TW201639059A - Wafer transfer apparatus and wafer transfer method thereof - Google Patents

Abstract

A wafer transfer apparatus is provided for placing a first carrier and a second carrier. The first carrier is formed with a plurality of first accommodating slots vertically spaced from each other. Each of the first accommodating slots is used to accommodate a wafer. The second carrier is formed with a plurality of second accommodating slots vertically spaced from each other. The number of the first accommodating slots is different from the number of the second accommodating slots. The wafer conversion apparatus comprises a base, a first positioning frame, a second positioning frame, a height adjusting mechanism and an ejector mechanism. The first carrier and the second carrier are placed on the first positioning frame and the second positioning frame respectively. The height adjustment mechanism can drive the first carrier to transfer between a first height position and a second height position. The wafer in the first carrier is pushed into the second carrier by the ejector mechanism.

Description

Wafer conversion device and wafer conversion method thereof

The present invention relates to a conversion device, and more particularly to a wafer conversion device for transferring a wafer in a carrier to another carrier.

In the semiconductor process, the wafers need to be processed by a variety of machines, and the wafers are transported between the different process machines through the carrier to ensure that the wafers are not damaged during the movement. In order to match the machine and process environment required for different processes, the wafers need to be stored in different configurations of the carrier, and when the wafers are to be switched between different carriers, the wafer conversion device is used to assist the wafers in two The positions of the different carriers are safely interchanged. The use concept of the wafer conversion device is that the operator firstly places the carrier device to be transferred out of the wafer and the carrier device to receive the wafer in a specified position on the wafer conversion device in order, and confirms that the positions of the two carrier devices are correctly placed. Then, by using the shifting mechanism of the wafer transfer device, the wafer in the carrier device to be transferred out of the wafer is transferred to the carrier device to receive the wafer, and after confirming that the transfer operation is completed, the operator sequentially takes out the two carrier devices.

However, conventional wafer conversion devices can only tolerate two carrying capacities. The same amount of carrier devices do the operation of exchanging wafers with each other. How to allow two carrier devices with different bearing capacities to exchange wafers with each other will improve the efficiency of the overall process, which is a subject worthy of study.

Accordingly, it is an object of the present invention to provide a wafer conversion apparatus that can perform wafer exchange between carriers having different numbers of wafers.

Another object of the present invention is to provide a wafer conversion method for a wafer conversion device that performs wafer exchange between carriers having different numbers of wafers.

Therefore, the wafer conversion device of the present invention can be placed in a first carrier and a second carrier. The first carrier is formed with a plurality of first receiving slots spaced apart from each other. The slot is configured to receive a wafer, and the second carrier is formed with a plurality of second accommodating slots spaced apart from each other. The number of the first accommodating slots is different from the number of the second accommodating slots. The wafer conversion device includes: a first positioning frame disposed on the base, the first positioning frame includes a front end, and a rear end opposite to the front end; a second positioning frame is disposed on the base The second positioning frame is configured to carry and position the second carrier; the height adjusting mechanism is disposed on the first positioning frame, and the height adjusting mechanism is configured to carry the first Carrying the carrier and adjusting the first carrier from a first height position to a second height position higher than the first height position, when the first carrier is at the first height position, the first All of the receiving slots and one of the second receiving slots And wherein the other part receiving groove position aligned with each other when the first carrier in the second height position, The first receiving groove and the entire receiving groove of one of the second receiving grooves are aligned with each other of the other receiving groove; and a pushing mechanism is slidably disposed on the base Positioned at the front end of the first positioning frame, the pushing mechanism is movable in a front-to-back pushing direction for aligning the first receiving positions with the second receiving groove positions The wafers in the slots are pushed into the second receiving slots by the first receiving slots.

In some embodiments, the height adjustment mechanism includes a first carrier board and a second carrier board. The height of the first carrier board is smaller than the height of the second carrier board. The first carrier board and the second board. One of the carrier plates is selectively disposed on the first positioning frame, the first carrier plate can carry the first carrier to be located at the first height position, and the second carrier plate can carry the first carrier Position it at the second height position.

In some implementations, the first positioning frame includes a positioning plate, two limiting plates protruding from the surface of the positioning plate and spaced apart from each other, and a positioning defined by the limiting plates and the positioning plate. The slot, one of the first carrier board and the second carrier board is selectively latched in the positioning slot.

In some embodiments, the second positioning frame includes a carrier disposed on the base, and a mounting fixture. The surface of the carrier is recessed to form a placement slot, and the mounting fixture is engaged with the placement slot. The mounting fixture includes two left and right spaced side walls, each of the side walls is formed with a plurality of guiding grooves arranged at an upper and lower intervals, the second carrier is coupled to the rear side of the mounting fixture, and the second The accommodating slots are respectively aligned with the guiding slots, and the guiding slots are configured to guide the corresponding wafers to move into the corresponding second accommodating slots.

In some embodiments, the carrier includes a substrate on which the placement slot is formed, and a barrier plate protruding from the rear end of the substrate to block the second carrier.

In some embodiments, the base includes a vertical wall, the first positioning frame and the second positioning frame are disposed on the vertical wall, and the height adjusting mechanism includes a slidably coupled to the first positioning frame and can carry the a sliding frame of the first carrier, and a rotating component disposed on the first positioning frame and connected to the sliding frame, the rotating component can drive the first carrier in the vertical direction through the sliding frame at the first The height position moves between the second height position.

In some embodiments, the pushing mechanism includes a thimble guiding plate and a plurality of thimbles, each ejector pin for pushing the corresponding wafer, and each of the ejector pin ends is recessed to form a groove, the groove Extending between the left and right ends of the thimble, and the longitudinal section of the groove is open-shaped V-shaped, the ejector guide plate is disposed on the base, and has a plurality of perforations of the same number as the thimbles. The thimbles are threaded through the set position.

