TWM491548U - Automatic feeding device of grinding equipment - Google Patents

Description

Automatic feeding device for grinding equipment

The present invention relates to an automatic feeding device, and more particularly to an automatic feeding device for a grinding device that automatically sends a wafer to a grinding device for grinding.

Generally, in the manufacturing process, the surface of the wafer needs to be polished and polished to improve the flatness of the surface, and the wafer grinding device is a processing machine specially used for grinding the surface of the wafer. In order to facilitate the aforementioned processing steps, the wafers are typically placed in groups on a carrier that surrounds a center of rotation of the carrier. When one of the polishing devices rotates the carrier to rotate the carrier, it is possible to perform grinding processing for each wafer on the carrier.

However, in view of the fact that the general wafer is subjected to the grinding process, the steps of feeding and discharging are manually carried out, and not only the process cannot be consistent, but also a high labor cost is required in the grinding operation.

The purpose of the present invention is to provide an automatic feeding device for a grinding apparatus that can automatically feed to reduce labor costs.

The novel automatic feeding device is used to transfer a wafer carrier Unit, the wafer carrier unit includes a carrier, and a plurality of processing components mounted in the carrier and having at least one wafer, and the feeding device can transfer the processing components to a grinding device for grinding Processing, and comprising: a frame, and an angle adjustment mechanism mounted on the frame, a loading mechanism, a feeding mechanism, and a transfer mechanism. The angle adjusting mechanism includes a carrier for receiving the processing assembly, a lifting cylinder for driving the carrier to lift, a rotating disk, and an adjusting rotating member for driving the rotating disk, the bearing has a a rotating disk extending to support the perforation of the workpiece, and the loading mechanism includes a bracket for transferring the processing component stored in the carrier to the rotating disk and the carrier, the feeding mechanism The processing assembly located on the carrier is transferred to the polishing apparatus, and the transfer mechanism is configured to transfer the wafer carrier unit adjacent to the carrier mechanism to facilitate the carrier to transfer the processing components.

The beneficial effect of the present invention is that the cooperation of the above-mentioned mechanism can transfer the wafer which is ready to be polished to the angle adjustment mechanism for angle adjustment, and then consistently transfer it to the grinding device for grinding processing, thereby achieving automation. Feeding and discharging, as well as reducing labor costs during grinding.

