TWI680526B - Wafer conversion device - Google Patents

Abstract

A wafer conversion device is suitable for placing a first wafer carrier and a second wafer carrier. The first wafer carrier includes a plurality of first receiving grooves, and each first receiving groove is suitable for receiving a wafer. The second wafer carrier includes a plurality of second accommodating slots, and each of the second accommodating slots is adapted to receive a wafer. The wafer conversion device includes a base, a guide unit, and a pushing mechanism. The guide unit includes a first guide frame having a plurality of first guide grooves arranged at vertical intervals. The pushing mechanism can be controlled to push the wafers in the first receiving slots aligned with the second receiving slots, so that the wafers pass through the guide from the first receiving slots. The first guide frame of the guide unit is finally moved into the second receiving grooves through the first guide grooves.

Description

Wafer conversion device

The present invention relates to a wafer conversion device, and particularly to a wafer conversion device capable of smoothly transferring wafers between two wafer carriers.

In the semiconductor manufacturing process, the wafers need to be processed by a variety of machines, and the wafers are moved between different process machines through the carrier device to ensure that the wafers will not be damaged during the movement. In order to match the machine and process environment required for different processes, wafers need to be stored in different types of carrier devices. When wafers are to be changed between different carrier devices, wafer conversion devices are used to assist the wafers in two different Positions are interchanged between the carrier devices to ensure wafer transfer efficiency and avoid wafer damage. The use method of the wafer conversion device is that the operator first places the carrier device to be transferred out of the wafer and the carrier device to receive the wafer in a designated position on the wafer conversion device in order. After confirming that the positions of the two carrier devices are correct, Then, the transfer mechanism of the wafer conversion device is used to transfer the wafers in the carrier device to be transferred out to the carrier device to receive the wafers. After confirming that the transfer operation is completed, the operator sequentially removes the two carrier devices .

However, when the conventional wafer conversion device performs wafer transfer, the wafer may be warped due to thermal stress after the wafer is subjected to a high-temperature process, resulting in the wafer not being smoothly transferred from the transfer during the wafer conversion process. The accommodating groove of the carrier device out of the wafer enters the accommodating groove of the carrier device to receive the wafer, and collides with the groove wall of the carrier device receiving the wafer, and the wafer breaks, which affects the process yield. In addition, the wafer transfer process is not smooth, which will also affect production efficiency.

Therefore, one object of the present invention is to provide a wafer conversion device that can smoothly transfer wafers between two wafer carriers and prevent wafer cracking.

The wafer conversion device of the present invention is suitable for placing a first wafer carrier and a second wafer carrier. The first wafer carrier includes a plurality of first receiving grooves arranged in a vertical interval, and a first communication container connected to the first containers. A first inlet on one side of the receiving groove and a first outlet communicating with the other side of the first receiving grooves. Each first receiving groove is suitable for receiving a wafer, and the second wafer carrier It includes a plurality of second accommodating grooves arranged at a vertical interval and a second inlet that communicates with one side of the second accommodating grooves and faces the first outlet. Each second accommodating groove is suitable for accommodating a wafer. The wafer conversion device includes a base; a guide unit includes a first guide frame disposed on the base, the first guide frame includes a plurality of vertically spaced arrays and is located on the first wafer carrier; A first guide groove between the second wafer carrier, a guide entrance communicating with one side of the first guide grooves and facing the first entrance, and another passage connecting the first guide grooves A guide exit on one side and facing the second inlet, each first guide groove is adapted to allow a wafer to pass through, and each first The guide groove has an entrance section adjacent to the first wafer carrier and vertically aligning one of the first receiving grooves, and an entrance section communicating with the entrance section and adjacent to the second wafer carrier and vertically aligning the second containers. Set the exit section of one of the slots, the vertical height of the entrance sections is greater than the vertical height of the exit sections; and a pushing mechanism is movably disposed on the base, and the pushing mechanism can be controlled to pass through the first section. The first entrance of a wafer carrier pushes the wafers in the first receiving slots aligned with the second receiving slots, so that the wafers pass through the first receiving slots. The first exit enters the guide entrance of the first guide frame of the guide unit, passes through the first guide grooves and exits from the guide exit, and finally passes through the second of the second wafer carrier. The entrance moves into the second accommodation slots.

In some embodiments, the first guide frame includes two side walls spaced apart and located between the first wafer carrier and the second wafer carrier, each side wall has an inner wall surface, and the inner wall surfaces Facing each other, the inner wall surfaces are formed with the first guide grooves, and the side walls define the guide inlet and the guide outlet.

In some embodiments, the first guide frame further includes a handle, and two ends of the handle are respectively connected to the side walls.

In some implementation forms, the number of the first receiving grooves is different from the number of the second receiving grooves. The wafer conversion device further includes a height adjustment mechanism disposed on the base. The height adjustment mechanism Suitable for carrying the first wafer carrier and adjusting the first wafer carrier from a first height position to a second height position higher than the first height position, when the first wafer carrier is in the At the first height position, the positions of all the receiving grooves of one of the first wafer carrier and the second wafer carrier and a part of the receiving grooves of the other wafer are aligned with each other. The positions of the first guide grooves, the first receiving grooves, and the second receiving grooves are aligned with each other. When the first wafer carrier is at the second height position, the first wafer carrier and the The positions of all the accommodating grooves of one of the second wafer carriers and the other accommodating grooves of the other are aligned with each other, and the first guide grooves and the first accommodating grooves of the first guide frame And the positions of the second receiving slots are aligned with each other.

