KR100902292B1 - Transfering apparatus of tray, Handler for testing semiconductor device using the transfering apparatus, Transfering method of the tray using the handler, and Manufacturing method of the semiconductor device using the the handler - Google Patents

Abstract

The present invention relates to a tray transfer apparatus for transferring a tray into which a semiconductor element is loaded / exported, a tray transfer method, a handler for testing a semiconductor element using the same, and a method for manufacturing a semiconductor element using the transfer apparatus.

To this end, the present invention includes a loading area and a loading area located below the loading area, and a loading unit in which a test tray equipped with a semiconductor device to be tested can be transferred from the loading area to the carrying area, the test A chamber unit for connecting a semiconductor device to be connected to a test apparatus, an exchange unit for supplying a test tray equipped with the semiconductor element to be tested to the chamber unit and a test tray equipped with the tested semiconductor element from the chamber unit; An unloading unit including a region and an loading region located below the unloading region, wherein the test tray on which the tested semiconductor device is mounted can be transferred from the loading region to the unloading region, and the semiconductor element to be tested Simultaneously transferring the mounted test tray from the discharge area to the exchange part The present invention provides a handler for testing semiconductor devices including a tray transfer device for transferring a test tray on which the tested semiconductor device is mounted from the exchange unit to the loading area.

Loading part, unloading part, exchange part, chamber part, tray feeder

Description

Tray transfer apparatus, handler for semiconductor device test using the same, tray transfer method of handler for semiconductor device test, and semiconductor device manufacturing method using handler for semiconductor device test {Transfering apparatus of tray, Handler for testing semiconductor device using the transfering apparatus, Transfering method of the tray using the handler, and Manufacturing method of the semiconductor device using the the handler}

The present invention relates to a transfer device and a handler for testing a semiconductor device using the same, and more particularly, a tray transfer device, a tray transfer method, and a semiconductor using the same, to transfer a tray into which the semiconductor device is loaded / exported in order to test the semiconductor device. A device test handler and a method for manufacturing a semiconductor device using the transfer device.

In general, semiconductor devices, for example, memory or non-memory semiconductor devices, and module ICs, which are constituted on a single circuit in a circuit, are produced after testing various electrical, thermal, and functional performances by a test apparatus. do.

Producers ensure product reliability by only shipping products classified as good as a result of the test of the test apparatus.

The equipment used in the process of testing the semiconductor device is a handler for testing a semiconductor device. The handler for testing a semiconductor device largely performs a loading process, an unloading process, and a test process.

Here, the semiconductor devices are inspected in the state accommodated in the test tray, and the semiconductor devices whose inspection is completed are carried out to the outside.

The loading process is a process of transporting and mounting the semiconductor devices to be tested from the customer tray to the test tray. Transfer of such semiconductor devices is performed through a plurality of pickers.

The unloading process is a process of separating the tested semiconductor devices from the test tray and classifying the semiconductor devices into customer trays according to grades according to test results. Transfer of such semiconductor devices is performed through a plurality of pickers as in the loading process.

The test process is a process in which the semiconductor devices accommodated in the test trays are connected to a test device, and the semiconductor devices are tested by the test device. The test process tests whether the semiconductor device operates normally even under extreme conditions of room temperature, high temperature or low temperature.

The above-mentioned conventional semiconductor device test handler has the following problems.

First, in order to transfer the test tray, the tray feeder provided in the conventional semiconductor device test handler has a time limit in transferring the test tray since one test tray is transferred in one stroke.

Second, when an error occurs in any one of the loading process and the unloading process, another process capable of normal operation is also stopped, the operation efficiency is reduced.

The problem to be solved in the present invention is to reduce the time required for the movement of the test tray transfer device, a transfer method, a semiconductor device test handler using the transfer device and the handler for the semiconductor device test to increase the output per unit time It is to provide a method for manufacturing a semiconductor device used.

Another problem to be solved by the present invention is to provide a handler for a semiconductor device test and a method for manufacturing a semiconductor device using the same that can be continuously operated even if an error occurs in any one of the loading process and the unloading process. It is.