In some embodiments, the carriage includes a vertical plate slidably coupled to the first positioning frame, the vertical plate is formed with a card slot, and the vertical plate has a surrounding surface defining the card slot, the surrounding plate The surface has a lower side portion and an upper side portion. The rotating assembly includes a rotating shaft pivotally connected to the first positioning frame, a knob disposed at one end of the rotating shaft for rotating, and a fixed connection to the other end of the rotating shaft. An eccentric shaft, and a set of bearings disposed on the eccentric shaft, the shaft and the central axis of the eccentric shaft are parallel and spaced apart from each other, the bearing is inserted into the card slot and is respectively engaged with the lower side portion and the on Side section.

In some embodiments, the eccentric shaft includes a shaft member and a latch for securing the shaft member to the shaft.

In some embodiments, the carriage further includes a carrier plate disposed on the vertical plate and perpendicular thereto. The height adjustment mechanism further includes a mounting fixture disposed on the carrier plate, the mounting fixture includes two Each of the side walls is formed with a plurality of guiding grooves spaced apart from each other. The first carrier is coupled to the mounting jig and located at a front side of the two side walls, and the first receiving grooves respectively The guiding slots are aligned, and the guiding slots are used to guide the corresponding wafers to move into the corresponding second receiving slots.

In some embodiments, the first positioning frame includes a first rail fixed to the vertical wall, a second rail fixed to the vertical wall and spaced apart from a rear side of the first rail, the first rail and the second rail. The rails are respectively elongated and have a longitudinal direction parallel to the vertical direction. The vertical plate is disposed between the first rail and the second rail, and the vertical plate abuts the first rail and the second rail, respectively.

The wafer conversion method of the wafer conversion device of the present invention is adapted to transfer a wafer carried by a first carrier to a second carrier, wherein the first carrier is formed with a plurality of first and second spaced intervals. Each of the first receiving slots is configured to receive a wafer, and the second carrier is formed with a plurality of second receiving slots spaced apart from each other. The number of the first receiving slots is smaller than the number of the first receiving slots. And the number of the second accommodating slots, the method includes the following steps: the installation step, respectively mounting the first carrier and the second carrier at a high The first adjustment frame is located at a first height position, and the first accommodating groove is aligned with a part of the accommodating groove positions of the second accommodating grooves; In the step of pushing, the first accommodating grooves aligned with each other and the wafers in the second accommodating grooves are pushed from the first accommodating grooves to the second accommodating grooves by a pushing mechanism The step of replacing the first carrier is removed from the height adjustment mechanism; and the height adjustment step is to install the first carrier of the other fully loaded wafer to the height adjustment mechanism, and the height adjustment mechanism is Adjusting the other first carrier to a second height position higher than the first height position, so that the first receiving slots of the other first carrier and the second receiving slots The other part of the accommodating groove is aligned with each other; and the second ejector step is, by the urging mechanism, pushing the first accommodating groove which is aligned with the other part of the second accommodating groove The wafers are pushed from the first receiving slots to the wafers Etc. The second receiving groove.

In some implementations, the number of the first accommodating slots is one-half of the number of the second accommodating slots, and the number of the second accommodating slots is an even number. In the installing step, the first accommodating slots The first accommodating slots are respectively aligned with the second accommodating slots which are located at the even positions. In the height adjusting step, the first accommodating slots are respectively the second accommodating positions at odd positions. The slots are aligned with each other.

The wafer conversion method of the wafer conversion device of the present invention is adapted to transfer and transfer a wafer carried by a first carrier to a second carrier, wherein the first carrier is formed with a plurality of upper and lower intervals. a receiving slot, each of the first receiving slots for receiving a wafer, and the second carrier is formed with a plurality of second accommodating slots spaced apart from each other, the number of the first accommodating slots being greater than the number of the second accommodating slots, the method comprising the following steps: the installing step, the first carrier and the first carrier The second carrier is respectively mounted on a height adjusting mechanism and a positioning frame, so that the first carrier is located at a first height position, and a part of the first receiving groove and the second receiving groove Aligning the positions with each other; the first ejector step, the first accommodating grooves in the first accommodating grooves aligned with the positions of the second accommodating grooves by a pushing mechanism Pushing into the second accommodating slots; replacing step of moving the second carrier of the fully loaded wafer away from the positioning frame, and mounting another empty second carrier to the positioning frame; height adjustment step Adjusting the first carrier to a second height position higher than the first height position by the height adjustment mechanism, so that another part of the first receiving slots accommodates the slot and the other empty The second receiving slots of the second carrier are aligned with each other; and a second ejector step of pushing the wafers in the other portion of the first accommodating grooves aligned with the positions of the second accommodating grooves by the ejector mechanism to The circle is pushed into the second accommodating grooves by the first accommodating grooves.

In some implementations, the number of the first accommodating slots is twice the number of the second accommodating slots, and the number of the first accommodating slots is an even number. In the installing step, the second The accommodating slots are respectively aligned with the first accommodating slots which are located at the even positions. In the height adjusting step, the second accommodating slots are respectively the first accommodating slots which are located at odd positions. Align with each other.

The effect of the invention lies in: driving through the height adjustment mechanism Converting the wafers from the first carrier to the second carrier by the pushing mechanism when the first carrier is at the first height position and the second height position, respectively, and the first carrier and the second carrier The number of accommodating wafers of the carrier is different, so that the wafer can be converted between different carrier devices.