In some embodiments, the guide unit further includes a second guide frame disposed on the base, and the second guide frame includes a plurality of vertically spaced and spaced apart from the second receiving grooves and the A second guide slot that is aligned with the exit sections of the first guide slot.

In some embodiments, the height adjustment mechanism includes a first carrier plate, a second carrier plate, and a first base plate connected to the side walls for the first wafer carrier to be disposed. The height of the first carrier plate is less than The height of the second carrier plate, one of the first carrier plate and the second carrier plate is disposed on the base and carries the first base plate, and the first carrier plate can carry the first wafer carrier so that the first A wafer carrier is located at the first height position, and the second carrier plate can carry the first wafer carrier so that the first wafer carrier is located at the second height position.

In some embodiments, the first guide frame further includes at least one stopper disposed on the sidewalls, and the stopper is suitable for positioning the first wafer carrier or the second wafer carrier.

In some embodiments, the height adjustment mechanism includes a first bottom plate and a second bottom plate. The height of the first bottom plate is less than the height of the second bottom plate. One of the first bottom plate and the second bottom plate is disposed on The base is connected to the side walls, the first base plate can carry the first wafer carrier so that the first wafer carrier is positioned at the first height position, and the second base plate can carry the first wafer carrier so that the The first wafer carrier is located at the second height position, whereby the first wafer carrier can be adjusted and changed between the first height position and the second height position.

In some embodiments, the guide unit further includes a second guide frame disposed on the base. The second guide frame includes a plurality of vertically spaced and spaced apart from the first receiving slots and the A second guide slot that is aligned with the entry sections of the first guide slot.

In some embodiments, the height adjustment mechanism includes a first bearing plate and a second bearing plate. The height of the first bearing plate is smaller than the height of the second bearing plate. The first bearing plate and the second bearing plate. One of the plates is disposed on the base and carries the first wafer carrier. The first carrier plate can carry the first wafer carrier such that the first wafer carrier is at the first height position, and the second carrier The board can carry the first wafer carrier so that the first wafer carrier is positioned at the second height position.

In some embodiments, the entrance section of each first guide slot has a first end facing the first wafer carrier and a second end communicating with the exit section, and the vertical height of the entrance section is from the first One end is tapered to the second end.

In some embodiments, the vertical height of the first end of the inlet section of each first guide slot is greater than the vertical height of each first receiving slot.

In some embodiments, the vertical height of the exit section of each first guide groove is not greater than the vertical height of each second guide groove.

In some embodiments, the length of the inlet section of each first guide groove is not less than the length of the outlet section.

In some embodiments, the length of the exit section of each first guide groove is 15% -20% of the diameter of each wafer.

In some implementation forms, each exit section has a first section connecting the inlet section and a second section connecting the first section and the guide outlet, and the vertical height of the second section is from an end remote from the first section. The tapered portion is tapered to an end adjacent to the first portion, and the second portion has an included angle located at an end adjacent to the first portion, and the included angle is between 10-15 degrees.

In some embodiments, the entrance section of each first guide groove has an included angle at the second end, and the included angle is between 10-15 degrees.

In some implementation forms, the inner wall surfaces are recessed with the first guide grooves, and the depth of each first guide groove depression is 10% -15% of the diameter of each wafer.

The present invention has at least the following effects: by the vertical height of the inlet sections of the first guide frame of the guide unit being greater than the vertical height of the outlet sections and the first receiving slots, the wafers from In the process of converting the first wafer carrier to the second wafer carrier, the wafers are guided from the first receiving tank into the inlet section and guided to the exit section, and finally enter the The second receiving slot. Because the vertical height of the entrance sections is greater than the vertical height of the first receiving grooves, the wafers can smoothly enter the entrance sections without warping even if warped, so that the wafers can be smoothed. The ground is transferred from the first wafer carrier to the second wafer carrier to prevent the wafers from cracking during the transfer process, and effectively improve the process yield and production efficiency.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

Referring to FIGS. 1, 2 and 5, a first embodiment of a wafer conversion device according to the present invention is suitable for placing a first wafer carrier 1 and a second wafer carrier 2. The first wafer carrier 1 includes a plurality of first receiving grooves 11 arranged at a vertical interval, a first inlet 12 communicating with one side of the first receiving grooves 11, and a first receiving groove communicating with the first receiving grooves 11. The first outlet 13 on the other side of 11, each of the first accommodating grooves 11 is suitable for accommodating a wafer W. The second wafer carrier 2 includes a plurality of second accommodating grooves 21 arranged vertically and a second inlet 22 communicating with one side of the second accommodating grooves 21 and facing the first outlet 13. The two accommodating grooves 21 are adapted to accommodate one wafer W. The wafer conversion device includes a base 3, a positioning unit 4, a guiding unit 5, a height adjusting mechanism 6, and a pushing mechanism 7. In this embodiment, the first wafer carrier 1 is a Teflon wafer box, the second wafer carrier 2 is a quartz wafer boat, the first wafer carrier 1 and the second wafer carrier 2 It is set in such a way that the first outlet 13 and the second inlet 22 face each other. The number of the second accommodation slots 21 is an even number, and the number of the first accommodation slots 11 is smaller than the number of the second accommodation slots. The number of the first accommodating slots 11 is one half of the number of the second accommodating slots 21. Among them, the number of the first receiving slots 11 is 25 (for example, the two slots on both sides of the first wafer carrier 1 are combined into one first receiving slot 11), and the second receiving slots 11 The number 21 is based on 50 as an example (the two slots located on the two sides of the second wafer carrier 2 are combined into one second receiving slot 21), and the first receiving slots 11 are vertically spaced apart from each other. Is twice the vertical distance between the second accommodation slots 21, but the first accommodation slots 11 and the second accommodation slots 21 are not limited to this number and the separation distance. The types of a wafer carrier 1 and the second wafer carrier 2 are not limited to the foregoing.

