CN217955838U - Automatic lifting and rotating device for wafer processing - Google Patents
Automatic lifting and rotating device for wafer processing Download PDFInfo
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Abstract
本实用新型公开了一种用于晶圆加工的自动升降及旋转装置,包括基座、输料机构、固定机构、升降旋转机构、加工机构及转运机构,所述基座顶部的凹槽内设置有载料台,所述载料台中部通孔内设置有转盘;所述固定机构包括呈环形安装在转盘上的第一气缸,所述第一气缸的活塞杆安装有L型夹块,所述L型夹块内安装有缓冲垫。本实用新型结构设计科学合理,通过设置配合使用的转盘、第一气缸、L型夹块等结构组成固定机构,可以在其配合下快速将通过传送带转运至载料台上的工件进行夹持固定,可以自动对工件的高度进行调节,同时在加工过程中可以根据需求调节固定机构的旋转角度,进而满足不同的加工需求。
The utility model discloses an automatic lifting and rotating device for wafer processing, which comprises a base, a feeding mechanism, a fixing mechanism, a lifting and rotating mechanism, a processing mechanism and a transfer mechanism. There is a loading platform, and a turntable is arranged in the through hole in the middle of the loading platform; the fixing mechanism includes a first air cylinder installed in a ring on the turntable, and the piston rod of the first air cylinder is equipped with an L-shaped clamping block. A buffer pad is installed in the L-shaped clamp block. The structure design of the utility model is scientific and reasonable, and the fixing mechanism is composed of the rotating disk, the first cylinder, the L-shaped clamping block and other structures used in conjunction with it, and can quickly clamp and fix the workpiece transferred to the loading table through the conveyor belt under its cooperation. , the height of the workpiece can be automatically adjusted, and at the same time, the rotation angle of the fixing mechanism can be adjusted according to the demand during the processing, so as to meet different processing requirements.
Description
技术领域technical field
本实用新型涉及晶圆加工设备技术领域,具体为一种用于晶圆加工的自动升降及旋转装置。The utility model relates to the technical field of wafer processing equipment, in particular to an automatic lifting and rotating device for wafer processing.
背景技术Background technique
晶圆是指制作硅半导体电路所用的硅晶片,硅晶棒在经过研磨,抛光,切片后,形成硅晶圆片,也就是晶圆。目前市面上的晶圆加工校位装置在应用的过程中存在以下问题:传统的晶圆加工校位装置在使用时多为工作人员自行进行调整,在操作时费时费力,工件的升降及旋转调节过程较为复杂,且在工件旋转时,由于缺少角度对比机构,导致工作人员无法准确调节旋转角度,因此具有一定的弊端。为此,我们提出一种用于晶圆加工的自动升降及旋转装置。Wafer refers to the silicon wafer used to make silicon semiconductor circuits. After the silicon crystal rod is ground, polished and sliced, it forms a silicon wafer, that is, a wafer. At present, the wafer processing alignment devices on the market have the following problems in the application process: the traditional wafer processing alignment devices are mostly adjusted by the staff when they are used, and the operation is time-consuming and laborious. The lifting and rotation adjustment of the workpiece The process is relatively complicated, and when the workpiece is rotating, due to the lack of an angle comparison mechanism, the staff cannot accurately adjust the rotation angle, so it has certain disadvantages. For this reason, we propose an automatic lifting and rotating device for wafer processing.
实用新型内容Utility model content
本实用新型的目的在于提供一种用于晶圆加工的自动升降及旋转装置,以解决上述背景技术中提出的问题。The purpose of this utility model is to provide an automatic lifting and rotating device for wafer processing, so as to solve the problems raised in the above-mentioned background technology.