100‧‧‧ wafer conversion device

200‧‧‧ wafer conversion device

1‧‧‧Base

2‧‧‧First positioning frame

21‧‧‧ Positioning board

22‧‧‧ Limit Board

23‧‧‧ positioning slot

24‧‧‧ front end

25‧‧‧ Backend

3‧‧‧Second positioning frame

31‧‧‧ bearing seat

311‧‧‧Substrate

312‧‧‧Block board

313‧‧‧Place slot

32‧‧‧Installation fixture

321‧‧‧ side wall

322‧‧‧ guiding slot

4‧‧‧ Height adjustment mechanism

41‧‧‧First carrier board

42‧‧‧Second carrier board

5‧‧‧Pushing mechanism

51‧‧‧ Connecting rod

52‧‧‧Pushing board

6‧‧‧First carrier

61‧‧‧First accommodating slot

62‧‧‧first opening

63‧‧‧second opening

7‧‧‧Second carrier

71‧‧‧Second accommodating slot

8‧‧‧ wafer

1'‧‧‧Base

11'‧‧‧立立

2'‧‧‧First positioning frame

21'‧‧‧First rail

22'‧‧‧Second rail

23'‧‧‧ front end

24'‧‧‧ Backend

25'‧‧‧Locking plate

251'‧‧‧ pivot hole

3'‧‧‧Second positioning frame

4'‧‧‧ Height adjustment mechanism

41'‧‧‧Slide

42'‧‧‧Rotating components

43'‧‧‧Installation fixture

431'‧‧‧ side wall

432'‧‧‧ guiding slot

44'‧‧‧ 立板

441'‧‧‧ card slot

442'‧‧‧ Around the surface

442a'‧‧‧ upper side

442b'‧‧‧ lower side

45'‧‧‧Bearing board

46'‧‧‧ reel

47'‧‧‧ knob

471'‧‧‧ indicating slot

48'‧‧‧Eccentric shaft

481'‧‧‧ shaft parts

482'‧‧‧Latch

49'‧‧‧ Bearing

5'‧‧‧ Pushing mechanism

50'‧‧‧ Connecting rod

51'‧‧‧ thimble

511'‧‧‧ trench

52'‧‧‧Tedal guide plate

521'‧‧‧Perforation

6'‧‧‧First carrier

61'‧‧‧First accommodating slot

62'‧‧‧First opening

63'‧‧‧ second opening

7'‧‧‧Second carrier

71'‧‧‧First accommodating slot

P‧‧‧Pushing direction

D‧‧‧Reset direction

D1‧‧‧Up and down direction

H1, H2‧‧‧ height

L1, L2‧‧‧ central axis

S1~S5‧‧‧Steps

S1'~S5'‧‧‧ steps

The other features and advantages of the present invention will be apparent from the detailed description of the embodiments of the present invention. FIG. 1 is a perspective view illustrating a first embodiment of the wafer converting apparatus of the present invention; A partial cross-sectional front view illustrating a first carrier of the first embodiment at a first height position; and FIG. 3 is a partial cross-sectional front view illustrating the first carrier of the first embodiment at a second height 4 is a top view illustrating that a pushing mechanism of the first embodiment has not pushed a plurality of wafers, and the wafers are in a state of the first carrier; FIG. 5 is a top view illustrating the first A push mechanism of the embodiment pushes the wafers from the first carrier to a second carrier; FIG. 6 is a schematic flow chart illustrating a wafer conversion method of the wafer conversion device of the present invention. FIG. 7 is a partial enlarged view of FIG. 2, illustrating that the wafers are located in a plurality of first receiving grooves of the first carrier; FIG. 8 is a partially enlarged cross-sectional front view illustrating The wafers are pushed by the pushing mechanism to the second bearing A second plurality of frame receiving groove; FIG. 9 is a partial enlarged view of FIG. 3, the description of the wafers positioned such FIG. 10 is a partially enlarged cross-sectional front view showing the wafer being pushed into the second accommodating grooves by the pushing mechanism; FIG. 11 is a perspective view showing the wafer conversion of the present invention; A second embodiment of the device; FIG. 12 is a perspective view of FIG. 11; FIG. 13 is a partially exploded perspective view showing a rotating assembly and a vertical plate of the second embodiment; FIG. The exploded view is another view of FIG. 13; FIG. 15 is a partial cross-sectional side view illustrating the rotating assembly and the vertical plate of the second embodiment; FIG. 16 is a partial perspective view illustrating a ejector pin and a groove of the thimble; Figure 17 is a side elevational view of Figure 16; Figure 18 is a partial cross-sectional front view showing the first carrier at a first height position, the wafers are located in the first receiving slots; Figure 19 is a partial cross-sectional side The view shows that an eccentric shaft of the rotating assembly is at a first height position; FIG. 20 is a partial cross-sectional front view showing the first carrier at a second height position, and the wafers are located in the first accommodating grooves; Figure 21 is a partial cross-sectional side view showing the The eccentric shaft of the rotating assembly is at the second height position; FIG. 22 is a flow diagram illustrating the wafer converting method of the wafer converting apparatus of the present invention, which is applicable to the second embodiment; FIG. 23 is a partial cross-sectional side view illustrating the Wait for the thimble at the first height Positioning the wafers into the second receiving slots; and FIG. 24 is a partial cross-sectional side view showing the pins pushing the wafers into the second receiving slots at the second height position .

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1 and FIG. 2, the first embodiment of the wafer conversion device 100 of the present invention can be placed on a first carrier 6 and a second carrier 7. The first carrier 6 is formed with a plurality of upper and lower intervals. The first accommodating groove 61, the first opening 62, and the second opening 63 opposite to the first opening 62, each of the first accommodating grooves 61 is for accommodating a wafer 8. The second carrier 7 is formed with a plurality of second accommodating slots 71 spaced apart from each other. The number of the first accommodating slots 61 is different from the number of the second accommodating slots 71. The wafer conversion device 100 of the first embodiment includes a base 1, a first positioning frame 2, a second positioning frame 3, a height adjusting mechanism 4, and a pushing mechanism 5. In this embodiment, the first carrier 6 is a Teflon wafer cassette, the second carrier 7 is a quartz crystal boat, and the number of the second receiving slots 71 is an even number, and the first receiving slot 61 is The number of the first accommodating slots 61 is one-half of the number of the second accommodating slots 71, and the number of the first accommodating slots 61 is 25, for example. The number of the accommodating slots 71 is exemplified by 50, but is not limited thereto.

The first positioning frame 2 is disposed on the base 1. The first positioning frame 2 includes a positioning plate 21, two limiting plates 22 protruding from the surface of the positioning plate 21 and spaced apart from each other, and a positioning plate 21 and the like. The positioning groove 23 defined by the plate 22 A front end 24 and a rear end 25 opposite the front end 24. The first opening 62 of the first carrier 31 is toward the front end 24 and the second opening 63 is toward the rear end 25.