The base 3 is a rectangular plate base. The positioning unit 4 includes two limiting walls 41 and a blocking wall 42. The blocking wall 42 is disposed at one end of the base 3, and the limiting walls 41 are respectively disposed on both sides of the base 3 and connected to the blocking wall 42. The base 3, the stop wall 42 and the limiting walls 41 define a placement slot S, which is used for the first wafer carrier 1, the second wafer carrier 2, and the guide unit. 5 and the height adjustment mechanism 6 are placed.

Referring to FIGS. 3 to 6, the guide unit 5 includes a first guide frame 51 disposed on the base 3 and a second guide frame 52 disposed on the base 3. The first guide frame 51 includes two side walls 511 spaced apart and located between the first wafer carrier 1 and the second wafer carrier 2, and a handle 512 connected to the top side of the side walls 511 at both ends and Two limiting members 516 are disposed on the side wall 511. Each side wall 511 has an inner wall surface 515 and four grooves 517 facing the first wafer carrier 1 are formed. The inner wall surfaces 515 face each other, and the inner wall surfaces 515 are formed with a plurality of vertically spaced arrays. First guide grooves 518 (the two grooves on the two side walls 511 together constitute a first guide groove 518), and each of the first guide grooves 518 on the inner wall surfaces 515 is available for the periphery of the wafer W Accept, pass, and provide corresponding guidance effects. The card slots 517 are used for four card blocks (not shown) of the first wafer carrier 1 to be engaged, thereby engaging the first wafer carrier 1 to the first guide frame 51, and the cards The number of slots 517 and the number of such blocks (not shown) is not limited to four. The side walls 511 and the handle 512 define a guide entrance 513 that communicates with one side of the first guide grooves 518 and faces the first entrance 12 and another side that communicates with the first guide grooves 518 It faces the guide exit 514 of the second inlet 22. Each of the first guide grooves 518 is adapted to allow the wafer W to pass through, and each of the first guide grooves 518 has a position adjacent to the first wafer carrier 1 and vertically aligned with one of the first receiving grooves 11. And an exit section 518b that communicates with the entry section 518a and is adjacent to the second wafer carrier 2 and is vertically aligned with one of the second receiving slots 21. Each entrance section 518a has a first end 518a1 facing the first wafer carrier 1 and a second end 518a2 communicating with the exit section 518b. The vertical height of the entrance section 518a is from the first end 518a1 to the second The end 518a2 is tapered, so that the cross-sectional shape of the inlet section 518a is generally tapered, and the included angle θ can be between 10-15 degrees, and the vertical height of each inlet section 518a is greater than the vertical height of each outlet section 518b, making the Wait until the wafer W can be guided in the process of passing through the entrance section 518a, and the length L1 of each entrance section 518a is not less than the length L2 of each exit section 518b, so as to ensure that the included angle θ is within an appropriate range. When the included angle θ is smaller, the vertical component force that the wafer W receives when passing through the entrance section 518a is smaller, so that the wafer W can enter the exit section 518b smoothly. Referring again to FIG. 6A, each exit section 518b has a first section 518b1 communicating with the entry section 518a and a second section 518b2 communicating with the first section 518b1 and the guide exit 514. The vertical height of the second section 518b2 is far from An end of the first portion 518b1 is tapered to an end adjacent to the first portion 518b1, and the second portion 518b2 has an included angle α located at an end adjacent to the first portion 518b1, and the included angle α is between 10-15 degrees. The length L2 of each exit section 518b is approximately 15% -20% of the diameter of the wafer W, and the depth L3 of each first guide groove 518 recessed inward from the inner wall surface 515 of the side walls 511 is approximately 10% -15% of the diameter of the wafer W, so that the wafer W can be stably contained in each of the first guide grooves 518 when passing through each of the first guide grooves 518. It is worth mentioning that if the length L2 and the depth L3 are too large, the friction of the wafers W during the conversion process will be increased, and if the length L2 and the depth L3 are too small, the support force for the wafers W will be increased. Insufficient, so the length L2 and depth L3 need to be set within a suitable range. Furthermore, the vertical height X2 of the first end 518a1 of each inlet section 518a is greater than the vertical height X1 of each first receiving slot 11, and the vertical height of the outlet section 518b of each first guide slot 518 is not Greater than the vertical height of each of the second guide grooves 524a. The limiting pieces 516 are two ribs formed on one side of the side walls 511 facing the first wafer carrier 1 and extending vertically, for clamping the two sides of the first wafer carrier 1 so that The first wafer carrier 1 is positioned relative to the first guide frame 51 to prevent the first wafer carrier 1 from shaking from side to side. The limiting member 516 is not limited to the form of two ribs, as long as the first wafer carrier 1 can be positioned.

