, the laying mechanism comprises a robot.
Further, in a preferred embodiment of the present invention, a camera assembly is provided on the robot.
Further, in a preferred embodiment of the present invention, the silicon wafer laying apparatus further comprises a second conveyor belt for conveying the silicon wafer to the laying mechanism.
The invention has the beneficial effects that: when the silicon wafer laying device is used, external transportation equipment such as a conveyor belt conveys the tray to the bearing plate. At this moment, the clamping assembly on the bearing plate can clamp the tray on the bearing plate, so that the tray cannot move relative to the bearing plate. After the tray and the bearing plate are fixed with each other, the laying mechanism can lay the part of the tray in the movable range. After the part is laid, the driving assembly drives the bearing table to move, the bearing table drives the tray to move to the next station together, and the laying mechanism continues laying until the tray is completely laid. After the laying is finished, the clamping assembly releases the clamping of the tray, and the laid tray B is taken away by external equipment for subsequent processing. When the plummer drives the tray common motion, because the centre gripping subassembly remains the centre gripping to the tray all the time, prevent that tray and plummer from taking place relative displacement. The position of the tray after moving is ensured not to have errors.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic top view of a silicon wafer laying apparatus according to an embodiment of the present invention;
fig. 2 is a schematic front view of a silicon wafer laying apparatus according to an embodiment of the present invention.
Icon: a silicon wafer A; a tray B; a bearing table 1; a tray feeding mechanism 2; a carrier plate 21; a rail groove 211; a drive assembly 22; an electric cylinder 23; a laying mechanism 3; a first conveyor belt 4; a lifting assembly 5; a camera assembly 6; a second conveyor belt 7.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1 to 2, the present embodiment provides a silicon wafer laying apparatus including:
a bearing table 1;
the tray feeding mechanism 2 comprises a driving assembly 22, a clamping assembly and a bearing plate 21, wherein the bearing plate 21 is arranged on the bearing table 1 through the driving assembly 22, the driving assembly 22 is used for driving the bearing plate 21 to move along a first direction, and the clamping assembly is arranged on the bearing plate 21 and is used for clamping a tray B on the bearing plate 21;
and the laying mechanism is arranged on the bearing table 1 and is used for laying the silicon wafer A on the tray B on the bearing plate 21.
In this embodiment, the first direction is any direction on a plane parallel to the upper surface of the susceptor 1. It is only necessary to realize that the driving assembly 22 drives the carrier plate 21 to move linearly in a certain direction.
In use, the pallet B is transported to the carrier plate 21 by an external transport device, such as a conveyor belt. At this time, the clamping assembly on the bearing plate 21 clamps the tray B on the bearing plate 21, so that the tray B cannot move relative to the bearing plate 21. After the tray B and the carrier 21 are fixed to each other, the laying mechanism lays the portion of the tray B within its movable range. After the part is laid, the driving assembly 22 drives the bearing table 1 to move, the bearing table 1 drives the tray B to move to the next station together, and then the laying mechanism continues laying until the tray B is completely laid. After the laying is finished, the clamping component releases the clamping of the tray B, and the laid tray B is taken away by external equipment for subsequent processing. When plummer 1 drove tray B common motion, because the centre gripping subassembly remains the centre gripping to tray B throughout, prevent that tray B and plummer 1 from taking place relative displacement. The position of the tray B after moving is ensured not to have errors.
Further, referring to fig. 1 and fig. 2, in the embodiment, the silicon wafer laying apparatus further includes a first conveyor belt 4, and the first conveyor belt 4 is disposed on the carrier table 1 and is used for conveying the tray B onto the carrier plate 21. Guide rail groove 211 has been seted up along first direction to loading board 21 upper surface, and first conveyer belt 4 both ends all set up on plummer 1 through lifting unit 5, and first conveyer belt 4 is located guide rail groove 211, and lifting unit 5 is used for driving first conveyer belt 4 and rises or descend.
In specific implementation, the two ends of the first conveyor belt 4 are both provided with the lifting assemblies 5, and the lifting assemblies 5 can use the existing screw lifting assemblies 5 or other universal lifting assemblies 5. The carrier table 1 is disposed below the middle of the first conveyor belt 4, and the first conveyor belt 4 is located in the guide rail groove 211. The depth of the guide groove 211 is greater than the thickness of the first conveyor belt 4. Meanwhile, after the first conveyor belt 4 descends to the lowest point, the upper surface of the first conveyor belt 4 is lower than the upper surface of the bearing table 1; when the first conveyor belt 4 rises to the highest point, the upper surface of the first conveyor belt 4 is higher than the upper surface of the carrier table 1.