10‧‧‧Automatic feeding device

11‧‧‧ wafer carrier unit

111‧‧‧ carrying case

112‧‧‧Processing components

113‧‧‧ box bottom wall

114‧‧‧ bottom groove

115‧‧‧Package

116‧‧‧ wafer

12‧‧‧ grinding device

13‧‧‧First direction

14‧‧‧second direction

2‧‧‧Rack

21‧‧‧Chassis

211‧‧‧Open side

212‧‧‧feed side

213‧‧‧ Feed inlet

22‧‧‧Upper substrate

221‧‧ ‧ guide slot

222‧‧‧ slotting

23‧‧‧ Lower substrate

24‧‧‧First Board

25‧‧‧Second board

26‧‧‧ Feeding plate

3‧‧‧Transfer organization

31‧‧‧First lifting unit

31’‧‧‧Second Lifting Unit

311‧‧‧ lifting track

312‧‧‧ Lifting seat

313‧‧‧ Lifting power source

314‧‧‧ bottom wall

315‧‧‧ Missing slot

33‧‧‧First translation unit

332‧‧‧First translation cylinder

333‧‧‧Mobile rack

334‧‧‧First pull piece

336‧‧‧ sloped surface

337‧‧‧Pushing surface

34‧‧‧Second translation unit

341‧‧‧First hanger

342‧‧‧Feed push frame

343‧‧‧Second translation cylinder

35‧‧‧ third translation unit

351‧‧‧Second hanger

352‧‧‧Feeding push frame

353‧‧‧third translation cylinder

36‧‧‧4th translation unit

361‧‧‧4th translation cylinder

362‧‧‧ Pulling frame

363‧‧‧Second pull piece

364‧‧‧Sloping surface

365‧‧‧Pushing surface

4‧‧‧ Angle adjustment mechanism

41‧‧‧Fixed hanger

42‧‧‧lifting cylinder

43‧‧‧ lifting hanger

44‧‧‧ bearing seat

441‧‧‧Perforation

45‧‧‧Adjust rotating parts

451‧‧‧ shaft

46‧‧‧ rotating disk

5‧‧‧Transfer agency

51‧‧‧ holding cylinder

52‧‧‧ bracket

521‧‧‧ fork

6‧‧‧Feeding agency

61‧‧‧ suspended pedestal

62‧‧‧ protruding station

63‧‧‧ Feed power source

64‧‧‧lifting platform

65‧‧‧feeding cylinder

66‧‧‧Clamping parts

661‧‧‧Clamping cylinder

662‧‧‧claw

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a front view of an embodiment of the present invention, illustrating the feeding device and The relative relationship between the grinding device and the plurality of wafer loading units; Figure 2 is a front perspective view of the embodiment, omitting one of the feeding devices; Figure 3 is a rear perspective view of the embodiment, and the chassis is omitted; Figure 4 is a partial perspective view of the embodiment, mainly One of the first translation unit and the second translation unit of the feeding device is illustrated; FIG. 5 is a partial bottom perspective view of the embodiment, mainly illustrating a third translation unit and a fourth translation unit of the feeding device; 6 is a partial cross-sectional view of the embodiment, illustrating the fourth translation unit; FIG. 7 is another partial perspective view of the embodiment, illustrating an angle adjustment mechanism and a movement mechanism of the feeding device; FIG. 8 is the implementation Another partial cross-sectional view of the example also illustrates the relative relationship between the angle adjusting mechanism and the loading mechanism; FIG. 9 is a partial rear view of the preferred embodiment, separately illustrating a feeding mechanism of the feeding device, in the figure The feed mechanism is in a starting position; and Figure 10 is a view similar to Figure 9 in which the feed mechanism is in a feed position.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to Figures 1, 2, and 3, an embodiment of the present automatic feeding device 10 can drive a plurality of wafer loading units 11 to move, and is adjacent to one of the grinding devices 12, each wafer loading unit 11 Including one a carrying case 111, and a plurality of processing components 112 vertically and horizontally interposed in the carrying case 111, the carrying case 111 has a bottom wall 113 having a plurality of parallel spaced bottom grooves 114, each processing The assembly 112 has a carrier 115, and a plurality of wafers 116 disposed on the carrier 115 and surrounding a center of rotation of the carrier 115. In the following description, the front finger has the feeding device 10. One side, that is, the grinding device 12 is located behind the feeding device 10.

In this embodiment, the automatic feeding device 10 can transfer the wafer loading units 11 to advance along a feeding direction and a discharging direction, and transfer the processing components 112 of the wafer loading units 11 one by one to the same. The grinding device 12 performs a grinding process, and the feeding device 10 includes: a frame 2, and a transfer mechanism 3 installed inside one of the chassis 21 of the frame 2, an angle adjusting mechanism 4, a loading mechanism 5, and a Feed mechanism 6.

The rack 2 further includes a horizontally disposed upper substrate 22 mounted inside the chassis 21, a lower substrate 23 mounted inside the chassis 21 and parallel to the upper substrate 22, and a piece erected adjacent to the polishing device 12 a vertical plate 24, and a second vertical plate 25 standing upright and adjacent to the front right side, the chassis 21 having an open side 211 at the rear, and a feed side 212 at the front, the feed side 212 having a feed The upper substrate 22 has two adjacent front guiding grooves 221 and a rear adjacent opening groove 222 extending along a first direction 13. Further, the frame 2 further includes a feed plate 26 connected to the lower substrate 23 and protruding from the feed port 213.

Referring to Figures 3, 4 and 5, the transfer mechanism 3 of the present embodiment includes a a first lifting unit 31 mounted on the first vertical plate 24, a second lifting unit 31' mounted on the second vertical plate 25, and a first translation mounted on the upper substrate 22 adjacent to the front side a unit 33, a second translating unit 34 mounted on the upper substrate 22 and disposed in the front-rear direction, a third translating unit 35 disposed on the lower substrate 23 and directly below the first translating unit 33, and a setting A fourth translating unit 36 is located on the lower substrate 23 and directly below the third translating unit 35.

The first lifting unit 31 and the second lifting unit 31' have the same structure, and both have two upright parallel lifting rails 311, a lifting seat 312 movably mounted between the lifting rails 311, and a driving unit. The lifting power source 313 for lifting and lowering the lifting base 312 is in the form of a motor-fit chain in the embodiment. Since the lifting and lowering of the lifting base 312 by the motor and the chain is a general mechanical design, it will not be described in detail. Further, the lifting base 312 of the first lifting unit 31 has a bottom wall 314 having two notches 315 extending along a second direction 14 and opening toward the front, the second direction 14 being parallel to The first direction is 13.