为实现上述目的,本实用新型提供如下技术方案:一种用于晶圆加工的自动升降及旋转装置,包括基座、输料机构、固定机构、升降旋转机构、加工机构及转运机构,所述基座顶部的凹槽内设置有载料台,所述载料台中部通孔内设置有转盘;In order to achieve the above purpose, the utility model provides the following technical solutions: an automatic lifting and rotating device for wafer processing, including a base, a feeding mechanism, a fixing mechanism, a lifting and rotating mechanism, a processing mechanism and a transfer mechanism, the A loading platform is arranged in the groove on the top of the base, and a turntable is arranged in the through hole in the middle of the loading platform;
所述固定机构包括呈环形安装在转盘上的第一气缸,所述第一气缸的活塞杆安装有L型夹块,所述L型夹块内安装有缓冲垫;The fixing mechanism includes a first cylinder installed in a ring on the turntable, the piston rod of the first cylinder is equipped with an L-shaped clamp block, and a buffer pad is installed in the L-shaped clamp block;
所述升降旋转机构包括安装在转盘底部的第二气缸,所述第二气缸底部连接有旋转电机,所述旋转电机底部连接有通过定位架安装在基座底部的第三气缸。The lifting and rotating mechanism includes a second cylinder installed at the bottom of the turntable, the bottom of the second cylinder is connected with a rotating motor, and the bottom of the rotating motor is connected with a third cylinder installed at the bottom of the base through a positioning frame.
优选的,所述输料机构包括安装在防护罩内的传送带,所述传送带尾端设置有倾斜的导料板。Preferably, the feeding mechanism includes a conveyor belt installed in the protective cover, and an inclined material guide plate is provided at the tail end of the conveyor belt.
优选的,所述转盘中部设置有吸盘。Preferably, a suction cup is provided in the middle of the turntable.
优选的,所述加工机构包括安装在基座顶部的支撑架,所述支撑架侧面的滑轨内部滑动安装有移动杆,所述移动杆底部通过转接板安装有加工件,所述移动杆上部侧面连接第四气缸。Preferably, the processing mechanism includes a support frame installed on the top of the base, a moving rod is slidably installed inside the slide rail on the side of the support frame, and a processing part is installed at the bottom of the moving rod through an adapter plate, and the moving rod The upper side is connected with the fourth cylinder.
优选的,所述转运机构包括安装于支撑架内的第五气缸,所述第五气缸端部连接壳体,所述壳体侧面安装有固定夹块和移动夹块,所述移动夹块通过滑动块与安装在壳体内的第六气缸连接。Preferably, the transfer mechanism includes a fifth air cylinder installed in the support frame, the end of the fifth air cylinder is connected to the housing, and a fixed clamp block and a movable clamp block are installed on the side of the housing, and the movable clamp block passes through The sliding block is connected with the sixth cylinder installed in the housing.
优选的,所述载料台上侧沿圆心环形分布有刻度线。Preferably, the upper side of the loading table is annularly distributed with scale marks along the center of the circle.
与现有技术相比,本实用新型的有益效果是:Compared with the prior art, the beneficial effects of the utility model are:
1、该种用于晶圆加工的自动升降及旋转装置,结构设计简单合理,通过设置配合使用的转盘、第一气缸、L型夹块等结构组成固定机构,可以在其配合下快速将通过传送带转运至载料台上的工件进行夹持固定,且由于多个L型夹块对称布置,可以均匀有效地将晶圆工件夹持固定在转盘中心处,同时在吸盘的作用下可以将工件稳定吸附固定在转盘顶部,进一步提高了加工过程的稳定性;1. This kind of automatic lifting and rotating device for wafer processing has a simple and reasonable structural design. The fixed mechanism is composed of a turntable, the first cylinder, and an L-shaped clamping block for use in conjunction with it. With its cooperation, it can quickly move through The conveyor belt is transferred to the workpiece on the loading table for clamping and fixing, and due to the symmetrical arrangement of multiple L-shaped clamping blocks, the wafer workpiece can be clamped and fixed at the center of the turntable evenly and effectively, and the workpiece can be clamped under the action of the suction cup Stable adsorption is fixed on the top of the turntable, which further improves the stability of the processing process;
2、通过设置第二气缸、旋转电机和第三气缸配合使用,可以自动对工件的高度进行调节,同时在加工过程中可以根据需求调节固定机构的旋转角度,进而满足不同的加工需求;2. By setting the second cylinder, the rotating motor and the third cylinder together, the height of the workpiece can be automatically adjusted, and at the same time, the rotation angle of the fixing mechanism can be adjusted according to the demand during the processing, so as to meet different processing requirements;
3、通过设置第五气缸、壳体、固定夹块、移动夹块、滑动块和第六气缸等结构配合使用,可以在晶圆加工结束之后通过上述机构组成的转运机构对晶圆机构进行夹持并进行自动转运,保证了加工流程的顺畅性,进一步提高了加工效率。3. By setting the fifth cylinder, housing, fixed clamping block, moving clamping block, sliding block and sixth cylinder and other structures to cooperate with each other, the wafer mechanism can be clamped by the transfer mechanism composed of the above-mentioned mechanisms after the wafer processing is completed. Support and automatic transfer ensures the smoothness of the processing process and further improves the processing efficiency.
