CN114639626A - Positioning and carrying device for wafer - Google Patents
Positioning and carrying device for wafer Download PDFInfo
- Publication number
- CN114639626A CN114639626A CN202210272000.1A CN202210272000A CN114639626A CN 114639626 A CN114639626 A CN 114639626A CN 202210272000 A CN202210272000 A CN 202210272000A CN 114639626 A CN114639626 A CN 114639626A
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- disc
- wafer
- sliding
- module
- positioning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a positioning and carrying device for wafers, which comprises a supporting plate, a mounting plate, a first disc and a second disc, wherein a slide rail is arranged on the front side surface of the supporting plate, a second module is arranged on the first module, a supporting table is connected below the mounting plate, and a sliding sleeve is arranged above a spring. According to the wafer conveying device, due to the arrangement of the suckers, when the wafer is required to be conveyed, the wafer can be adsorbed through the suckers, the height of each sucker can be controlled through the air cylinder, so that the wafer can be conveniently sucked, then the wafer is driven to slide and transport through the first module and the second module, manual intervention is not needed in the whole process, the machining efficiency is improved, manpower is reduced, the risk of injury caused by manual operation is avoided, meanwhile, the wafer is limited and fixed by the three clamping blocks, the wafer can be positioned, and the phenomenon that the wafer is shifted in position during machining is avoided.
Description
Technical Field
The invention relates to the technical field of positioning and carrying equipment, in particular to a positioning and carrying device for a wafer.
Background
When the TAIKO wafer is ground, the peripheral edge part of about 3mm of the wafer is required to be reserved, and only the inner part of the wafer is ground to be thinned, so that the warping of the wafer is reduced, the transmission requirement and the fragment risk of a post-process machine table are greatly reduced, the requirement of processing ultrathin crystal with the thickness of less than 100um is met, the wafer needs a carrying device to change the position of the wafer in the processing and manufacturing process, and the wafer is transported to a specific position through the carrying device.
The existing positioning and carrying device for the wafer does not have a positioning function in use, for example, a wafer carrier carrying mechanism disclosed in application number CN201420373226.1, the wafer needs to be loaded and carried in the processing process, most of the existing devices are manually loaded and carried, the operation is complicated and the labor intensity is high, so that the time, labor and cost are wasted, and if the workpiece is manually carried by a person and sent to a cutting device, the safety risk exists, and the overall loading and carrying rhythm is slow.
Therefore, it is necessary to provide a positioning and transporting apparatus for wafers to solve the above problems.
Disclosure of Invention
The invention aims to provide a positioning and conveying device for wafers, which solves the problem that the prior art does not have a positioning function, the wafers need to be loaded and conveyed in the processing process, most of the prior art are manually loaded and conveyed, the operation is complicated, the labor intensity is high, time and labor are wasted, the cost is high, if the workpieces are conveyed to other positions by manual conveying of personnel, the integral loading and conveying rhythm is slow, and meanwhile, the prior conveying device can not position the wafers, and directly conveys and places the wafers on a worktable, so that the wafers are subjected to position deviation during processing and are easy to damage.
In order to achieve the above purpose, the invention provides the following technical scheme: the utility model provides a location handling device for wafer, includes backup pad, mounting panel, first disc and second disc, backup pad front side surface is provided with module one, be provided with module two on the module one, the below of mounting panel is connected with a supporting bench, a supporting bench's bottom is provided with first disc, be connected with the fixed block on the first disc, the inside of fixed block is provided with the motor, one side of motor is connected with the lead screw, one side of second disc is connected with the connecting plate, the front end of connecting plate is connected with the fixed plate, the top of fixed plate is provided with the cylinder, the top of cylinder is provided with the fixed station, the left and right sides of fixed station is connected with the slide bar, be provided with the spring on the slide bar, the top of spring is provided with the sliding sleeve.
Preferably, sliding connection is adopted between the first module and the second module, and a mounting plate is arranged at the front end of the second module, so that the first module and the second module can move the position of the carrying device conveniently.
Preferably, the fixed block is provided with 3, the fixed block distributes according to certain angle about between the first disc, the spout has been seted up at the middle part of fixed block for the fixed block can stabilize the support motor.
Preferably, a second sliding block is arranged inside the sliding groove, the sliding groove is in sliding connection with the second sliding block, and a clamping block is arranged above the second sliding block, so that the sliding groove and the second sliding block can slidably adjust the position of the clamping block.
Preferably, the number of the clamping blocks is 3, grooves are formed in the clamping blocks, and the clamping blocks are distributed among the first disks according to a certain angle, so that the clamping blocks push the wafer, and the wafer is conveniently positioned.
Preferably, the bottom of the first disk is provided with a second disk, and a positioning bolt is arranged between the first disk and the second disk, so that the positioning bolt can ensure that the first disk and the second disk are kept in a parallel state, and the three clamping blocks are equal in height.