The first translation unit 33 has a first translation cylinder 332 mounted on the bottom surface of the upper substrate 22, and a moving frame 333 driven by the first translation cylinder 332 to reciprocate along the first direction 13, and The first pulling member 334 is elastically pivotally mounted on the moving frame 333. The first pulling members 334 are respectively protruded from the guiding holes 221 of the upper substrate 22 by spring struts. Each of the first pulling members 334 has an inclined surface 336 and a blocking surface 337. The blocking surface 337 can abut against the rear side of the wafer loading unit 11 to push the wafer loading units 11 By the first The second lifting unit 31' moves toward one side of the second translation unit 34.

The second translating unit 34 has a first hanger 341 suspended inside the casing 21, a feeding pusher 342 movably mounted below the first hanger 341, and a drive for pushing the feed. The second translation cylinder 343 of the frame 342 moves along the second direction 14. The third translating unit 35 is similar in structure to the second translating unit 34 and has a second hanger 351 suspended below the upper substrate 22 and a discharge movably mounted below the second hanger 351. The push frame 352 and a third translation cylinder 353 that drives the discharge push frame 352 to move along the first direction 13.

Referring to Figures 3, 5 and 6, the fourth translation unit 36 is similar in structure to the first translation unit 33, and has a fourth translation cylinder 361 mounted on the bottom surface of the lower substrate 23, one of which is a pulling frame 362 driven by the cylinder shaft of the four translation cylinder 361 to reciprocate along the second direction 14, and two second pulling members 363 elastically resetably mounted on the pulling frame 362, the second The pulling members 363 respectively correspond to the notches 315 of the first lifting unit 31, and respectively have an inclined surface 364 facing the missing slots 315, and a blocking surface 365. The second pulling member 363 can extend into the bottom groove 114 of the carrying case 111 of the wafer loading unit 11 to borrow the same when the fourth translation cylinder 361 pulls the pulling frame 362 to move. The blocking surface 365 of the second pulling member 363 abuts against the bottom groove 114 of the wafer loading unit 11 to pull the wafer loading unit 11 located on the first lifting unit 31 to the third translation unit 35. .

Referring to Figures 3, 7, and 8, the angle adjusting mechanism 4 of the present embodiment includes a fixed hanger 41 mounted under the slot 222 of the upper substrate 22. a lifting and lowering cylinder 42 mounted under the fixed hanger 41, a lifting and lowering hanger 43 pushed up and down by the lifting and lowering cylinder 42 , and a carrier mounted above the lifting and lowering bracket 43 and above the upper substrate 22 44. An adjustment rotary member 45 mounted in the slot 222 of the upper substrate 22, and a rotary disk 46 driven by the adjustment rotary member 45 for micro-lifting and rotating. The carrier 44 has a rotary disk 46 for the rotary disk 46. An extended perforation 441, the adjustment rotary member 45 and a shaft 451 coupled in conjunction with the rotary disk 46.

The loading mechanism 5 is mounted on the substrate 22 above the frame 2, and can capture the processing component 112 located in the carrier 111, and includes a device disposed along the first direction 13 and mounted on the upper substrate a holding cylinder 51 on 22, and a bracket 52 driven by the holding cylinder 51 to reciprocate along the first direction 13, the bracket 52 having two disposed along the first direction 13 and a fork 521 that can move toward the first lifting unit 31. The fork 521 is located on the opposite side of the carrier 44, and can move the processing component 112 located on the first lifting unit 31 to the angle adjustment. The carrier 44 of the mechanism 4 and the rotating disk 46.

Referring to Figures 3, 9, and 10, the feeding mechanism 6 of the present embodiment can transfer the processing assembly 112 located on the carrier 44 to the grinding device 12 (see Fig. 1) for processing, and includes a mounting on the upper substrate. a suspended base 61 above the 22, a projecting platform 62 movably mounted on the suspended base 61, a feed power source 63 for driving the projecting table 62 to reciprocate along the second direction 14, and a feed source 63 a lifting platform 64 located below the protruding table 62, a feeding cylinder 65 mounted on the protruding table 62 and driving the lifting platform 64 to rise and lower, and a plurality of angles mounted on the lifting platform 64 at equal angles Clamping piece 66. Each of the clamping members 66 has a clamping cylinder 661 mounted on the lifting platform 64, and a driving cylinder 661 is driven between a clamping position and a non-clamping position. The jaw 662, that is, the aforementioned jaw 662, can be driven by the clamping cylinder 661 to move toward the radially outer end or to the radially inner end.