The second positioning frame 3 is disposed on the base 1 and located at the rear end 25 of the first positioning frame 2, and the second positioning frame 3 is used to carry and position the second carrier 7. The second positioning frame 3 includes a mounting base 31 and a mounting fixture 32. The surface of the mounting base 31 is recessed to form a positioning slot 313. The mounting fixture 32 is engaged in the positioning slot 313. 32 includes two side walls 321 spaced apart from each other, and each side wall 321 is formed with a plurality of guiding grooves 322 spaced apart from each other. The second carrier 7 is joined to the rear side of the mounting fixture 32, and the second receiving slots 71 are respectively aligned with the guiding slots 322. In this embodiment, the number of the guiding slots 322 is the same as the number of the second receiving slots 71, which are all 50, but not limited thereto, as long as the number is the same.

Referring to FIG. 1 to FIG. 3, the height adjustment mechanism 4 is disposed on the first positioning frame 2 for carrying the first carrier 6 and adjusting the first carrier 6 from a first height position (as shown in FIG. 2) to A second height position that is higher than the first height position (as shown in FIG. 3). The height adjustment mechanism 4 includes a first carrier plate 41 and a second carrier plate 42. The height H1 of the first carrier plate 41 is smaller than the height H2 of the second carrier plate 42. One of the first carrier plate 41 and the second carrier plate 42 is selectively inserted into the positioning slot 23 of the first positioning frame 2, and the height adjusting mechanism 4 is the first carrier plate 41 and the second carrier plate 42. The replacement adjusts the first carrier 6 to switch between the first height position and the second height position. The first carrier plate 41 can carry the first carrier 6 at a first height position, and the second carrier plate 42 can carry the first carrier 6 to Located at the second height position. When the first carrier 6 is in the first height position, the first accommodating groove 61 and all the accommodating grooves of one of the second accommodating grooves 71 and the other accommodating groove are aligned with each other. . When the first carrier 6 is in the second height position, the first receiving groove 61 and the other receiving groove of one of the second receiving grooves 71 and the other part of the other receiving groove are mutually positioned Align. Specifically, in the embodiment, as shown in FIG. 2, when the first carrier 6 is at the first height position, all the receiving slots of the first receiving slots 61 and the second receiving slots are The even-numbered position accommodating grooves 71 of the first accommodating groove 61 are aligned with each other; as shown in FIG. 3, when the first carrier 6 is at the second height position, all the accommodating grooves of the first accommodating grooves 61 are provided. The odd-numbered position accommodating grooves (from top to bottom) of the second accommodating grooves 71 are aligned with each other.

Referring to FIG. 1 to FIG. 5, the pushing mechanism 5 is slidably disposed on the base 1 and located at the front end 24 of the first positioning frame 2, and is movable along a front-to-back pushing direction P for The wafers 8 in the first accommodating grooves 61, which are aligned with the second accommodating grooves 71, are pushed into the second accommodating grooves by the first accommodating grooves 61. The pushing mechanism 5 includes a long connecting rod 51 and a rectangular pushing plate 52. The connecting rod 51 is slidably disposed on the base 1 and extends in a direction perpendicular to the base 1. The pushing plate 52 is disposed on The connecting rod 51 extends in the pushing direction P.

Referring to FIG. 6 , the wafer conversion method of the wafer conversion device 100 of the present embodiment is adapted to transfer the wafer 8 carried by the first carrier 6 to the second carrier 7 . The conversion method includes the following steps: Installation step S1, a first push step S2, a replacement step S3, and a height adjustment step Step S4, and a second pushing step S5.

Referring to FIG. 4, FIG. 6, and FIG. 7, in the mounting step S1, the second carrier 7 is first joined to the rear side of the mounting fixture 32, and then the first carrier 6 is mounted to the first carrier of the height adjusting mechanism 4. 41, and the mounting fixture 32 is snapped into the placement slot 313 of the second positioning frame 3. At this time, the first carrier 6 is located at the first height position, and all the accommodating slots of the first accommodating slots 61 and a part of the accommodating slots of the second accommodating slots 71 are aligned with each other, in this embodiment. The entire accommodating grooves of the first accommodating grooves 61 and the even-numbered position accommodating grooves of the second accommodating grooves 71 are aligned with each other.

Referring to FIGS. 5, 6, and 8, in the first pushing step S2, the user can push the connecting rod 51 of the pushing mechanism 5 to move the pushing plate 52 in the pushing direction P. During the movement of the pushing plate 52 in the pushing direction P, it will penetrate into the first opening 62 of the first carrier 6, and then the pushing plate 52 will push the even position of the second receiving slots 71. The wafers 8 in the first accommodating grooves 61 that are aligned with each other are moved, and the wafers 8 are moved away from the first accommodating grooves 61 and guided by the corresponding guiding grooves 322 of the mounting jig 32. And moving to the corresponding second receiving slot 71. After each wafer 8 is moved to the corresponding second receiving groove 71, the user can move the pushing mechanism 5 in a reset direction D opposite to the pushing direction P by pulling the connecting rod 51 of the pushing mechanism 5 by hand. To an initial position as shown in FIG.

Referring to FIGS. 6 and 9, in the replacing step S3, the empty first carrier 6 is moved away from the first carrier 41.

In the height adjustment step S4, the first carrier plate 41 is first moved away from the positioning slot 23 of the first positioning frame 2, and then the second carrier plate 42 is mounted on the second carrier plate 42. In the positioning groove 23, the first carrier 6 of the other fully loaded wafer 8 is then mounted on the second carrier plate 42 of the height adjusting mechanism 4. The first carrier 6 of the other fully loaded wafer 8 can be adjusted to the second height position by replacing the first carrier plate 41 with the second carrier plate 42 so that the other first carrier 6 is The first accommodating slots 61 and the other accommodating slots of the second accommodating slots 71 are aligned with each other. In this embodiment, all the accommodating slots of the first accommodating slots 61 are The odd-numbered position receiving grooves in the second accommodating grooves 71 are aligned with each other.