In order to solve the above problems, the present invention includes a loading area and an export area located below the loading area, wherein a test tray equipped with a semiconductor device to be tested may be transferred from the loading area to the export area. A loading unit, a chamber unit for connecting the semiconductor element to be tested to a test apparatus, a test tray equipped with the semiconductor element to be tested is supplied to the chamber unit, and a test tray equipped with the tested semiconductor element is supplied from the chamber unit. An unloading part including an exchange part, an unloading area and a loading area located below the unloading area, wherein the test tray on which the tested semiconductor device is mounted can be transferred from the loading area to the unloading area, and Replace the test tray in which the semiconductor element to be tested is mounted in the export area. And transfer Sikkim simultaneously provides a tray transfer device handler for testing the semiconductor device including a for transferring to said import region in the switching section the test tray on which the test is completed the semiconductor device mounting.

The tray conveying apparatus includes a first head portion for transferring a test tray on which a semiconductor element to be tested is mounted, a second head portion for transferring a test tray on which a tested semiconductor element is mounted, and the first head portion and a first head portion. 2 may include a driving unit for moving the head.

The first head part may include a locking member accommodating part provided in a test tray on which a semiconductor device to be tested is mounted, and a locking member coupleable at an upper portion thereof.

The second head part may include a rolling member contactable from a side of a test tray on which the tested semiconductor device is mounted.

The exchange unit may include a rotator for rotating the test tray downward while the test tray on which the semiconductor element to be tested is mounted is transferred from the export area to the exchange unit.

The unloading unit may include an unloading unit transfer device for lifting the test tray upward while the test tray on which the tested semiconductor device is mounted is transferred from the exchange unit to the loading area.

When the test tray on which the tested semiconductor device is mounted is moved upward, the rolling member may be rotated about an axis of rotation of the rolling member.

Further, according to another aspect of the present invention, the present invention includes a head unit, a guide rail for guiding the movement of the head unit, and a drive unit for moving the head unit along the guide rail, both sides of the head unit Provided is a tray conveying apparatus for allowing a first test tray and a second test tray to be moved simultaneously.

The head unit may include a first head portion for transferring the first test tray, a second head portion for transferring the second test tray, one side of which is coupled to the first head portion, and the other side of the second head. It may include a head frame coupled to the portion.

The first head part may include a first moving member, a first elevating device for moving the first moving member up and down, and a engaging member engageable with the engaging member accommodating part provided in the first test tray.

The second head portion may include a second moving member, a second lifting device for moving the second moving member up and down, and a rolling member contactable with a side surface of the second test tray.

The locking member may move the first test tray along a length direction of the guide rail in a state where the locking member is inserted into the locking member accommodation portion.

The rolling member may move the second test tray along the longitudinal direction of the guide rail while pushing the side of the second test tray.

In addition, the present invention is a downward movement step of moving the head unit in the direction of the first test tray and the second test tray in the upper portion of the first test tray and the second test tray which is located at a predetermined interval, and the head unit of Provided is a tray transfer method of a handler for a semiconductor test including a horizontal movement step of simultaneously horizontally moving the first test tray and the second test tray disposed on both sides.

The tray transfer method of the handler for testing a semiconductor device may further include a rotation movement step of rotating the first test tray in a downward direction at the same time as the horizontal movement step is completed.

The tray transfer method of the handler for testing a semiconductor device may further include an upward movement step of transferring the second test tray upwards at the same time as the horizontal movement step is completed.

In addition, the present invention is a loading step of bringing the semiconductor device to be tested into the loading area, a lowering step of moving the test tray equipped with the semiconductor device to be tested from the loading area to the export area located below the loading area, Moving the test tray located in the export area to the exchange unit to test the semiconductor device, and moving the test tray on which the tested semiconductor device is mounted from the exchange unit to the import area, and the tested semiconductor device Provides a method for manufacturing a semiconductor device using a handler for testing a semiconductor device comprising a lifting movement step of moving a test tray equipped with a moving from the loading area to the unloading area located above the loading area.