Referring to FIGS. 1, 2 and 5, the second guide frame 52 includes a main body wall 521, a bottom wall 522, four connecting rods 523 and two guide walls 524. The main body wall 521 is disposed on the bottom wall 522 and defines an opening 521a. The bottom wall 522 is disposed on the base 3 for the second wafer carrier 2 to be placed. Each connecting rod 523 extends toward the first guide frame 51. One end of the connecting rod 523 is movably pivotally connected to the base. The other end of the main body wall 521 is fixed to the guide walls 524. The guide walls 524 are located between the first guide frame 51 and the second wafer carrier 2, and form a plurality of vertically spaced arrangements, which are respectively aligned with the first receiving grooves 11 and the first guides. The second guide grooves 524a (the two grooves located on the two guide walls 524 together constitute a second guide groove 524a) aligned with the inlet sections 518a of the guide groove 518, and the guide walls 524 and the main body wall 521 Phase space. The combining process of the second guide frame 52 and the second wafer carrier 2 is summarized as follows: first, the connecting rods 523 are pivoted to be parallel to the main body wall 521, and then the second wafer carrier 2 is placed At the bottom wall 522, the second wafer carrier 2 is placed with the second inlet 22 in a direction opposite to the main body wall 521, and finally the connecting rods 523 are pivoted toward the second wafer carrier 2. The second wafer carrier 2 is substantially perpendicular to the main body wall 521.

Referring to FIG. 2, FIG. 5 and FIG. 7, the height adjustment mechanism 6 includes a first carrier plate 61, a second carrier plate 62, and a first plate secured to the side walls 511 for the first wafer carrier 1 to be disposed.底板 63。 The bottom plate 63. The height h1 of the first bearing plate 61 is smaller than the height h2 of the second bearing plate 62. One of the first carrier plate 61 and the second carrier plate 62 is disposed on the base 3 and carries the first base plate 63, and the first base plate 63 is used for the first wafer carrier 1 to be placed. The first carrier plate 61 and the second carrier plate 62 are alternately placed, so the first carrier plate 61 can carry the first wafer carrier 1 so that the first wafer carrier 1 is positioned at a first height position. In addition, if the height needs to be adjusted, the first wafer carrier 1 can be carried by the second carrier plate 62, so that the first wafer carrier 1 is positioned at a second height position higher than the first height position. The first wafer carrier 1 is adjusted and changed between the first height position and the second height position. A guide angle 631 is formed on both sides of one end of the first bottom plate 63 away from the first guide frame 51, and the range of the guide angle 631 can be between 30-45 degrees, so as to be conveniently placed in the placement slot S. When the first wafer carrier 1 is at the first height position, all the first receiving grooves 11 of the first wafer carrier 1 and a part of the second receiving grooves 21 of the second wafer carrier 2 are aligned with each other. When the first wafer carrier 1 is at the second height position, all the first receiving grooves 11 of the first wafer carrier 1 and another part of the second receiving groove 21 of the second wafer carrier 2 Positions are aligned with each other. In this embodiment, at the first height position and the second height position, the vertical heights of the 25 first receiving slots 11 of the first wafer carrier 1 will correspond to the second wafer carrier, respectively. The odd-numbered layers and the even-numbered layers in two of the 50 second receiving slots 21.

It should be noted that, because the first bottom plate 63 is locked to the side walls 511 of the first guide frame 51, when the first bottom plate 63 is between the first bearing plate 61 and the second bearing plate 62, When the height is changed, the first guide frame 51 will also be linked, so that whether in the first height position or the second height position, all the first receiving slots 518 of the first guide frame 51 All are aligned with the positions of the first receiving grooves 11 and the second receiving grooves 21. The first base plate 63 is not an essential component, and may be omitted in some embodiments, so that one of the first carrier plate 61 and the second carrier plate 62 can directly carry the first wafer carrier 1. In other embodiments, one of the first carrier plate 61 and the second carrier plate 62 is disposed on the base 3 and carries the second guide frame 52 and the second wafer carrier 2. The height difference between the first wafer carrier 1 and the second wafer carrier 2 can be adjusted by the thickness difference between the first carrier plate 61 and the second carrier plate 62, so that the first wafer carrier can also be achieved. The positions of all the first receiving grooves 11 of 1 and a part of the second receiving grooves 21 of the second wafer carrier 2 are aligned with each other. However, one of the first carrying plate 61 and the second carrying plate 62 is disposed on the base 3 and carries the first bottom plate 63, which is a more preferable embodiment, because it is convenient in operation, it only needs to hold the The handle 512 (see FIG. 3) of the first guide frame 51 can remove the first guide frame 51 together with the first bottom plate 63 and the first wafer carrier 1, so that the first carrier can be replaced.板 61 and this second carrying plate 62. Conversely, if one of the first carrier plate 61 and the second carrier plate 62 is disposed on the base 3 and carries the second guide frame 52 and the second wafer carrier 2, the first carrier must be replaced. The plate 61 and the second carrier plate 62 need to remove the first guide frame 51 together with the first base plate 63, the first wafer carrier 1, the second guide frame 52, and the second wafer carrier 2 More inconvenient.

Referring to FIG. 8 to FIG. 10, the pushing mechanism 7 is slidably disposed on the base 3. The pushing mechanism 7 includes a slightly L-shaped pushing plate 71 and an end of the pushing plate 71. A pusher block 72 having a plurality of grooves 721 formed therein, so that the pusher block 72 is sawtooth-shaped. When the wafers W are pushed up, the wafers W will slide to the grooves 721. It is stuck at the deepest place, so that the wafers W can be prevented from shaking up and down. The pushing mechanism 7 can be controlled to move in a pushing direction P through the first inlet 12 of the first wafer carrier 1 to push the first containers aligned with some of the second receiving slots 21. Place the wafers W in the slot 11 such that the wafers W enter the first guide frame 51 of the guide unit 5 from the first receiving slot 11 through the first outlet 13 The inlet 513 passes through the first guide grooves 518 and exits from the guide outlet 514, and finally moves to the second receiving grooves 21 through the second inlet 22 of the second wafer carrier 2 as shown in FIG. 9. Inside.