Referring to FIG. 5, FIG. 6, and FIG. 10, in the second pushing step S5, the user can push the pushing rod 52 of the pushing mechanism 5 in the pushing direction P by pushing the connecting rod 51 of the pushing mechanism 5. When the pushing plate 52 moves in the pushing direction P, it will penetrate into the first opening 62 of the first carrier 6, and then the pushing plate 52 will push and the odd position in the second receiving slots 71. The wafers 8 in the first accommodating grooves 61 in which the second accommodating grooves 71 are aligned with each other are moved to move the wafers 8 away from the first accommodating grooves 61 and by the corresponding guides of the mounting fixtures 32. The guiding groove 322 is guided to move into the corresponding second receiving groove 71. This completes the step of converting the wafer 8 from two 25-piece Teflon wafer cassettes to a 50-piece quartz wafer boat.

Referring to FIG. 11 and FIG. 12, the second embodiment of the wafer conversion device of the present invention can be placed on a first carrier 6' and a second carrier 7'. The first carrier 6' is formed with a plurality of upper and lower phases. a first accommodating groove 61' (shown in FIG. 18), a first opening 62' at the front end, and a second opening 63' at the rear end opposite to the first opening 62', each of which The first receiving groove 61 ′ is for accommodating a wafer 8 . The second carrier 7' is formed on a plurality of The second accommodating groove 71' is arranged at a lower interval, and the number of the first accommodating grooves 61' is different from the number of the second accommodating grooves 71'. The wafer conversion device 200 of the second embodiment comprises a base 1', a first positioning frame 2', a second positioning frame 3', a height adjusting mechanism 4', and a pushing mechanism 5'. In this embodiment, the first carrier 6' is a quartz crystal boat, and the second carrier 7' is a Teflon wafer cassette. The number of the first receiving slots 61' is an even number. The number of the first accommodating grooves 61' is twice the number of the second accommodating grooves 71', and the number of the first accommodating grooves 61' is 50. For example, the number of the second accommodating slots 71' is 25, but not limited thereto.

The base 1' includes a vertical wall 11'. The first positioning frame 2' includes a front end 23', a rear end 24' opposite to the front end 23', a first rail 21' fixed to the vertical wall 11', a fixed to the vertical wall 11' and spaced apart from the first rail The second guide rail 22' on the rear side of 21', and a locking plate 25' fixed to the first rail 21' and the second rail 22'. The first rail 21' and the second rail 22' are respectively elongated and extend in an up and down direction D1. The second positioning frame 3' is disposed on the vertical wall 11' and located at the rear end 24' of the first positioning frame 2' for carrying and positioning the second carrier 7'.

Referring to FIG. 11, FIG. 12 and FIG. 13, the height adjustment mechanism 4' is disposed on the first positioning frame 2' for carrying the first carrier 6' and adjusting the first carrier 6' from a first height position to A second height position that is higher than the first height position. The height adjusting mechanism 4' includes a sliding frame 41' slidably coupled to the first positioning frame 2' and capable of carrying the first carrier 6', and is disposed on the first positioning frame 2' and associated with the sliding frame 41' Connected rotating assembly 42', And a mounting fixture 43' disposed on the carriage 41'. The carriage 41' includes a vertical plate 44' slidably coupled between the first rail 21' and the second rail 22' of the first positioning bracket 2', and a bearing disposed on the vertical plate 44' and perpendicular thereto Board 45'. The vertical plate 44' is formed with a card slot 441' and has a surrounding surface 442' defining a card slot 441'. The surrounding surface 442' has a lower side portion 442b' and an upper side portion 442a'. The carrier plate 45' is for carrying the mounting fixture 43' and the first carrier 6'. The rotating assembly 42' can drive the first carrier 6' to move between the first height position and the second height position in the up and down direction D1 through the carriage 41'. The mounting fixture 43' includes two left and right spaced side walls 431', and each side wall 431' is formed with a plurality of guiding grooves 432' spaced apart from each other (as shown in FIG. 18), and the first carrier 6' is joined to The mounting fixture 43' is disposed on the front side of the two side walls 431'. The first receiving slots 61' are respectively aligned with the guiding slots 432', and the guiding slots 432' are used to guide the corresponding wafers 8 to move. And corresponding to the second accommodating groove 71'. In this embodiment, the number of the guiding slots 432' is the same as the number of the first receiving slots 61', which are all 50, but not limited thereto, as long as the number is the same.

Referring to FIG. 13 to FIG. 15, the rotating assembly 42' is further described herein, which has a rotating shaft 46', a knob 47' that is engaged with one end of the rotating shaft 46' for rotation, and a fixed connection to the rotating shaft 46'. An eccentric shaft 48' at one end and a set of bearings 49' disposed on the eccentric shaft 48'. The rotating shaft 46' is rotatably pivotally connected to the pivot hole 251' of the locking plate 25'. The knob 47' is recessed to define an indication groove 471' for indicating the height position of the height adjustment mechanism 4'. The central axes L1, L2 of the rotating shaft 46' and the eccentric shaft 48' are parallel and spaced apart from each other, and the eccentric shaft 48' includes a shaft member 481' and a shaft member 481' for fixing the shaft member 481' Pin 482' of shaft 46'. The bearing 49' is sleeved on the shaft 481' of the eccentric shaft 48', and the bearing 49' is disposed in the slot 441' of the vertical plate 44' and is respectively engaged with the lower side portion 442b' and the upper side portion 442a' .