Effects of the above-described tray transfer apparatus and a handler for testing a semiconductor device using the same are as follows.

First, the tray conveying apparatus according to the present invention has an advantage of increasing the yield per unit time by simultaneously moving two test trays, that is, a first test tray and a second test tray at a time.

In particular, the rolling member provided in the second head portion for moving the second test tray can reduce the time required for transporting the tray by enabling vertical movement immediately after the second test tray is horizontally moved. There is this.

Second, the semiconductor device test handler according to the present invention separates the work line to which the test tray is moved up and down so that the loading process and the unloading process are performed separately, even if an error occurs in any one of the loading process and the unloading process. Processes that are operating normally have the advantage of being able to run continuously.

Third, by simplifying the loading process and the unloading process, it is possible to reduce the errors occurring during the loading and unloading process, thereby improving the efficiency and stability of the operation.

Hereinafter, with reference to the accompanying drawings will be described specific details for the practice of the invention.

1 is a view schematically showing a configuration of an embodiment of a handler for testing a semiconductor device according to the present invention, and FIG. 2 is a view schematically showing a process of transferring a test tray.

1 and 2, the configuration of an embodiment of a handler for testing a semiconductor device according to the present invention will be described in detail.

The handler 1 for testing a semiconductor device according to the present embodiment includes a stacker 10, a loading unit 30, an exchange unit 40, an unloading unit 50, a chamber unit 3, a loading picker and an unloading unit. And a picker unit (not shown) including a picker.

The stacker 10 includes a loading stacker 11 for carrying in a semiconductor device from the outside and an unloading stacker 13 for carrying out the semiconductor device to the outside.

The loading stacker 11 may accommodate a plurality of customer trays in which semiconductor devices to be tested are mounted. The unloading stacker 13 may store a plurality of customer trays in which the tested semiconductor devices are classified and mounted according to grades.

The loading unit 30 includes a loading region 31 and a carrying region 33 positioned below the loading region 31.

The loading region 31 is a place where a loading process is performed in which a semiconductor device to be tested is mounted on an empty test tray. The loading process may be performed by a loading picker (not shown) that is movable between the loading stacker 20 and the loading region 31.

In addition, the loading area 31 is also a place where the empty test tray is supplied from the unloading area 53 of the unloading part 50.

The export area 33 is a place where the test tray is located before the test tray on which the semiconductor device to be tested is mounted is transferred to the exchange unit 40. As a result, when the loading process is completed, the test tray on which the semiconductor device to be tested is mounted is transferred from the loading region 31 to the carrying region 33 by a loading unit transfer device (not shown).

In addition, the test handler according to the present invention may include a loading buffer 20 provided between the loading stacker 20 and the loading region 31.

The loading buffer 20 temporarily mounts the semiconductor device transferred from the loading stacker 20 when the semiconductor device cannot be directly transferred from the loading stacker 20 to the loading region 31.

The exchanger 40 supplies a test tray on which the semiconductor device to be tested is mounted to the chamber 3, and receives a test tray on which the tested semiconductor device is mounted from the chamber 3.

The exchanger 40 includes a rotator (not shown) for rotating the test tray from a horizontal state to a vertical state or from a vertical state to a horizontal state.

The rotator (not shown) rotates a test tray on which a semiconductor device to be tested is mounted from a horizontal state to a vertical state, and rotates a test tray on which the tested semiconductor device is mounted from a vertical state to a horizontal state.

In particular, according to the present embodiment, a process of transferring a test tray on which a semiconductor element to be tested is mounted from the export area 33 to the first exchange area 41 of the exchange part, and exchanging a test tray on which the tested semiconductor element is mounted The process of transferring from the negative first exchange area 41 to the carry-in area 51 is simultaneously performed by one tray feeder. A process of transferring the test tray by the tray transfer device will be described later with reference to FIGS. 4A to 4D.

The unloading part 50 includes an unloading area 53 and a loading area 51 positioned below the unloading area 53.