Referring to Figures 1, 2, and 3, in the present embodiment, when the feeding device is in use, the wafer loading unit 11 loaded with the wafers 116 is placed at the feeding plate 26 of the frame 2 and pushed to the feeding plate. The lifting base 312 of the second lifting unit 31' is driven by the lifting power source 313 of the second lifting unit 31', and the wafer loading unit 11 is raised to be equal to the upper substrate 22, and then the wafer is loaded. The unit 11 is pushed onto the upper substrate 22, and then the first pulling member 334 of the first translation unit 33 transfers the wafer carrier unit 11 to the second translation unit 34. When the wafer loading unit 11 corresponds to the feeding push frame 342 of the second translation unit 34, the wafer loading unit 11 is driven by the second translation unit 34, and the wafer loading unit 11 is moved backward along the second direction 14 to the first On the lifting base 312 of the lifting unit 31, at this time, the lifting base 312 of the first lifting unit 31 is gradually lowered by the driving of the lifting power source 313, so that each processing component 112 on the wafer loading unit 11 Gradually, the bracket 52 of the mechanism 5 is to be moved.

Referring to Figures 3, 7, and 8, when the carrier 52 of the carrier mechanism 5 is to be loaded out of the processing module 112 by the carrier 111, the rotating disk 46 and the carrier 44 will be as shown in FIG. The solid line is slightly lowered, and the bracket 52 is driven to move along the first direction 13 toward the first lifting unit 31, and the processing assembly 112 is carried by the carrier 111. One of them is returned to the vicinity of the opening 222 of the upper substrate 22. Then, the rotating disk 46 and the carrier 44 which are originally lowered will support the processing assembly 112, and the rotating disk 46 is slightly higher than the carrier 44 after being held. At this time, by sensing the sensing component (not shown) provided on the processing component 112 and the rotating disk 46, it can be sensed whether the positioning angle of the processing component 112 is correct, and rotated by the adjustment. The member 45 drives the rotating disk 46 to rotate to finely adjust the angle of the processing assembly 112 and facilitate subsequent processing.

Referring to Figures 3, 9, and 10, when the angle of the processing assembly 112 is correct, the feeding cylinder 65 of the feeding mechanism 6 will drive the lifting platform 64 to descend, and the jaws 662 will be the same. The driving cylinder 661 is moved toward the radially outer end and is located at the non-clamping position. When the bottom edge of the clamping jaws 662 passes over the bottom edge of the processing assembly 112, the clamping cylinders 661 are retracted. The jaws 662 are translated to the gripping position and thus the processing assembly 112 is clamped. When the feeding cylinder 65 drives the lifting platform 64 to rise, and the feeding power source 63 of the feeding mechanism 6 drives the protruding table 62 to move in the direction of the grinding device 12 (see FIG. 1), Grinding is performed.

The ground processing assembly 112 is again returned to the position of FIG. 3 and repositioned onto the carrier 44 of the angle adjustment mechanism 4, and then returned to the crystal by the carrier 52 of the loading mechanism 5. In the carrier 111 of the circular loading unit 11, by analogy, the processing components 112 located in the carrier 111 can be automatically transferred to the polishing apparatus 12 for polishing.

Referring to Figures 2, 3, and 5, when the wafer carrier unit 11 is added After the processing of the assembly 112 is completed, the lifting seat 312 of the first lifting unit 31 is moved to the lowest position, and the fourth translation unit 36 corresponding to the transfer mechanism 3, by the fourth translation unit 36 and the third The operation of the translating unit 35 can transfer the processed wafer loading unit 11 to the feeding plate 26, and thus achieve the purpose of automatic feeding and discharging consistency.

As can be seen from the above description, the automatic feeding device 10 of the present invention can continuously transfer the processing components 112 of the wafer loading units 11 one by one to the rotating disk 46 of the angle adjusting mechanism 4, waiting for the correction angle value. After being sent to the grinding device 12 for grinding by the feeding mechanism 6, and then returned to the automatic feeding device 10, the transfer of the third translation unit 35 and the fourth translation unit 36 is completed. Consistent feeding and discharging operations, the novel automatic feeding device 10 of the present invention not only has a novel structure, but also achieves the purpose of automatic feeding and discharging, and at the same time reduces the labor cost of the grinding process.

However, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made in accordance with the scope of the present patent application and the contents of the patent specification, All remain within the scope of this new patent.

10‧‧‧Automatic feeding device

11‧‧‧ wafer carrier unit

111‧‧‧ carrying case

112‧‧‧Processing components

113‧‧‧ box bottom wall

114‧‧‧ bottom groove

115‧‧‧Package

116‧‧‧ wafer

13‧‧‧First direction

14‧‧‧second direction

2‧‧‧Rack

22‧‧‧Upper substrate

222‧‧‧ slotting

23‧‧‧ Lower substrate

24‧‧‧First Board

25‧‧‧Second board

3‧‧‧Transfer organization

31‧‧‧First lifting unit

31’‧‧‧Second Lifting Unit

311‧‧‧ lifting track

312‧‧‧ Lifting seat

313‧‧‧ Lifting power source

314‧‧‧ bottom wall

315‧‧‧ Missing slot

34‧‧‧Second translation unit

4‧‧‧ Angle adjustment mechanism

41‧‧‧Fixed hanger

42‧‧‧lifting cylinder

43‧‧‧ lifting hanger

5‧‧‧Transfer agency

51‧‧‧ holding cylinder

52‧‧‧ bracket

6‧‧‧Feeding agency

61‧‧‧ suspended pedestal

62‧‧‧ protruding station

63‧‧‧ Feed power source

64‧‧‧lifting platform

65‧‧‧feeding cylinder

66‧‧‧Clamping parts

Claims (6)

An automatic feeding device for a grinding device for transferring a wafer carrier unit, the wafer carrier unit comprising a carrier, and a plurality of processing components mounted in the carrier and having at least one wafer, and the processing component The feeding device can transfer the processing components to a grinding device for grinding, and comprises: a frame; an angle adjusting mechanism mounted on the frame and including a carrier for receiving the processing component, a lifting cylinder for driving the carrier to lift, a rotating disk, and an adjusting rotating member for driving the rotating disk, the bearing seat has a through hole for the rotating disk to protrude to support the processing component; a mechanism mounted on the frame, including a bracket from which the processing assembly can be removed from the carrier and the processing assembly is transferred to the rotating disk and the carrier; a feeding mechanism mounted on the frame And transferring the processing component located on the carrier to the grinding device; and a transfer mechanism mounted on the frame and transferring the wafer carrier unit to the vicinity Torr shift mechanism to facilitate the shifting mechanism of the carriage of the tray assembly taken out from the processing of the ballast tank. The automatic feeding device of the grinding apparatus according to claim 1, wherein the frame comprises an upper substrate having a slot for the adjusting rotating member, and the angle adjusting mechanism further comprises a hanging a fixed crane below the upper substrate and provided for the lifting and lowering cylinder And a lifting hanger driven by the lifting and lowering cylinder, wherein the carrier is located above the upper substrate and is mounted on the lifting hanger. The automatic feeding device of the grinding apparatus of claim 2, wherein the loading mechanism further comprises a holding cylinder that drives the carrier to reciprocate along a first direction, the bracket having two separate positions a fork on the opposite side of the carrier. The automatic feeding device of the grinding apparatus of claim 3, wherein the feeding mechanism comprises a suspended base frame mounted on the upper substrate, a protruding platform, and a protruding platform is mounted on the hanging base a feed power source protruding from the grinding device, a lifting platform, a feeding cylinder for arranging the lifting platform below the protruding table, and a plurality of loading cylinders mounted on the lifting platform The clamping member of the processing assembly can be clamped. The automatic feeding device of the grinding apparatus according to claim 4, wherein the clamping members each have a clamping cylinder mounted on the lifting platform, and a control cylinder is controlled by the clamping cylinder a clamping position between a pinch position and a non-clamping position. An automatic feeding device for a grinding apparatus according to claim 4, wherein the frame further comprises a lower substrate located below the upper substrate, and two spaced apart vertical plates, and the transfer mechanism comprises two separate mountings A lifting unit that can lift and lower the wafer carrier unit on the vertical board, and a plurality of translation units that drive the wafer carrier unit to translate.