附图说明Description of drawings
图1为本实用新型结构示意图;Fig. 1 is the structural representation of the utility model;
图2为本实用新型转盘顶部结构示意图;Fig. 2 is a schematic diagram of the top structure of the utility model turntable;
图3为本实用新型L型夹块结构示意图;Fig. 3 is the structural schematic diagram of L-shaped clamping block of the utility model;
图4为本实用新型转运机构的结构示意图。Fig. 4 is a structural schematic diagram of the transfer mechanism of the present invention.
图中:1基座、11支撑柱、12防护罩、13传送带、14导料板、15载料台、16转盘、17吸盘、18第一气缸、19L型夹块、2缓冲垫、21第二气缸、22旋转电机、23第三气缸、24定位架、25支撑架、26滑轨、27移动杆、28转接板、29加工件、3第四气缸、31第五气缸、32壳体、33固定夹块、34移动夹块、35滑动块、36第六气缸、4刻度线。In the figure: 1 base, 11 support column, 12 protective cover, 13 conveyor belt, 14 material guide plate, 15 material loading platform, 16 turntable, 17 suction cup, 18 first cylinder, 19L type clamp block, 2 buffer pad, 21 first Two cylinders, 22 rotating motors, 23 third cylinders, 24 positioning frames, 25 support frames, 26 slide rails, 27 moving rods, 28 adapter plates, 29 processed parts, 3 fourth cylinders, 31 fifth cylinders, 32 shells , 33 fixed clips, 34 movable clips, 35 sliding blocks, 36 sixth cylinders, 4 scale marks.
具体实施方式detailed description
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
实施例:Example:
请参阅图1-4,本实用新型提供一种技术方案:一种用于晶圆加工的自动升降及旋转装置,包括基座1、输料机构、固定机构、升降旋转机构、加工机构及转运机构,所述基座1顶部的凹槽内设置有载料台15,所述载料台15中部通孔内设置有转盘16,所述转盘16中部设置有吸盘17,吸盘17为电动吸盘,通过电控开关进行控制,所述载料台15上侧沿圆心环形分布有刻度线4,通过在载料台15上设置向内侧分布的环形刻度线,在通过旋转电机22调节转盘16角度时,工作人员可以方便了解转盘16的转动角度;Please refer to Figures 1-4. The utility model provides a technical solution: an automatic lifting and rotating device for wafer processing, including a base 1, a feeding mechanism, a fixing mechanism, a lifting and rotating mechanism, a processing mechanism and a transfer mechanism. Mechanism, the groove on the top of the base 1 is provided with a loading table 15, the middle of the loading table 15 is provided with a
所述输料机构包括安装在防护罩12内的传送带13,所述传送带13尾端设置有倾斜的导料板14,经过传送带13运输至尾部的工件自动通过导料板14的斜面下落至载料台15中部的转盘16上。The conveying mechanism includes a
所述固定机构包括呈环形安装在转盘16上的第一气缸18,所述第一气缸18的活塞杆安装有L型夹块19,所述L型夹块19内安装有缓冲垫2,缓冲垫2可选用橡胶或硅胶材质,起到增强摩擦力和同步缓冲防护的目的;Described fixing mechanism comprises the
在工件通过导料板14移动至转盘16上后,工件的底部与L型夹块19的底板接触,此时同步启动第一气缸18,第一气缸18的活塞杆伸出并推动L型夹块19自动靠近,从而通过多个L型夹块19的侧板将工件固定,通过设置配合使用的转盘16、第一气缸18、L型夹块19等结构组成固定机构,可以在其配合下快速将通过传送带13转运至载料台15上的工件进行夹持固定,且由于多个L型夹块19对称布置,可以均匀有效地将晶圆工件夹持固定在转盘16中心处,同时在吸盘17的作用下可以将工件稳定吸附固定在转盘16顶部,进一步提高了加工过程的稳定性。After the workpiece moves onto the