Preferably, the number of the air cylinders is 2, and the air cylinders are mutually and centrally symmetrical about the second disc, so that the air cylinders can adjust the height of the suction disc.
Preferably, be sliding connection between slide bar and the sliding sleeve, the external diameter of slide bar is less than the internal diameter of sliding sleeve, the top of sliding sleeve is provided with the sucking disc for slide bar and sliding sleeve can reduce the impact force when sucking the wafer of sucking disc.
Preferably, the number of the suckers is 4, and the suckers are in central symmetry with each other about the fixed table, so that the suckers can suck and move the cut wafer.
In the technical scheme, the invention provides the following technical effects and advantages:
1. through the arrangement of the sucker, when the wafer needs to be transported, the wafer can be adsorbed through the sucker, the height of the sucker can be controlled through the air cylinder, so that the wafer can be conveniently sucked, and then the wafer is driven to slide and transport through the module I and the module II, so that the whole process does not need manual intervention, the processing efficiency is improved, the manpower is reduced, and the risk of manual operation injury is avoided;
2. through the setting of fixture block, the motor is connected with the lead screw, and the second slider is installed on the lead screw, can drive the lead screw rotation through the motor, so when the lead screw is rotatory, the nut can drive the fixture block and remove on the lead screw direction, and three fixture block carries out spacing fixed to the wafer simultaneously, can fix a position the wafer from this, avoids the wafer to appear the phenomenon of offset when adding man-hour.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is a perspective view of a second disk of the present invention;
FIG. 4 is a schematic perspective view of a positioning bolt according to the present invention;
FIG. 5 is a schematic perspective view of a groove structure according to the present invention;
fig. 6 is a schematic perspective view of the chuck of the present invention.
Description of reference numerals:
1. a support plate; 2. a first module; 3. a second module; 4. mounting a plate; 5. a support table; 6. a first disc; 7. a fixed block; 8. a chute; 9. a motor; 10. a screw rod; 11. a second slider; 12. a clamping block; 13. a groove; 14. a second disc; 15. positioning the bolt; 16. a connecting plate; 17. a fixing plate; 18. a cylinder; 19. A fixed table; 20. a slide bar; 21. a spring; 22. a sliding sleeve; 23. and (4) sucking discs.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.
The invention provides a positioning and carrying device for wafers as shown in figures 1-6, which comprises a supporting plate 1, a mounting plate 4, first disc 6 and second disc 14, the surface is provided with module one 2 before backup pad 1, be provided with module two 3 on the module one 2, the below of mounting panel 4 is connected with brace table 5, the bottom of brace table 5 is provided with first disc 6, be connected with fixed block 7 on the first disc 6, the inside of fixed block 7 is provided with motor 9, one side of motor 9 is connected with lead screw 10, the top of second disc 14 is connected with connecting plate 16, the front end of connecting plate 16 is connected with fixed plate 17, the top of fixed plate 17 is provided with cylinder 18, the top of cylinder 18 is provided with fixed station 19, the left and right sides of fixed station 19 is connected with slide bar 20, be provided with spring 21 on the slide bar 20, the top of spring 21 is provided with sliding sleeve 22.
The first die set 2 is connected with the second die set 3 in a sliding manner, the front end of the second die set 3 is provided with a mounting plate 4, 3 fixed blocks 7 are arranged, the fixed blocks 7 are distributed at a certain angle relative to the first disc 6, the middle part of the fixed blocks 7 is provided with a sliding groove 8, a second sliding block 11 is arranged inside the sliding groove 8, the sliding groove 8 is connected with the second sliding block 11 in a sliding manner, a clamping block 12 is arranged above the second sliding block 11, the clamping block 12 is provided with 3, the clamping block 12 is provided with a groove 13,
the bottom of the first disc 6 is provided with a second disc 14, a positioning bolt 15 is arranged between the first disc 6 and the second disc 14, 2 air cylinders 18 are arranged, the air cylinders 18 are centrosymmetric with respect to the second disc 14, the sliding rods 20 are in sliding connection with the sliding sleeves 22, the outer diameters of the sliding rods 20 are smaller than the inner diameters of the sliding sleeves 22, suction cups 23 are arranged above the sliding sleeves 22, the number of the suction cups 23 is 4, and the suction cups 23 are centrosymmetric with respect to the fixed table 19.