The unloading region 53 is a place where an unloading process is performed in which the tested semiconductor device is classified according to a test result. Of course, the unloading buffer 80 may be used during the unloading process.

The loading area 51 is a place where the test tray on which the tested semiconductor device is mounted is supplied from the first exchange area 41 of the exchanger 40.

When the test tray on which the tested semiconductor device is mounted is transferred from the first exchange area 41 to the carry-in area 51, the unloading part transfer device (not shown) provided in the unloading part 50 is the test tray. Is transferred from the loading area 51 to the unloading area 53.

When the test tray on which the tested semiconductor device is mounted is transferred from the loading area 51 to the unloading area 53, an unloading process is performed.

When the unloading process is completed and the test tray becomes empty, the empty test tray is transferred from the unloading area 53 to the loading area 31 via the standby position 60.

As a result, the test tray on which the semiconductor element to be tested is mounted is transferred from the loading area 31 to the carrying out area 33 (S1), and transferred from the carrying out area 33 to the exchange part 40 ( S2).

Then, the exchange unit 40 supplies the test tray on which the semiconductor device to be tested is mounted to the chamber unit 3, and receives the test tray on which the tested semiconductor device is mounted from the chamber unit 3. At this time, the rotator provided in the exchanger 40 rotates the test tray on which the semiconductor device to be tested is mounted from the horizontal state to the vertical state (R1), and the horizontal state of the test tray on which the tested semiconductor device is mounted in the vertical state. Rotate to (R2).

After that, the test tray on which the tested semiconductor device is mounted is moved from the exchange part to the loading area 51 (S3), and then moved from the loading area 51 to the unloading area 53 (S4).

After all of the semiconductor devices are unloaded in the unloading region 53, the empty test tray passes through the standby position 60 and circulates back to the loading region 31 (S5 and S6).

Here, the carrying out area 33, the first exchange area 41 of the exchange part, and the loading area 51 form a lower work line of the handler, and the unloading area 53, the waiting position 60, and the loading area. 31 forms an upper work line of the handler body.

For example, the carrying out area 33 and the carrying area 51 may be located on the same lower horizontal plane, and the unloading area 53 and the loading area 31 may be located on the same upper horizontal plane.

As a result, the work line to which the test tray is moved is divided up and down, and the loading process and the unloading process are performed separately, so that the process that is operating normally even if an error occurs in any one of the loading process and the unloading process is continued. There is an advantage that can work.

Referring to Figure 3, an embodiment of a tray feeder according to the present invention will be described.

The tray conveying apparatus 100 includes a head unit, a guide rail 140 for guiding the movement of the head unit, and a driving unit for moving the head unit in the longitudinal direction of the guide rail 140.

The head unit includes a first head portion 110 for transferring a first test tray (T1 of FIG. 4A), for example, a test tray on which a semiconductor element to be tested is mounted, and a second test tray (T2 of FIG. 4A). For example, the second head 120 may be configured to transfer the test tray on which the tested semiconductor device is mounted.

In addition, one side of the head unit is coupled to the first head portion 110 so that the first head portion 110 and the second head portion 120 are moved in the longitudinal direction of the guide rail 140. The other side may include a head frame 130 coupled to the second head part 120.

In addition, the first head part 110 includes a first moving member 115 and a first elevating device 113 for moving the first moving member 115 up and down. A locking member 111 that is insertable into the locking member accommodating part 210 provided in the first test tray T1 is provided below the first moving member 115.

The locking member accommodating part 210 may have a shape of a hole or a groove formed in the first test tray T1, for example, at a side edge of the first test tray. The locking member 111 is inserted into or separated from the upper portion of the locking member accommodating part (see 210 of FIG. 4A) together with the movement of the first moving member 115.

The second head portion 120 includes a second moving member 125, a second lifting device 123 for moving the second moving member 125 up and down, and one side of the second moving member. It comprises a rolling member 121.

Here, the head unit is moved in the longitudinal direction of the guide rail by the drive unit. In addition, the first moving member 115 and the second moving member 125 are perpendicular to the longitudinal direction of the guide rail 140 by the first elevating device 113 and the second elevating device 123. Is moved up and down.