Referring to FIG. 6 and FIG. 10 to FIG. 12, the operation method of the first embodiment of the wafer conversion device of the present invention is described below. The wafer W in the figure is only taken as an example. First, the height adjustment mechanism 6 is selected as shown in FIG. 10. The first carrier plate 61 carries the first wafer carrier 1 so that the first wafer carrier 1 is located at the first height position having a lower height, and then the pushing mechanism 7 is operated toward the pushing direction P as shown in FIG. 11. Moving, so that the pushing mechanism 7 pushes the wafer W located in one of the first receiving grooves 11 of the first wafer carrier 1 through the first inlet 12 of the first wafer carrier 1 through the The first exit 13 enters the entry section 518a and the exit section 518b of the first guide groove 518 through the guide entrance 513 of the first guide frame 51, and exits through the guide exit 514 to enter the The corresponding second guide groove 524a of the second guide frame 52 is finally moved through the second inlet 22 of the second wafer carrier 2 into the corresponding second guide groove 524a as shown in FIG. The pushing mechanism 7 is moved back to the original position in the reset direction D, thus completing the process of pushing the wafer W once. It should be noted that, because the vertical height X2 of the inlet section 518a of the first guide slot 518 is greater than the vertical height X1 of the first receiving slot 11, and the vertical height of the outlet section 518b is not greater than the second guide The vertical height of the groove 524a, even if the wafer W is warped during the wafer conversion process, when the wafer is transferred from the first receiving groove 11 to the first guide groove 518, the vertical The height deviation can still be contained by the entrance section 518a of the first guide groove 518, and the warped portion of the wafer W will not directly hit the upper and lower wall surfaces of the first guide groove 518 and cause cracking. The circle W will enter the exit section 518b along the tapered vertical height of the entry section 518a from the first end 518a1 to the second end 518a2, and the design of the second section 518b2 will allow the wafer W to smoothly pass from the The exit section 518b leaves and enters the second guide groove 524a, and finally transfers to the second receiving groove 21 through the second guide groove 524a, so that the wafer conversion process is smooth, so that not only the wafers W can be reduced. Breakage and increase the yield, smooth conversion of these wafers W can also improve production efficiency. Similarly, when the wafers W are transferred from the exit section 518b of the first guide groove 518 to the second guide groove 524a, the vertical height deviation caused by the warpage can still be used by the second guide groove. 524a is contained because the vertical height of the exit section 518b is not greater than the vertical height of the second guide groove 524a.

Referring again to FIG. 13 and FIG. 14, since the number of the second accommodating grooves 21 of the second wafer carrier 2 is twice the number of the first accommodating grooves 11 in this embodiment, the second crystal cavity needs to be filled. All the second accommodating slots 21 of the round carrier 2 need to convert the wafers W in the first full wafer carrier 1 to the second full wafer carrier 2, so the first Second push. First, the first carrier plate 61 of the height adjustment mechanism 6 is replaced with the second carrier plate 62, so that the first wafer carrier 1 is located at the second height position, and the first receiving grooves 11 are aligned with the first The second receiving slots 21 of the two wafer carriers 2 have not yet received the wafers W. Then, the pushing mechanism 7 is operated to transfer the wafers W from the first wafer carrier 1 to the second wafer carrier 2 according to the foregoing operation mode, so as to complete the wafer conversion process.

15 and FIG. 16, there is shown a second embodiment of a wafer conversion device according to the present invention. Most of the implementation of the second embodiment is similar to the first embodiment. The main difference is that the height adjustment mechanism 6 includes a first A bottom plate 63 and a second bottom plate 64. A height H1 of the first bottom plate 63 is smaller than a height H2 of the second bottom plate 64. One of the first bottom plate 63 and the second bottom plate 64 is disposed on the base 3 and locked to the side walls 511. The first bottom plate 63 can carry the first wafer carrier 1 so that the first wafer carrier 1 at the first height position, the second base plate 64 can carry the first wafer carrier 1 so that the first wafer carrier 1 is at the second height position, whereby the first wafer carrier 1 can be carried Adjust and change between the first height position and the second height position. That is, in this embodiment, the height of the first wafer carrier 1 is adjusted by replacing the first base plate 63 and the second base plate 64 with different thicknesses, and the first embodiment is performed under the first base plate 63. Setting the first bearing plate 61 and the second bearing plate 62 with different thicknesses to adjust the height is a different embodiment.

Referring to FIG. 17, a third embodiment of a wafer conversion device according to the present invention is also provided. The wafer conversion device of this embodiment is also used for placing a first wafer carrier 1 and a second wafer carrier 2 and includes a base 3. , A positioning unit 4, a guiding unit 5, a height adjustment mechanism 6, and a pushing mechanism 7. The individual structures of the base 3, the positioning unit 4, the first guide frame 51 and the second guide frame 52, and the height adjustment mechanism 6 of the guide unit 5 are the same as those of the first embodiment and the first embodiment. The second embodiment is the same, but the relative setting relationship in use is different. In addition, in this embodiment, the first wafer carrier 1 is a quartz crystal boat, and the second wafer carrier 2 is a Teflon wafer box. The number of the first receiving grooves 11 is an even number, and the After the number of the first accommodating slots 11 is greater than the number of the second accommodating slots 21, the number of the first accommodating slots 11 is twice the number of the second accommodating slots 21. Among them, the number of the first receiving slots 11 is 50, and the number of the second receiving slots 21 is 25, but not limited thereto. That is, in the third embodiment, the wafers W are transferred from the first wafer carrier 1 with a larger capacity to the second wafer carrier 2 with a smaller capacity. The wafers W are transferred from the first wafer carrier 1 with a smaller capacity to the second wafer carrier 2 with a larger capacity, which are suitable for different process requirements, and it should be noted that the first A wafer carrier 1 is the same as the second wafer carrier 2 of the first embodiment, and the second wafer carrier 2 is the same as the first wafer carrier 1 of the first embodiment. Of course, the first to third embodiments are also applicable to the transfer of the wafers W between the first wafer carrier 1 and the second wafer carrier 2 having the same capacity, and are not limited to specific implementations.