The first conveyor belt 4 is used for conveying the tray B, when the tray B is used, the lifting assemblies 5 at two ends of the first conveyor belt 4 lift the first conveyor belt 4 to the highest point, the tray B is placed on the first conveyor belt 4, the first conveyor belt 4 moves, after the tray B is conveyed to the position above the bearing plate 21, the first conveyor belt 4 stops moving, and at the moment, the tray B is suspended above the bearing plate 21. Then the lifting assembly 5 lowers the first conveyor belt 4 to the lowest point, and in the process, as the upper surface of the first conveyor belt 4 is lower than the upper surface of the bearing table 1, the tray B is separated from the first conveyor belt 4 and is erected on the bearing plate 21. The pallet B is held by the holding members on the loading plate 21 and then the laying work is performed. For the laying process, please refer to the above process, which is not described herein. After the laying is finished, the clamping assembly releases clamping of the tray B, the lifting assembly 5 controls the first conveyor belt 4 to ascend to the highest point, the tray B is jacked up and separated from the bearing plate 21, the first conveyor belt 4 continues to move, and the tray B which is finished to be laid is driven to move to the next processing procedure. The whole process of conveying the tray B is completed by using the same first conveyor belt 4, and meanwhile, the laying process is not influenced.
Further, in the present embodiment, the rail grooves 211 are multiple and arranged in parallel. The first conveyor belts 4 are arranged in parallel, and the end parts of the same sides of the first conveyor belts 4 are arranged on the same lifting assembly 5. Because the tray B is large in size, it can be transported smoothly in the transportation process using a plurality of conveyor belts. Meanwhile, the end parts of the same sides of the first conveyor belts 4 are arranged on the same lifting assembly 5, so that the synchronous movement of the first conveyor belts 4 during ascending and descending can be ensured.
Further, in this embodiment, the clamping assembly includes at least one set of electric cylinder group, each electric cylinder group includes two electric cylinders 23, two electric cylinders 23 in the same set are respectively disposed on two opposite sides of the bearing plate 21, and a clamping member is disposed on a cylinder rod of each electric cylinder 23. In this embodiment, the engaging member is a fixing block having a slot. When the tray B needs to be clamped, the electric cylinder 23 drives the clamping piece to be close to the edge of the tray B, and finally the edge of the tray B is clamped in the clamping groove, so that the tray B is clamped.
Preferably, at least two electric cylinders 23 are provided at each edge of the pallet B to ensure stable clamping. Meanwhile, because each edge of the tray B is correspondingly provided with the electric cylinder 23, the position of the tray B can be adjusted by matching the plurality of electric cylinders 23 together, and when the initial position of the tray B and the bearing plate 21 deviates, the tray B can be adjusted to the correct position and fixed by matching the plurality of electric cylinders 23.
Further, in the present embodiment, the driving assembly 22 includes a screw guide and a servo motor, and the servo motor drives the loading plate 21 to move along the first direction through the screw guide. The servo motor has the characteristics of high and stable control precision, and the movement precision of the tray B can be ensured to be the highest by controlling the movement of the bearing plate 21 through the servo motor and the screw guide rail.
Further, in the present embodiment, the laying mechanism includes a robot. The manipulator can use the existing multi-degree-of-freedom arm type manipulator, the common three-degree-of-freedom arm type manipulator can simulate the movement of a human hand, and the silicon wafer A can be grabbed and laid. The manipulator is provided with a camera assembly 6. The existing silicon wafer laying device respectively collects position data of a silicon wafer A and a tray B through two externally erected camera assemblies, and then calculates moving parameters. However, since the two groups of cameras are separated from each other, in order to correlate the data, the calculated data is large, the processing speed is too slow, and the production efficiency is affected. In this embodiment, directly set up camera module 6 on the manipulator, when the manipulator snatched silicon chip A and laid silicon chip A, carry out data acquisition to silicon chip A and tray B's position respectively, realize carrying out data acquisition to silicon chip A and tray B with the same group of camera module 6, make the calculated amount reduce, increase computational rate to improve production efficiency.
Further, in this embodiment, the arm type robot may be replaced with a linear module. The linear module comprises grabbing device and triaxial control cabinet, and the triaxial control cabinet has the linear orbit of XYZ three direction, realizes the removal to grabbing device in three-dimensional space through the control to three direction. The grabbing device is used for grabbing and laying the silicon wafer A.