Of course, the first moving member 115 and the second moving member 125 may be moved simultaneously by one lifting device.

On the other hand, when the first moving member 115 is lowered by the first elevating device, the locking member 111 is inserted into the locking member receiving portion 210. When the second moving member 125 descends, the rolling member 121 is positioned at a position corresponding to the wall surface of the second test tray T2.

Of course, the present invention is not limited to the above-described embodiment, the locking member is formed in the test tray, the locking member receiving portion may be provided in the first head portion. In addition, the rolling member may be provided in the form of a freely rotatable roller or bearing.

Next, the head unit is moved in the longitudinal direction of the guide rail 140 by a drive unit. Then, the first test tray and the second test tray disposed on both sides of the head unit are moved at the same time.

The drive unit includes a rotatable motor 160 and a power transmission device 150 for converting the rotational force of the motor into a linear motion of the head unit.

The power transmission device includes a first pulley 151 installed at one end of the guide rail 140, a second pulley 153 installed at the other end of the guide rail 140, and the first pulley 151. It may include a power transmission member 155 for transmitting the rotational force of the second pulley 153.

The first pulley 151 is axially coupled directly to the motor 160 and may be installed on one side of the guide rail 140. The second pulley 153 corresponds to the first pulley 151 and rotates by the rotation of the first pulley 151.

The power transmission member 155 is moved by the rotation of the first pulley 151 and the second pulley 153 to move the head unit from one end to the other end or from the other end to the one end. Can be.

The power transmission member 155 is coupled to a head unit moving part (not shown) provided in the head unit. Specifically, a belt, for example, a timing belt may be used as the power transmission member 155. The belt moves the head unit while moving between the first pulley and the second pulley in a state coupled with the head unit moving part.

The present invention is not limited to the embodiment described above, the chain can be used as the power transmission member, when the chain is used, the head unit moving portion can be used as a gear that can be engaged with the chain. There will be.

Of course, the motor and the head unit may be mechanically connected through a gear device. For example, the power transmission device may include a screw installed along a direction to move the head unit. The head unit may be coupled to the screw.

When the motor rotates, the screw axially coupled with the motor rotates, and when the screw rotates, the head unit engages with the screw and linearly moves.

In addition, the power transmission device may have any configuration as long as it can transmit the rotational force of the motor in the linear motion of the head unit.

2, 3, and 4A to 4D, a test tray on which a first test tray, for example, a semiconductor element to be tested, and a second test tray, for example, a tested semiconductor, are mounted using a tray conveying apparatus. The process of simultaneously moving the test tray in which the device is mounted will be described.

4A illustrates a state in which the first test tray T1 and the second test tray T2 are positioned below the head unit. As shown in FIG. 4A, when the first test tray T1 is located in the carrying out area 33 and the second test tray is located in the first exchanging area 41 of the exchange part, the first head of the first head part is provided. The moving member 115 and the second moving member 125 of the second head portion are moved downward by the first elevating device 113 and the second elevating device 123, respectively. That is, the head unit is moved in the direction of the first test tray and the second test tray from the upper portion of the first test tray and the second test tray.

Then, the locking member 111 of the first head portion is inserted into the locking member accommodating portion 210 of the first test tray T1, and the rolling member 121 of the second head portion 120 is formed of the first head. 2 is moved to a position corresponding to the side of the test tray T2 (see FIG. 4B).

Thereafter, the head unit simultaneously horizontally moves the first test tray T1 and the second test tray T2 disposed on both sides of the head unit.

In detail, the driving unit moves the head unit along the guide rail 140. Then, the locking member 111 is moved to the exchange part 40 by dragging the first test tray T1 placed in the carrying out area 33, and at the same time, the rolling member 121 is placed on the exchange part. The second test tray T2 was pushed to move to the loading area 51 (see FIG. 4C).

That is, the locking member 111 provided at the lower end of the first head unit 110 may be connected to the first test tray while being inserted into the locking member accommodating part 210 provided in the first test tray T1. To move, the rolling member provided on the second head portion can be moved while pushing the side of the second test tray.