所述升降旋转机构包括安装在转盘16底部的第二气缸21,所述第二气缸21底部连接有旋转电机22,所述旋转电机22底部连接有通过定位架24安装在基座1底部的第三气缸23,在需要调节转盘16高度时,使用者启动第二气缸21,通过第二气缸21的活塞杆带动与之连接的转盘16进行上下移动,接着可以通过旋转电机22对第二气缸21及转盘16进行角度调节,此时若需要调节旋转电机22自身高度,可以通过第三气缸23对其进行调节,通过设置第二气缸21、旋转电机22和第三气缸23配合使用,可以自动对工件的高度进行调节,同时在加工过程中可以根据需求调节固定机构的旋转角度,进而满足不同的加工需求。The lifting and rotating mechanism includes a
所述加工机构包括安装在基座1顶部的支撑架25,所述支撑架25侧面的滑轨26内部滑动安装有移动杆27,所述移动杆27底部通过转接板28安装有加工件29,所述加工件29可以为具有驱动机构的打磨机构,所述移动杆27上部侧面连接第四气缸3,在工作时,通过第四气缸3调节加工件29的横向位置从而对工件进行有效加工。The processing mechanism includes a
所述转运机构包括安装于支撑架25内的第五气缸31,所述第五气缸31端部连接壳体32,所述壳体32侧面安装有固定夹块33和移动夹块34,所述移动夹块34通过滑动块35与安装在壳体32内的第六气缸36连接,加工结束后,令第一气缸18带动L型夹块19复位,接着工作人员将工件取下放入固定夹块33与移动夹块34内,启动第六气缸36,第六气缸36通过滑动块35带动移动夹块34向靠近固定夹块33的方向移动,从而通过固定夹块33与移动夹块34将工件夹紧,接着通过第五气缸31对壳体32及工件进行横向调节,通过设置第五气缸31、壳体32、固定夹块33、移动夹块34、滑动块35和第六气缸36等结构配合使用,可以在晶圆加工结束之后通过上述机构组成的转运机构对晶圆机构进行夹持并进行自动转运,保证了加工流程的顺畅性,进一步提高了加工效率。The transfer mechanism includes a
该种用于晶圆加工的自动升降及旋转装置,具体使用时,首先,经过传送带13运输至尾部的工件自动通过导料板14的斜面下落至载料台15中部的转盘16上,工件的底部与L型夹块19的底板接触,此时同步启动第一气缸18,第一气缸18的活塞杆伸出并推动L型夹块19自动靠近,从而通过多个L型夹块19的侧板将工件固定,在需要调节转盘16高度时,使用者启动第二气缸21,通过第二气缸21的活塞杆带动与之连接的转盘16进行上下移动,接着可以通过旋转电机22对第二气缸21及转盘16进行角度调节,随后通过第四气缸3来回调节加工件29的横向位置从而对工件进行有效加工,加工结束后,令第一气缸18带动L型夹块19复位,接着工作人员将工件取下放入固定夹块33与移动夹块34内,启动第六气缸36,第六气缸36通过滑动块35带动移动夹块34向靠近固定夹块33的方向移动,从而通过固定夹块33与移动夹块34将工件夹紧,接着通过第五气缸31对壳体32及工件进行横向调节,将工件移动至合适的位置。This kind of automatic lifting and rotating device for wafer processing, in specific use, firstly, the workpiece transported to the tail through the
尽管已经示出和描述了本实用新型的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本实用新型的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本实用新型的范围由所附权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115274542A (en) * | 2022-08-03 | 2022-11-01 | 上海涛鑫电子设备有限公司 | Automatic lifting and rotating device for wafer processing |
| CN117207098A (en) * | 2023-08-31 | 2023-12-12 | 浙江晶睿电子科技有限公司 | A thin-walled parts processing device for semiconductor packaging that can prevent deformation |
| CN117644296A (en) * | 2023-12-11 | 2024-03-05 | 广西华芯振邦半导体有限公司 | Wafer cutting machine with location clamping structure |
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2022
- 2022-08-03 CN CN202222033624.6U patent/CN217955838U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115274542A (en) * | 2022-08-03 | 2022-11-01 | 上海涛鑫电子设备有限公司 | Automatic lifting and rotating device for wafer processing |
| CN117207098A (en) * | 2023-08-31 | 2023-12-12 | 浙江晶睿电子科技有限公司 | A thin-walled parts processing device for semiconductor packaging that can prevent deformation |
| CN117644296A (en) * | 2023-12-11 | 2024-03-05 | 广西华芯振邦半导体有限公司 | Wafer cutting machine with location clamping structure |
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