Further, in the present embodiment, the silicon wafer laying apparatus further includes a second conveyor belt 7, and the second conveyor belt 7 is used for conveying the silicon wafer a to the laying mechanism. Through setting up second conveyer belt 7 and directly transporting silicon chip A to laying mechanism department, can improve the speed that snatchs silicon chip A of laying mechanism, improve work efficiency.
Meanwhile, in the embodiment, the first conveyor belt 4, the tray feeding mechanism 2 and the laying mechanism are all arranged on the same bearing table 1, and the bottoms of the first conveyor belt 4, the tray feeding mechanism 2 and the laying mechanism are on the same plane, so that the workload of the equipment during initial calibration is greatly reduced.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A silicon wafer laying apparatus, comprising:
a bearing table;
the tray feeding mechanism comprises a driving assembly, a clamping assembly and a bearing plate, wherein the bearing plate is arranged on the bearing table through the driving assembly, the driving assembly is used for driving the bearing plate to move along a first direction, and the clamping assembly is arranged on the bearing plate and used for clamping a tray on the bearing plate;
and the laying mechanism is arranged on the bearing platform and used for laying the silicon wafer on the tray on the bearing plate.
2. The silicon wafer laying apparatus as claimed in claim 1, further comprising a first conveyor belt provided on the carrier table for conveying a tray onto the carrier plate.
3. The silicon wafer laying apparatus according to claim 2, wherein a guide rail groove is formed in the upper surface of the carrier plate along the first direction, both ends of the first conveyor belt are disposed on the carrier table through a lifting assembly, the first conveyor belt is located in the guide rail groove, and the lifting assembly is configured to drive the first conveyor belt to ascend or descend.
4. The silicon slice laying apparatus as claimed in claim 3, wherein the rail grooves are arranged in a plurality and in parallel.
5. The silicon wafer laying apparatus as claimed in claim 4, wherein the first conveyors are arranged in a plurality of parallel, and the ends of the same sides of the plurality of first conveyors are arranged on the same lifting assembly.
6. The silicon wafer laying apparatus as claimed in claim 1, wherein the clamping assembly comprises at least one set of electric cylinders, each set of electric cylinders comprises two electric cylinders, the two electric cylinders in the same set are respectively disposed on two opposite sides of the carrying plate, and a clamping member is disposed on a cylinder rod of each electric cylinder.
7. The silicon wafer laying apparatus as set forth in claim 1, wherein the drive assembly comprises a screw guide and a servo motor for driving the carrying plate in a first direction by the screw guide.
8. The silicon wafer laying apparatus as claimed in claim 1, wherein said laying mechanism comprises a robot.
9. The silicon laying apparatus as claimed in claim 8, wherein a camera assembly is provided on the robot.
10. The die laying apparatus of claim 1, further comprising a second conveyor for transporting the die to said laying mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810786235.6A CN110729223A (en) | 2018-07-17 | 2018-07-17 | Silicon chip laying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810786235.6A CN110729223A (en) | 2018-07-17 | 2018-07-17 | Silicon chip laying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110729223A true CN110729223A (en) | 2020-01-24 |
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ID=69217550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810786235.6A Pending CN110729223A (en) | 2018-07-17 | 2018-07-17 | Silicon chip laying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110729223A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117174785A (en) * | 2023-11-03 | 2023-12-05 | 阳光中科（福建）能源股份有限公司 | Solar cell silicon chip lamination laying device |
-
2018
- 2018-07-17 CN CN201810786235.6A patent/CN110729223A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117174785A (en) * | 2023-11-03 | 2023-12-05 | 阳光中科（福建）能源股份有限公司 | Solar cell silicon chip lamination laying device |
| CN117174785B (en) * | 2023-11-03 | 2024-02-27 | 阳光中科（福建）能源股份有限公司 | Solar cell silicon chip lamination laying device |
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Effective date of registration: 20210107 Address after: 101149 102-lq307, 1-3 / F, building 26, No. 17, huanke Middle Road, Jinqiao Science and technology industrial base, Tongzhou Park, Zhongguancun Science and Technology Park, Tongzhou District, Beijing Applicant after: Deyun Chuangxin (Beijing) Technology Co.,Ltd. Address before: 100176 10th floor, building 2, yard 9, Ronghua South Road, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing Applicant before: Juntai innovation (Beijing) Technology Co.,Ltd. |