In addition, the second test tray T2 moved to the loading area 51 is transferred to the unloading area 53 by an unloading part transfer device (not shown) (see FIG. 4D). At this time, the head unit is located between the exchange part 40 and the carry-in area 51, and maintains the stop state.

That is, the second test tray is transferred to the carry-in area 51 and raised to the unloading area 53 by the unloading unit transport device. At this time, when the second test tray is raised in contact with the rolling member 121, the rolling member 121 is rotated based on the central axis.

Rotating the rolling member 121 has an advantage of being able to prevent abrasion due to friction when the second test tray is raised.

Further, when the second test tray is raised to the unloading area 53 because the head unit moves the second test tray to the loading area 51 from the first exchange area 41 of the exchange part. The movement paths of the head unit and the second test tray do not overlap.

If the second test tray is transferred to the carrying area by a structure such as a locking member and a locking groove, the second test tray is moved in the direction in which the second test tray rises before the second test tray is raised to the unloading area. Since the process of leaving the head unit must be included essentially, there is a problem that the work time is lost.

In addition, the first test tray is transferred from the carry out area 33 to the first exchange area 41 of the exchange part and rotated to the second exchange area 43 by a rotator.

The first test tray is horizontally moved from the carry-out area 33 to the first exchange area 41 and rotated downwardly, that is, in the second exchange area 43. Here, the first test tray T1 is rotated downward in the state in which the locking member 111 is inserted into the locking member accommodating part 210 (see FIG. 4D).

As a result, the process of transferring the first test tray T1 from the carry-out area 33 to the first exchange area 41 is completed and at the same time, the first test tray T1 is removed from the first exchange area 41. The process of rotating to the second exchange area 43 is performed.

In addition, the process of moving the second test tray T2 from the first exchange area 41 of the exchange part to the carry-in area 51 is completed, and at the same time, the second test tray T2 is unloaded from the carry-in area 51. The process of transferring to the area 53 is performed continuously. Therefore, the movement of the test tray occurs continuously, thereby reducing the time required for the transfer process of the test tray.

In addition, the process of transferring the first test tray from the carrying out area 33 to the first exchange area 41, and the second test tray from the first exchange area 41 to the loading area 51 The transfer process is performed simultaneously to increase the number of semiconductor devices transferred per unit time.

Thereafter, after the second test tray T2 is raised, the first moving member 115 and the second moving member 125 are moved by the first elevating device 113 and the second elevating device 123. Is raised. In the state where the first and second moving members 115 and 125 are raised, the entire head unit is moved between its original position, that is, between the carry-out area 33 and the exchange part 40.

The present invention is not limited to the above-described embodiments, and those skilled in the art can make modifications without departing from the spirit of the present invention, and such modifications are within the scope of the present invention.

1 is a block diagram schematically showing the configuration of a handler for testing semiconductor devices in accordance with the present invention.

FIG. 2 is a view schematically illustrating a process in which a test tray is moved in area A of FIG. 1.

Figure 3 is a perspective view showing an embodiment of a tray feeder provided in the handler for testing semiconductor devices according to the present invention.

Figure 4a is a view showing a state in which the tray feeder of Figure 3 located on the upper part of the test tray.

4B is a view showing a state immediately before the tray feeder of FIG. 3 transfers a test tray.

Figure 4c is a view showing a state immediately after the test tray is transferred using the tray feeder of FIG.