Specifically, in this embodiment, the second guide frame 52 of the guide unit 5 is joined to the first wafer carrier 1 by the guide wall 524, so that the opening 521a of the main body wall 521 is pushed toward the pusher. The mechanism 7 is different from the first and second embodiments. The height adjustment mechanism 6 is also slightly different. Since the number of the first receiving slots 11 is greater than the number of the second receiving slots 21 in this embodiment, when the first wafer carrier 1 is in the first At the height position, a part of the first receiving groove 11 of the first wafer carrier 1 and all the second receiving grooves 21 of the second wafer carrier 2 are aligned with each other. When the first wafer carrier 1 is in the first At the two height positions, the positions of the first receiving grooves 11 of the other parts of the first wafer carriers 1 and the entire second receiving grooves 21 of the second wafer carrier 2 are aligned with each other, so that the first wafer carrier The wafers W accommodated in 1 are transferred to different second wafer carriers 2 in stages. The structure of the ejection mechanism 7 is also different from the first and second embodiments. In this embodiment, the ejection mechanism 7 includes a slightly rectangular ejection plate 71 and a plurality of ejection plates disposed on the ejection mechanism. The plate 71 faces the ejector pin 73 of the first wafer carrier 1. Each end of the ejector pin 73 is formed with a V-shaped groove 731, which can prevent the wafers W from shaking up and down when the wafers W are pushed. The number of thimbles 73 corresponds to the number of the second accommodation grooves 21, and the vertical heights of the thimbles 73 also correspond to the second accommodation grooves 21, but not limited thereto. In this embodiment, the second wafer carrier 2 is engaged with the first guide frame by a plurality of clamping blocks (not shown) in cooperation with the grooves 517 (see FIG. 3) of the first guide frame 51. 51, the same way that the first wafer carrier 1 engages the first guide frame 51 in the first embodiment.

Referring to FIG. 17 to FIG. 19, the operation method of the third embodiment of the wafer conversion device of the present invention is described below: First, the first carrier plate 61 of the height adjustment mechanism 6 is selected so that the first wafer carrier 1 is located at the first Height position, and then the pushing mechanism 7 is operated to move in the pushing direction P, as shown in FIG. 18, through the opening 521 a of the main wall 521 of the second guide frame 52 and then entering the first wafer carrier 1. The first inlet 12 pushes the wafers W in a part of the first accommodating slots 11 of the first wafer carrier 1 through the first outlet 13 and then into the second guide. The corresponding second guide grooves 524a of the frame 52 enter the inlet sections 518a and the outlet sections of the corresponding first guide grooves 518 through the guide inlet 513 of the first guide frame 51 518b, then exit through the guide exit 514, and finally move through the second inlet 22 of the second wafer carrier 2 into the corresponding second guide grooves 524a as shown in FIG. 19, and then push the jack The mechanism 7 moves back to the original position in the reset direction D, thus completing the process of pushing the wafers W once. It should be noted that, because the vertical height of the entrance sections 518a of the first guide grooves 518 is greater than the vertical height of the second guide grooves 524a, and the vertical height of the second guide grooves 524a and the After the vertical heights of the first receiving grooves 11 are the same, even if the wafers W are warped during the wafer conversion process, the second guiding grooves 524a are transferred to the first guiding grooves. At 518, the vertical height deviation caused by the warpage can still be contained by the entrance sections 518a of the first guide grooves 518, and the warped portion of the wafers W will not directly hit the first The upper and lower walls of the guide groove 518 cause cracks, and the wafers W will enter the exit sections 518b along the tapered vertical height of the entrance sections 518a from the first ends 518a1 to the second ends 518a2. Finally, it is transferred into the second accommodating grooves 21 so that the wafer conversion process is smooth.

Referring again to FIG. 20 and FIG. 21, since the number of the first receiving slots 11 of the first wafer carrier 1 is twice the number of the second receiving slots 21 in this embodiment, the first wafer carrier must be 1 If all the wafers W are transferred, another empty second wafer carrier 2 is required, and the remaining wafers W in the first wafer carrier 1 are transferred to the second wafer carrier 2 , So you need to do a second push. First, the first carrier plate 61 of the height adjustment mechanism 6 is replaced with the second carrier plate 62, so that the first wafer carrier 1 is located at the second height position, so that the wafer W is also accommodated. Wait until the first receiving grooves 11 are aligned with the second receiving grooves 21. Then, the pushing mechanism 7 is operated to transfer the wafers W from the first wafer carrier 1 to the second wafer carrier 2 according to the foregoing operation mode, so as to complete the wafer conversion process.