The working principle of the invention is as follows:
referring to the attached drawings 1-6 in the specification, when the device is used, firstly, the position offset phenomenon of a wafer during processing can be avoided through the positioning of the three clamping blocks 12, and the positioning bolt 15 arranged between the first disk 6 and the second disk 14 can ensure that the first disk 6 and the second disk 14 are in a parallel state, so that the phenomenon that the first disk 6 and the second disk 14 are inclined is avoided, and the three clamping blocks 12 are ensured to be equal in height. The carrying device is stably installed at a proper position through the supporting plate 1, so that the first disc 6 and the second disc 14 are located above the wafer, then the driving device is started, the positioning device is in a working state, when the wafer to be processed or processed needs to be positioned, the three motors 9 are simultaneously turned off, the lead screw 10 is driven to move through the motors 9, the fixture block 12 is simultaneously driven to move to the proper position, the position is mainly pushed through the dead position of the motor 9, so that the wafer is concentric with a certain reference, and the wafer is positioned;
referring to the attached drawings 1-6 of the specification, when the device is used, when a wafer is stably positioned on the suction cup 23, the wafer can be conveyed, after the wafer is processed, the air cylinder 18 can be opened, the fixing table 19 can be driven by the air cylinder 18 to adjust the height, meanwhile, the height position of the suction cup 23 can be adjusted, after the wafer is cut in a centering manner, the wafer can be sucked by the suction cup 23, and the position for sucking the wafer is movably adjusted by the first module 2 and the second module 3, so that the wafer conveying work can be completed.
Claims (9)
1. A location handling device for wafer, includes backup pad (1), mounting panel (4), first disc (6) and second disc (14), its characterized in that: the front side surface of the supporting plate (1) is provided with a first module (2), a second module (3) is arranged on the first module (2), a supporting table (5) is connected below the mounting plate (4), a first disc (6) is arranged at the bottom of the supporting table (5), a fixed block (7) is connected onto the first disc (6), a motor (9) is arranged inside the fixed block (7), a lead screw (10) is connected onto one side of the motor (9), a connecting plate (16) is connected onto one side of the second disc (14), a fixed plate (17) is connected at the front end of the connecting plate (16), an air cylinder (18) is arranged above the fixed plate (17), a fixed table (19) is arranged above the air cylinder (18), slide bars (20) are connected onto the left side and the right side of the fixed table (19), and springs (21) are arranged on the slide bars (20), a sliding sleeve (22) is arranged above the spring (21).
2. A positioning handling device for wafers as recited in claim 1, wherein: the first module (2) is in sliding connection with the second module (3), and a mounting plate (4) is arranged at the front end of the second module (3).
3. A positioning handling device for wafers as recited in claim 1, wherein: the number of the fixing blocks (7) is 3, the fixing blocks (7) are distributed among the first discs (6) according to a certain angle, and the middle parts of the fixing blocks (7) are provided with sliding grooves (8).
4. A positioning handling device for wafers as claimed in claim 3, wherein: a second sliding block (11) is arranged inside the sliding groove (8), the sliding groove (8) is connected with the second sliding block (11) in a sliding mode, and a clamping block (12) is arranged above the second sliding block (11).
5. A positioning and handling device for wafers according to claim 4 and wherein: the number of the clamping blocks (12) is 3, grooves (13) are formed in the clamping blocks (12), and the clamping blocks (12) are distributed among the first discs (6) according to a certain angle.
6. A positioning and handling device for wafers as set forth in claim 5, wherein: the bottom of the first disc (6) is provided with a second disc (14), and a positioning bolt (15) is arranged between the first disc (6) and the second disc (14).
7. A positioning handling device for wafers as recited in claim 1, wherein: the number of the cylinders (18) is 2, and the cylinders (18) are mutually and centrally symmetrical relative to the second disc (14).
8. A positioning handling device for wafers as recited in claim 1, wherein: the sliding rod (20) is in sliding connection with the sliding sleeve (22), the outer diameter of the sliding rod (20) is smaller than the inner diameter of the sliding sleeve (22), and a sucker (23) is arranged above the sliding sleeve (22).
9. A positioning handling device for wafers as recited in claim 8, wherein: the number of the suckers (23) is 4, and the suckers (23) are in central symmetry with respect to the fixed table (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210272000.1A CN114639626A (en) | 2022-03-18 | 2022-03-18 | Positioning and carrying device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210272000.1A CN114639626A (en) | 2022-03-18 | 2022-03-18 | Positioning and carrying device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114639626A true CN114639626A (en) | 2022-06-17 |
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ID=81950131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210272000.1A Pending CN114639626A (en) | 2022-03-18 | 2022-03-18 | Positioning and carrying device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114639626A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116443574A (en) * | 2023-05-05 | 2023-07-18 | 淮安市文盛电子有限公司 | Electronic components transport feed arrangement |
| CN117096088A (en) * | 2023-10-17 | 2023-11-21 | 和研半导体设备(沈阳)有限公司 | Wafer handling device |
-
2022
- 2022-03-18 CN CN202210272000.1A patent/CN114639626A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116443574A (en) * | 2023-05-05 | 2023-07-18 | 淮安市文盛电子有限公司 | Electronic components transport feed arrangement |
| CN116443574B (en) * | 2023-05-05 | 2024-03-22 | 淮安市文盛电子有限公司 | Electronic components transport feed arrangement |
| CN117096088A (en) * | 2023-10-17 | 2023-11-21 | 和研半导体设备(沈阳)有限公司 | Wafer handling device |
| CN117096088B (en) * | 2023-10-17 | 2024-02-02 | 和研半导体设备(沈阳)有限公司 | Wafer handling device |
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