Referring to FIG. 11, FIG. 16, and FIG. 17, the pushing mechanism 5' is slidably disposed on the vertical wall 11' of the base 1' and located at the front end 23' of the first positioning frame 2', and is movable from front to back. The pushing direction P is moved to align the wafers 8 in the first accommodating grooves 61 ′ that are aligned with the second accommodating grooves 71 ′ from the first accommodating grooves 61 ′. Pushed into the second receiving slots 71'. The pushing mechanism 5' includes a connecting rod 50' slidably coupled to the standing wall 11', a plurality of thimbles 51' disposed on the connecting rod 50' spaced apart from each other, and a thimble guiding plate 52'. Each of the ejector pins 51 ′ is used to push the corresponding wafer 8 , and the end surface of each of the ejector pins 51 ′ is recessed to form a groove 511 ′, and the groove 511 ′ extends between the left and right ends of the ejector pin 51 ′, and the groove The longitudinal section of the 511' is V-shaped with an opening facing backward. This structure is designed to clamp the wafer 8 during the pushing process and is not easy to shake to generate up and down displacement, ensuring smooth pushing process and preventing the wafer 8 from being in the process. rupture. The ejector guide plate 52' is disposed on the vertical wall 11' of the base 1' and has a plurality of through holes 521' identical to the ejector pins 51' for the thimbles 51' to be set. In the present embodiment, the number of the ejector pins 51' and the through holes 521' is 25, but not limited thereto.

Referring to Figures 18 and 19, the height adjustment mechanism 4' changes the height position by operating the knob 47'. When the indication groove 471' of the knob 47' is directed to the rear side, and the central axis L1 of the eccentric shaft 48' is lower than the central axis L2 of the rotation shaft 46', the carriage 41' will mount the jig 43' and the first carrier 6 'Support at the first height position. At this time, the first receiving slots 61' of the first carrier 6' The odd-numbered position accommodating grooves are respectively aligned with the accommodating groove positions of the ejector pins 51' and the second accommodating grooves 71' of the second carrier 7'. Referring to FIG. 20 and FIG. 21, the operation knob 47' is rotated 180 degrees clockwise to point the indication slot 471' to the front side, and the knob 47' rotates the rotation shaft 46' to drive the eccentric shaft 48' to rotate 180 degrees, so that the eccentric shaft 48' The central axis L1 is higher than the central axis L2 of the rotating shaft 46', thereby displacing the bearing 49' upward and simultaneously moving the vertical plate 44' and the carrying plate 45' upward, so that the first carrier 6' reaches the second height position. In the second height position, the even position accommodating grooves in the first accommodating grooves 61 ′ and the ejector pins 51 ′ and the second accommodating grooves 71 ′ of the second carrier 7 ′ are respectively The groove positions are aligned with each other.

Referring to FIG. 22, the wafer conversion method of the wafer conversion device 200 of the present embodiment is adapted to transfer the wafer carried by the first carrier 6' to a second carrier 7'. The conversion method includes the following Step: a mounting step S1', a first push step S2', a replacement step S3', a height adjustment step S4', and a second push step S5'.

Referring to FIGS. 18 and 22, in the mounting step S1', the first carrier 6' is first joined to the mounting fixture 43', and the mounting fixture 43' is attached to the carriage 41' of the height adjustment mechanism 4'. The carrier plate 45' is mounted, and the second carrier 7' is mounted on the second positioning frame 3'. At this time, the first carrier 6 ′ is located at the first height position, and a part of the first accommodating slots 61 ′ and the second accommodating slots 71 ′ of the first accommodating slots 61 ′ are aligned with each other. In the embodiment, the odd-numbered position accommodating grooves in the first accommodating grooves 61 ′ and the entire accommodating grooves of the second accommodating grooves 71 ′ and the positions of the ejector pins 51 ′ are aligned with each other.

Referring to FIG. 22 and FIG. 23, in the first pushing step S2', The user can move the ejector pins 51' in the pushing direction P by pushing the connecting rod 50' of the pushing mechanism 5' by hand. During the movement of the ejector pin 51' in the pushing direction P, it will penetrate into the first opening 62' of the first carrier 6', and then the ejector pin 51' will be pushed and aligned with the second accommodating groove 71'. The wafers 8 in the odd-numbered position accommodating grooves of the first accommodating grooves 61' are moved to move the wafers 8 away from the first accommodating grooves 61' and by the corresponding guides of the mounting fixtures 43' The guiding groove 432' is guided to move into the corresponding second receiving groove 71'. After each wafer 8 is moved to the corresponding second receiving groove 71', the user can pull the pushing rod 5' of the pushing mechanism 5' to move the pushing mechanism 5' in a direction opposite to the pushing direction P. The reset direction D moves to the initial position shown in FIG.

Referring to FIG. 20 and FIG. 22, in the replacing step S3', the second carrier 7' of the fully loaded wafer 8 is moved away from the second positioning frame 3', and the other empty second carrier 7' is mounted on the second Two positioning frame 3'.

In the height adjustment step S4', the vertical plate 44' of the carriage 41' and the carrier plate 45' are displaced upward by the rotation knob 47', so that the first carrier 6' can be adjusted to a height higher than the first height position. The second height position of the first accommodating groove 61 ′ of the other first accommodating groove 61 ′ and the second accommodating groove 71 ′ of the second vacant second carrier 7 ′ In this embodiment, the even-numbered position-receiving grooves in the first accommodating grooves 61' and the accommodating grooves of the second accommodating grooves 71' and the positions of the ejector pins 51' are aligned with each other.

Referring to FIGS. 22 and 24, in the second pushing step S5', the user can move the ejector pins 51' in the pushing direction P by pushing the connecting rod 50' of the pushing mechanism 5' by hand. During the movement of the ejector pin 51' in the pushing direction P Will penetrate into the first opening 62' of the first carrier 6', and then the ejector pin 51' will push into the first accommodating grooves 61' which are aligned with the second accommodating grooves 71'. The wafers 8 are moved to move the wafers 8 away from the first accommodating grooves 61 ′ and are moved to the corresponding second accommodating grooves 71 ′ by guiding the corresponding guiding grooves 432 ′ of the mounting fixtures 43 ′. Inside. This completes the step of converting the wafer 8 from a 50-piece quartz wafer boat to two 25-piece Teflon wafer cassettes.