In summary, the vertical height of the inlet sections 518a of the wafer conversion device of the present invention through the first guide frame 51 of the guide unit 5 is greater than the outlet sections 518b and the first receiving slots 11 Vertical height of the wafers W during the transition from the first wafer carrier 1 to the second wafer carrier 2, the wafers W enter the entrance sections from the first accommodation slots 11 518a is guided to the exit sections 518b, and finally enters the second accommodation slots 21. Because the vertical height of the entrance sections 518a is greater than the vertical height of the first receiving grooves 11, the wafers W can smoothly enter the entrance sections 518a without cracking even if warped, so as to ensure that Wafer W can be smoothly transferred from the first wafer carrier 1 to the second wafer carrier 2 to prevent the wafers W from cracking during the transfer process, so the production yield and production efficiency can be improved, so the cost can be achieved. The purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited in this way, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the patent specification of the present invention are still Within the scope of the invention patent.

1‧‧‧ the first wafer carrier

11‧‧‧ the first receiving tank

12‧‧‧ first entrance

13‧‧‧First Exit

2‧‧‧Second wafer carrier

21‧‧‧Second accommodation slot

22‧‧‧Second Entrance

3‧‧‧ base

4‧‧‧ positioning unit

41‧‧‧limit wall

42‧‧‧stop wall

5‧‧‧Guide unit

51‧‧‧First Guide Frame

511‧‧‧ sidewall

512‧‧‧handle

513‧‧‧Guide Entrance

514‧‧‧Guide Exit

515‧‧‧Inner wall surface

516‧‧‧Limit

517‧‧‧card slot

518‧‧‧first guide slot

518a‧‧‧ entrance section

518a1‧‧‧ first end

518a2‧‧‧ second end

518b‧‧‧Exit

518b1‧‧‧Part I

518b2 ‧‧‧ Part Two

52‧‧‧Second Guide Frame

521‧‧‧Main wall

521a‧‧‧ opening

522‧‧‧ bottom wall

523‧‧‧Connecting rod

524‧‧‧Guide wall

524a‧‧‧Second guide groove

6‧‧‧ height adjustment mechanism

61‧‧‧The first bearing plate

62‧‧‧Second loading plate

63‧‧‧First floor

631‧‧‧lead angle

64‧‧‧Second floor

7‧‧‧ Pushing mechanism

71‧‧‧ Pusher

72‧‧‧ Pushing block

721‧‧‧Groove

73‧‧‧ thimble

731‧‧‧Groove

W‧‧‧ Wafer

S‧‧‧ Placement slot

L1, L2‧‧‧ length

L3‧‧‧ Depth

h1, h2‧‧‧ height

H1, H2‧‧‧ height

P‧‧‧ Pushing direction

D‧‧‧ Reset direction

X1, X2‧‧‧ vertical height

θ, α‧‧‧ angle

Other features and effects of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is a perspective view of a first embodiment of a wafer conversion device of the present invention; FIG. 2 is the first implementation An exploded perspective view of the example; FIG. 3 is a perspective view illustrating a first guide frame of a guide unit of the first embodiment; FIG. 4 is a rear view of the first guide frame; FIG. 1 is a cross-sectional view illustrating a first wafer carrier at a first height position; FIG. 6 is a partially enlarged schematic view of FIG. 5, illustrating a plurality of first guides of the first guide frame; Leading grooves; FIG. 6A is a partially enlarged schematic diagram of FIG. 6 illustrating an exit section of each first guiding groove; FIG. 7 is a cross-sectional view similar to FIG. 5 of the first embodiment, illustrating the first wafer carrier At a second height position; FIG. 8 is a top view of the embodiment, illustrating a state where the wafers are located on the first wafer carrier before a pushing mechanism of the first embodiment has pushed the wafers Figure 9 is a top view similar to Figure 8 of the embodiment, illustrating the first embodiment The pushing mechanism pushes the wafers from the first wafer carrier to a second wafer carrier. FIG. 10 is a partially enlarged schematic diagram of FIG. 5, illustrating a wafer located on the first wafer carrier. FIG. 11 is a cross-sectional view similar to FIG. 10, illustrating that the wafer is pushed through one of the first guide grooves of the first guide frame by the pushing mechanism and enters the first guide groove. One of the second receiving slots of the two wafer carriers; FIG. 12 is a cross-sectional view similar to FIG. 10, illustrating that the wafer is pushed up to one of the second receiving slots of the second wafer carrier by the pushing mechanism; FIG. 13 is a partially enlarged schematic view of FIG. 7, illustrating that a wafer is located in one of the first receiving slots of the first wafer carrier; FIG. 14 is a cross-sectional view similar to FIG. 13, illustrating that the wafer is The pushing mechanism is pushed into one of the second accommodating grooves of the second wafer carrier; FIG. 15 is a cross-sectional view of a second embodiment of a wafer conversion device of the present invention, illustrating a first wafer carrier in A first height position; FIG. 16 is a cross-sectional view similar to FIG. 15 of the second embodiment, illustrating the first The round carrier is at a second height position; FIG. 17 is a perspective view of a third embodiment of the wafer conversion device of the present invention; FIG. 18 is an incomplete partial cross-sectional view obtained from the section line II-II of FIG. 17, It is explained that a plurality of wafers are located in a plurality of first accommodating grooves of the first wafer carrier; FIG. 19 is a cross-sectional view similar to FIG. FIG. 20 is a cross-sectional view similar to FIG. 18, illustrating that the other part of the wafers are located in the first receiving grooves of the first wafer carrier; 21 is a cross-sectional view similar to FIG. 18, illustrating that the wafers in another part are pushed into the second receiving grooves of the second wafer carrier by the pushing mechanism.