4D is a view illustrating a state in which a test tray on which a semiconductor device after testing is completed is lifted up;

<Code Description of Main Parts of Drawing>

10: stacker 20: loading buffer

30: loading unit 31: loading area

33: export area 40: exchange unit

41: first exchanger 43: second exchanger

50: unloading unit 51: loading area

53: unloading area 60: standby position

70: standby buffer 80: unloading buffer

100: tray feeder 110: first head portion

120: second head portion 130: head frame

140: guide rail

Claims (17)

A loading unit including a loading area and an export area positioned below the loading area, the test tray having a semiconductor device to be tested loaded from the loading area to the export area; A chamber unit for connecting the semiconductor element to be tested to a test apparatus; An exchange unit configured to supply a test tray equipped with the semiconductor device to be tested to the chamber unit and receive a test tray equipped with the tested semiconductor device from the chamber unit; An unloading unit including an unloading area and an loading area located below the unloading area, wherein the test tray on which the tested semiconductor device is mounted may be transferred from the loading area to the unloading area; And, And a tray transfer device for transferring the test tray on which the semiconductor element to be tested is mounted from the carrying out area to the exchange unit and simultaneously transferring the test tray on which the tested semiconductor element is mounted from the exchange unit to the loading area. Handler for device testing. The method of claim 1, The tray conveying apparatus includes a first head portion for transferring a test tray on which a semiconductor element to be tested is mounted, a second head portion for transferring a test tray on which a tested semiconductor element is mounted, and the first head portion and a first head portion. 2 A handler for testing semiconductor devices comprising a drive for moving the head. The method of claim 2, And the first head part comprises a catching member engageable with a catching member accommodating portion provided in the test tray at an upper portion of a test tray on which the semiconductor device to be tested is mounted. The method of claim 2, And the second head part comprises a rolling member contactable at a side of a test tray on which the tested semiconductor device is mounted. The method according to any one of claims 1 to 4, And the exchange unit includes a rotator for rotating the test tray downward while a test tray equipped with a semiconductor device to be tested is transferred from the export area to the exchange unit. The method according to any one of claims 1 to 4, And the unloading unit includes an unloading unit transfer device for lifting the test tray upwards while the test tray on which the tested semiconductor device is mounted is transferred from the exchange unit to the loading area. The method of claim 6, And the rolling member is rotated about an axis of rotation of the rolling member when the test tray on which the tested semiconductor device is mounted is moved upward. The method of claim 1, The tray feeder includes a head unit; A guide rail for guiding the movement of the head unit; And, And a driving unit for moving the head unit along the guide rail, wherein the first test tray and the second test tray disposed on both sides of the head unit move simultaneously. The method of claim 8, The head unit may include a first head portion for transferring the first test tray, a second head portion for transferring the second test tray, one side of which is coupled to the first head portion, and the other side of the second head. Tray feeder including a head frame coupled to the portion. The method of claim 9, The first head portion includes a tray conveying apparatus including a first moving member, a first lifting device for moving the first moving member up and down, and a locking member engageable with a locking member accommodation portion provided in the first test tray. . The method of claim 9, And the second head portion includes a second moving member, a second lifting device for moving the second moving member up and down, and a rolling member in contact with a side surface of the second test tray. The method of claim 10, And the locking member moves the first test tray along a length direction of the guide rail in a state where the locking member is inserted into the locking member accommodating part. The method of claim 11, The rolling member is a tray conveying apparatus, characterized in that for moving the second test tray along the longitudinal direction of the guide rail while pushing the side of the second test tray. To move the test tray on which the semiconductor element to be tested is mounted from the loading area to the export area located below the loading area, A lowering movement step of moving the head unit in the direction of the first test tray and the second test tray from an upper portion of the first test tray and the second test tray positioned at regular intervals; And, And a horizontal movement step of simultaneously horizontally moving the first test tray and the second test tray disposed on both sides of the head unit. The method of claim 14, And a rotation movement step of rotating the first test tray in a downward direction at the same time as the horizontal movement step is completed. The method of claim 14, And a lifting movement step of transferring the second test tray upwards at the same time as the horizontal movement step is completed. Loading a semiconductor device to be tested into a loading region; A descending movement step of moving a test tray on which the semiconductor device to be tested is mounted, from the loading area to an export area located below the loading area; Moving a test tray positioned in the export area to an exchange unit to test the semiconductor device, and simultaneously moving a test tray on which the tested semiconductor device is mounted from the exchange unit to an import area; And, And a rising movement step of moving the test tray on which the tested semiconductor device is mounted, from the loading area to the unloading area located above the loading area.

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