It should be noted that the second embodiment of the wafer conversion device of the present invention only needs to modify the design slightly, and the thrust mechanism 5' is mirror-mounted on the second carrier 7 with reference to the second carrier 7'. The rear side of the 'the push mechanism 5' can push the wafer 8 in the second carrier 7' into the first carrier 6' to reach the first embodiment of the wafer conversion device of the present invention. The effect can be achieved by converting the wafer 8 from a 25-piece Teflon wafer cassette to a 50-piece quartz wafer boat.

It should be noted that the background of the invention of the wafer conversion device of the present invention is that because there is a sintering station process in the semiconductor process, the wafer is transported by a 25-piece Teflon wafer cassette before the process, but The wafer must be transferred to a quartz crystal boat before the sintering process to continue the sintering process. In order to increase the productivity of the sintering station, the capacity of the quartz crystal boat is designed to be 50 pieces. Therefore, by the wafer conversion method of the present invention of the wafer conversion device 100 of the first embodiment of the present invention, the wafer is transferred from the Teflon wafer cassette to the quartz wafer boat through steps S1 to S5. After the sintering process is completed, the wafer conversion method of the wafer conversion device 200 according to the second embodiment of the present invention is used to convert the wafer from the quartz wafer boat to the Teflon wafer cassette through steps S1' to S5'. The wafer can be carried through the Teflon wafer cassette for subsequent processing. therefore The wafer conversion device of the present invention enables the wafer to be converted between different capacity carriers, thereby improving the productivity of the overall process. In addition, it should be added that the height difference between the first height position and the second height position is only the height of one slot of the quartz crystal boat, so the height adjustment mechanism only needs to control the first carrier to change between the height differences. It does not require a large amount of institutional space to streamline the design of the overall unit. Furthermore, the height adjustment mechanism can move the first carrier to move the first height position to the second height position by moving the short movement of the first carrier, thereby enabling the operator to quickly adjust the height of the first carrier. In order to shorten the operating hours and improve the efficiency of the operation.

In summary, the first carrier 6, 6' is moved through the height adjusting mechanism 4, 4' to move at the first height position and the second height position respectively, and the wafer 8 is pushed by the pushing mechanism 5, 5' The first carrier 6, 6' is pushed from the first carrier 6, 6' into the second carrier 7, 7', so that the first carrier 6, 6' and the second carrier 7, 7' of different capacities can be achieved. The purpose of converting the wafer 8 in turn can further improve the productivity of the overall process, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.

1'‧‧‧Base

11'‧‧‧立立

2'‧‧‧First positioning frame

21'‧‧‧First rail

22'‧‧‧Second rail

23'‧‧‧ front end

24'‧‧‧ Backend

25'‧‧‧Locking plate

3'‧‧‧Second positioning frame

4'‧‧‧ Height adjustment mechanism

41'‧‧‧Slide

42'‧‧‧Rotating components

43'‧‧‧Installation fixture

431'‧‧‧ side wall

44'‧‧‧ 立板

45'‧‧‧Bearing board

5'‧‧‧ Pushing mechanism

50'‧‧‧ Connecting rod

51'‧‧‧ thimble

52'‧‧‧Tedal guide plate

521'‧‧‧Perforation

6'‧‧‧First carrier

62'‧‧‧First opening

63'‧‧‧ second opening

7'‧‧‧Second carrier

P‧‧‧Pushing direction

D‧‧‧Reset direction

D1‧‧‧Up and down direction

Claims (15)