Claims (14)

A wafer conversion device is suitable for placing a first wafer carrier and a second wafer carrier. The first wafer carrier includes a plurality of first receiving grooves arranged at a vertical interval, and a first communication vessel connected to the first receiving vessel. A first inlet on one side of the receiving groove and a first outlet communicating with the other side of the first receiving grooves. Each first receiving groove is suitable for receiving a wafer, and the second wafer carrier It includes a plurality of second accommodating grooves arranged at a vertical interval and a second inlet communicating with one side of the second accommodating grooves and facing the first outlet. The number of the first accommodating grooves is different from the number of the second accommodating grooves. The wafer conversion device includes: a base; a guide unit including a first guide provided on the base; The first guide frame includes a plurality of first guide grooves arranged vertically spaced between the first wafer carrier and the second wafer carrier, and one side communicating with the first guide grooves. And a guide entrance facing the first entrance and a guide communicating with the other side of the first guide grooves and facing the second entrance Each first guide groove is adapted to allow a wafer to pass through, and each first guide groove has an entrance section adjacent to the first wafer carrier and vertically aligned with one of the first receiving grooves. And an exit section that communicates with the entry section and is adjacent to the second wafer carrier and is vertically aligned with one of the second receiving slots, the vertical height of the entry sections is greater than the vertical height of the exit sections; A pushing mechanism is movably disposed on the base, and the pushing mechanism can be controlled to pass through the first entrance of the first wafer carrier to push the first receptacles aligned with the second receptacles. The wafers in the slot, so that the wafers enter the guide inlet of the first guide frame of the guide unit from the first accommodation slot through the first outlet through the first guide A guide groove and exit from the guide exit, and finally move into the second accommodating grooves through the second inlet of the second wafer carrier; and a height adjustment mechanism provided on the base and including a first A bottom plate and a second bottom plate, the height of the first bottom plate is less than the height of the second bottom plate, and the first bottom plate And one of the second base plate is disposed on the base and connected to the side walls, the first base plate can carry the first wafer carrier so that the first wafer carrier is positioned at a first height position, and the second base plate The first wafer carrier can be carried so that the first wafer carrier is positioned at a second height position higher than the first height position, thereby the first wafer carrier can be at the first height position and the Adjust and change between the second height positions. When the first wafer carrier is at the first height position, all the receiving grooves of one of the first wafer carrier and the second wafer carrier and the other one The positions of a part of the receiving slots are aligned with each other, and the positions of the first guiding slots, the first receiving slots and the second receiving slots of the first guide frame are aligned with each other. When the tool is in the second height position, the positions of all the receiving grooves of one of the first wafer carrier and the second wafer carrier and the other part of the receiving grooves of the other are aligned with each other, and the first guide Positions of the first guide grooves, the first receiving grooves, and the second receiving grooves of the rack Align with each other. The wafer conversion device according to claim 1, wherein the first guide frame includes two side walls spaced apart and located between the first wafer carrier and the second wafer carrier, and each side wall has a An inner wall surface that faces each other, the inner wall surfaces are formed with the first guide grooves, and the side walls define the guide inlet and the guide outlet. The wafer conversion device according to claim 2, wherein the first guide frame further includes a handle, and two ends of the handle are respectively connected to the side walls. The wafer conversion device according to claim 1, wherein the guide unit further includes a second guide frame disposed on the base, and the second guide frame includes a plurality of vertically spaced arrays arranged separately from the second guide frame. The second receiving grooves and the second guiding grooves in which the exit sections of the first guiding grooves are aligned. The wafer conversion device according to claim 2, wherein the first guide frame further includes at least one stopper disposed on the sidewalls, and the stopper is suitable for positioning the first wafer carrier or the first wafer carrier. Two wafer carriers. The wafer conversion device according to claim 1, wherein the guide unit further includes a second guide frame disposed on the base, and the second guide frame includes a plurality of vertically spaced arrays arranged separately from the second guide frame. The first receiving grooves and the second guide grooves in which the inlet sections of the first guide grooves are aligned. The wafer conversion device according to any one of claims 1 to 6, wherein an entrance section of each first guide groove has a first end facing the first wafer carrier and an exit section communicating with the exit section. At the second end, the vertical height of the inlet section tapers from the first end to the second end. The wafer conversion device according to claim 7, wherein a vertical height of the first end of the entrance section of each first guide groove is greater than a vertical height of each first receiving groove. The wafer conversion device according to claim 8, wherein a vertical height of the exit section of each first guide groove is not greater than a vertical height of each second guide groove. The wafer conversion device according to claim 7, wherein a length of the entry section of each first guide groove is not less than a length of the exit section. The wafer conversion device according to claim 10, wherein a length of the exit section of each first guide groove is 15% -20% of a diameter of each wafer. The wafer conversion device according to claim 7, wherein each exit section has a first portion communicating with the inlet section and a second portion communicating with the first portion and the guide exit, and a vertical height of the second portion The tapered portion is tapered from an end far from the first portion to an end adjacent to the first portion, and the second portion has an included angle at an end adjacent to the first portion, and the included angle is between 10-15 degrees. The wafer conversion device according to claim 7, wherein the entrance section of each first guide groove has an included angle at the second end, and the included angle is between 10-15 degrees. The wafer conversion device according to claim 2, wherein the inner wall surfaces are recessed with the first guide grooves, and the depth of each first guide groove depression is 10% of the diameter of each wafer- 15%.