A wafer conversion device is disposed for a first carrier and a second carrier. The first carrier is formed with a plurality of first accommodating grooves arranged at an upper and lower intervals, and each of the first accommodating grooves is used for Having a wafer, the second carrier is formed with a plurality of second accommodating grooves spaced apart from each other. The number of the first accommodating grooves is different from the number of the second accommodating grooves. The conversion device includes: a base; a first positioning frame disposed on the base, the first positioning frame includes a front end, and a rear end opposite to the front end; a second positioning frame disposed on the base And the second positioning frame is configured to carry and position the second carrier; a height adjusting mechanism is disposed on the first positioning frame, and the height adjusting mechanism is configured to carry the first a carrier and the first carrier can be adjusted from a first height position to a second height position higher than the first height position, when the first carrier is at the first height position, All of the first accommodating groove and one of the second accommodating grooves Aligning with a part of the accommodating groove of the other one, when the first carrier is at the second height position, the first accommodating groove and the accommodating groove of one of the second accommodating grooves And another portion of the other of the receiving groove positions are aligned with each other; and a pushing mechanism is slidably disposed on the base and located at the front end of the first positioning frame, the pushing mechanism can be along a front-to-back Pusher And moving the wafers in the first accommodating slots aligned with the second accommodating slots to be pushed from the first accommodating slots into the second accommodating slots . The wafer conversion device of claim 1, wherein the height adjustment mechanism comprises a first carrier plate and a second carrier plate, the height of the first carrier plate being smaller than the height of the second carrier plate, the first One of the carrier plate and the second carrier plate is selectively disposed on the first positioning frame, and the first carrier plate can carry the first carrier to be located at the first height position, the second carrier plate The first carrier can be carried at the second height position. The wafer conversion device of claim 2, wherein the first positioning frame comprises a positioning plate, two limiting plates protruding from the surface of the positioning plate and spaced apart from each other, and a limiting plate and The positioning plate defines a positioning slot, and one of the first carrier board and the second carrier board is selectively latched in the positioning slot. The wafer conversion device of claim 2, wherein the second positioning frame comprises a carrier disposed on the base, and a mounting fixture, the surface of the carrier is recessed to form a placement slot, and the mounting The mounting fixture includes two left and right spaced side walls, each of the side walls is formed with a plurality of guiding grooves spaced apart from each other, the second carrier is engaged with the mounting fixture And the second receiving slots are respectively aligned with the guiding slots, and the guiding slots are configured to guide the corresponding wafers to move into the corresponding second receiving slots. The wafer conversion device of claim 4, wherein the carrier comprises a substrate having the placement groove, and a blocking plate protruding from the rear end of the substrate for blocking the second carrier. The wafer conversion device of claim 1, wherein the base includes a vertical wall, the first positioning frame and the second positioning frame are disposed on the vertical wall, and the height adjustment mechanism includes a first slidably coupled to the first a positioning frame and a sliding frame of the first carrier, and a rotating component disposed on the first positioning frame and connected to the sliding frame, the rotating component can drive the first through the sliding frame in an up and down direction The carrier moves between the first height position and the second height position. The wafer conversion device of claim 6, wherein the pushing mechanism comprises a thimble guiding plate and a plurality of thimbles, each ejector pin for pushing the corresponding wafer, and each of the ejector pin ends is recessed a groove extending between the left and right ends of the thimble, and the longitudinal section of the groove is open-shaped V-shaped, the ejector guide plate is disposed on the pedestal, and has a plurality of The same puncturing of the thimble is provided for the thimble to pass through the set position. The wafer conversion device of claim 7, wherein the carriage comprises a vertical plate slidably coupled to the first positioning frame, the vertical plate is formed with a card slot, and the vertical plate has a defined slot The surrounding surface has a lower side portion and an upper side portion, and the rotating assembly includes a rotating shaft pivotally connected to the first positioning frame, a knob disposed at one end of the rotating shaft for rotating, and a fixed connection An eccentric shaft at the other end of the rotating shaft, and a set of bearings disposed on the eccentric shaft, the central axis of the rotating shaft and the eccentric shaft are parallel and spaced apart from each other, and the bearing is inserted in the card slot and respectively The card is coupled to the lower side portion and the upper side portion. The wafer converting apparatus of claim 8, wherein the eccentric shaft comprises a shaft member, and a latch for fixing the shaft member to the rotating shaft. The wafer conversion device of claim 9, wherein the carriage further comprises a carrier plate disposed on the vertical plate and perpendicular thereto, the height adjustment mechanism further comprising a mounting fixture disposed on the carrier plate. The mounting fixture includes two left and right spaced sidewalls, each of the sidewalls is formed with a plurality of guiding slots spaced apart from each other, the first carrier is coupled to the mounting fixture and located on the front side of the sidewalls, the first A receiving slot is respectively aligned with the guiding slots, and each of the guiding slots is configured to guide the corresponding wafer to move into the corresponding second receiving slot. The wafer conversion device of claim 6, wherein the first positioning frame comprises a first rail fixed to the vertical wall, and a second rail fixed to the vertical wall and spaced apart from a rear side of the first rail. The first rail and the second rail are respectively elongated and have a longitudinal direction parallel to the vertical direction. The vertical plate is disposed between the first rail and the second rail, and the vertical panel and the first rail are respectively The second rail abuts. A wafer conversion method for a wafer conversion device is adapted to transfer a wafer carried by a first carrier to a second carrier, wherein the first carrier is formed with a plurality of first and lower intervals Each of the first receiving slots is configured to receive a wafer, and the second carrier is formed with a plurality of second receiving slots spaced apart from each other. The number of the first receiving slots is smaller than the number of the first receiving slots. And the number of the second accommodating slots, the method includes the following steps: the installation step, respectively, the first carrier and the second carrier are respectively The first accommodating groove is located at a first height position, and the first accommodating groove is aligned with a part of the accommodating groove of the second accommodating groove; a pushing step of pushing the wafers in the first receiving slots aligned with the positions of the second receiving slots by the pushing mechanism to the first receiving slots to the first a second receiving slot; a replacement step of moving the empty first carrier away from the height adjusting mechanism; and a height adjusting step of mounting another first carrier carrying the wafer to the height adjusting mechanism, through the height Adjusting mechanism adjusts the other first carrier to a second height position higher than the first height position, so that the first receiving slots of the other first carrier and the second receiving The other part of the groove is aligned with each other; and the second pushing step is to push the first volume of the other of the second receiving grooves by the pushing mechanism Locating the wafers in the trenches to accommodate the wafers by the first ones Such a second push to the receiving groove. The wafer conversion method of the wafer conversion device of claim 12, wherein the number of the first accommodating slots is one-half of the number of the second accommodating slots, and the number of the second accommodating slots In the mounting step, the first accommodating slots are respectively aligned with the second accommodating slots at the even positions. In the height adjusting step, the first accommodating slots are The second accommodating slots positioned at odd positions are aligned with each other. A wafer conversion method for a wafer conversion device, suitable for a first carrier The wafer carried by the rack is transferred to a second carrier. The first carrier is formed with a plurality of first accommodating slots arranged at intervals. Each of the first accommodating slots is for accommodating a wafer. The second carrier is formed with a plurality of second accommodating slots spaced apart from each other. The number of the first accommodating slots is greater than the number of the second accommodating slots. The method includes the following steps: a mounting step, The first carrier and the second carrier are respectively mounted on a height adjusting mechanism and a positioning frame, so that the first carrier is located at a first height position, and a part of the first receiving slots is received. Aligning with the second accommodating groove positions; the first ejector step, the wafers in the first accommodating grooves aligned with the second accommodating groove positions through a pushing mechanism Pushing the first receiving slots into the second receiving slots; the replacing step moves the second carrier of the fully loaded wafer away from the second positioning frame, and the other empty second bearing The rack is mounted on the second positioning frame; the height adjustment step is adopted by the height adjusting mechanism Adjusting the first carrier to a second height position that is higher than the first height position, such that the other portion of the first receiving slots accommodates the slot and the other empty second carrier The second accommodating groove positions are aligned with each other; and the second ejector step is, by the urging mechanism, pushing the other part of the accommodating grooves of the first accommodating grooves which are aligned with the second accommodating groove positions The wafers are pushed into the second accommodating grooves by the first accommodating grooves. A wafer conversion method of a wafer conversion device according to claim 14, wherein The number of the first accommodating slots is twice the number of the second accommodating slots, and the number of the first accommodating slots is an even number. In the installing step, the second accommodating slots are respectively The first accommodating slots in the even position are aligned with each other. In the height adjusting step, the second accommodating slots are respectively aligned with the first accommodating slots positioned at odd positions.