CN221164955U - Silicon wafer box alignment device - Google Patents
Silicon wafer box alignment device Download PDFInfo
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- CN221164955U CN221164955U CN202322857313.6U CN202322857313U CN221164955U CN 221164955 U CN221164955 U CN 221164955U CN 202322857313 U CN202322857313 U CN 202322857313U CN 221164955 U CN221164955 U CN 221164955U
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 89
- 239000010703 silicon Substances 0.000 title claims abstract description 89
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 210000000078 claw Anatomy 0.000 claims abstract description 22
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 72
- 238000009434 installation Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000671 immersion lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer box alignment device which comprises a mechanical arm, wherein a supporting component is arranged on the mechanical arm and used for supporting a silicon wafer box, a through hole is formed in one end face of the silicon wafer box relatively, the supporting component comprises a mounting seat, a supporting arm rod is arranged on the mounting seat relatively, a claw rod which can extend into a corresponding through hole is arranged on the supporting arm rod, a driving component used for adjusting the distance between the supporting arm rods is arranged on the mounting seat, a locking component matched with the corresponding through hole is arranged on the claw rod, and the locking component is used for locking the silicon wafer box. According to the utility model, through the arrangement of the mechanical arm, the supporting component and the sensing device, the placing process of the silicon wafer box is not required to be aligned for a plurality of times, so that the placing of the silicon wafer box can be faster and more efficient, and the production efficiency is increased.
Description
Technical Field
The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer box alignment device.
Background
The ACT series spin coater is used for producing silicon wafers by adopting devices such as automatic glue feeding, automatic spin coating, automatic edge removing and cleaning, and the ACT series spin coater is generally composed of four parts, wherein the first part is a silicon wafer box workstation, and a silicon wafer box is loaded on the machine; the second part is a process treatment part and comprises a main body of a spin coater, wherein main process units such as a viscosity increasing module, a hot disc, a cold disc, spin coating, development and the like are arranged on the main body of the spin coater, and one or two manipulators are used for transferring silicon wafers between the units; the third part is a unit matched with an immersion lithography process and comprises a silicon wafer surface flushing unit, a back cleaning unit and the like; the fourth part is an interface unit with the photoetching machine, comprising a buffer box for temporarily storing the silicon wafer, an interface for exposing the edge of the silicon wafer and exchanging the silicon wafer by the photoetching machine, and the like.
When the existing ACT series photoresist homogenizing developing machine works for the first part, most of silicon wafer boxes are loaded on the machine by manual operation of operators, and because the silicon wafer boxes need to be placed at the appointed position on the machine, the silicon wafer boxes can be placed at the appointed position on the machine only by multiple times of alignment in the manual operation process, so that the operation time is prolonged, the efficiency is reduced, and improvement is needed.
Disclosure of utility model
Aiming at the problems in the prior art, the utility model provides a silicon wafer box alignment device.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a silicon chip box alignment device, including the arm, be equipped with on the arm and hold in the palm and get the subassembly, hold in the palm and get the subassembly and be used for holding in the palm and get the silicon chip box, be equipped with the through-hole relatively on the terminal surface of silicon chip box, hold in the palm and get the subassembly including the mount pad, be equipped with relatively on the mount pad and hold in the palm and get the armed lever, hold in the palm and get the armed lever on be equipped with and be used for adjusting to hold in the palm and get the drive assembly of armed lever interval, be equipped with on the armed lever with corresponding through-hole complex locking subassembly, locking subassembly is used for locking the silicon chip box.
Further, one end of the through hole is provided with a limiting hole, one end of the claw rod is provided with a limiting column which can extend into the limiting hole, the other end of the through hole is provided with a locking groove, and the other end of the claw rod is provided with a locking rod which can rotate and extend into the locking groove.
Further, an installation cavity is arranged in the claw rod and positioned at the other end along the length direction, and a strip-shaped groove through which the locking rod can pass is arranged on the side wall of the installation cavity; the locking assembly comprises a mounting block arranged in the mounting cavity, the mounting block can be arranged in a moving mode along the extending direction of the mounting cavity, tooth grooves are formed in two opposite side walls of the mounting block, gears which can rotate and are meshed with the corresponding tooth grooves are arranged on two opposite sides of the mounting block, one end of the locking rod is fixedly connected to the corresponding gears, the other end of the locking rod can rotate out of the corresponding strip-shaped grooves, and the mounting block is used for driving the locking rod to rotate in or out of the mounting cavity along the corresponding strip-shaped grooves.
Further, the installation block is internally provided with a threaded hole along the length in a penetrating way, the installation cavity is internally provided with a rotatable rotating shaft, and the threads of the rotating shaft penetrate through the threaded hole.
Further, a first sliding groove is formed in the bottom wall of the mounting cavity along the extending direction of the bottom wall, and a first sliding block extending into the first sliding groove to slide is arranged on one side face of the mounting block.
Further, limiting blocks are oppositely arranged on the opposite side walls of the mounting cavity, and limiting plates matched with the corresponding limiting blocks are arranged on the mounting blocks.
Further, a second sliding groove with a T-shaped section is formed in one side face, facing the supporting arm rod, of the mounting seat along the length direction of the mounting seat, a second sliding block extending into the second sliding groove to slide is arranged at one end portion of one of the two supporting arm rods, the driving assembly comprises an electric push rod arranged on the mounting seat, and the electric push rod is used for driving the supporting arm rod to be close to or far away from the other supporting arm rod.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the utility model, through the arrangement of the mechanical arm, the supporting component and the sensing device, the placing process of the silicon wafer box is not required to be aligned for a plurality of times, so that the placing of the silicon wafer box can be faster and more efficient, and the production efficiency is increased.
2. According to the utility model, the distance between the supporting arm rods can be adjusted through the arrangement of the driving assembly, so that the supporting assembly can adapt to silicon wafer boxes with different sizes, and the applicability of the alignment device is improved.
Drawings
Fig. 1 is a schematic structural view of an alignment device for a silicon wafer cassette according to the present utility model.
Fig. 2 is a schematic structural view of a silicon wafer cassette according to the present utility model.
Fig. 3 is a schematic structural view of the picking assembly in the present utility model.
FIG. 4 is a schematic view of a locking assembly according to the present utility model.
Fig. 5 is a schematic structural view of a robot arm, a holding assembly, and a silicon wafer cassette according to the present utility model.
Fig. 6 is a schematic view of a part of the structure of a silicon wafer cassette according to the present utility model.
FIG. 7 is a schematic view of another view of the locking assembly of the present utility model.
The meaning of each reference numeral in the figures is:
100. A mechanical arm; 110. a holding component; 120. a silicon wafer box; 200. a placement cavity; 210. a through hole; 211. a limiting hole; 212. a locking groove; 300. the arm lever is supported and taken; 301. a limit column; 302. a claw rod; 310. a second chute; 311. an electric push rod; 320. a mounting base; 400. a mounting cavity; 401. a first chute; 410. a motor; 411. a rotating shaft; 420. a mounting block; 421. a limiting block; 422. tooth slots; 423. a threaded hole; 424. a limiting plate; 430. rotating the column; 431. a locking lever; 432. a gear; 440. a bar-shaped groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a number" is two or more, unless explicitly defined otherwise.
The utility model provides a technical scheme that:
Referring to fig. 1-7, a silicon wafer box alignment device in this embodiment includes a mechanical arm 100, a supporting component 110 is disposed on the mechanical arm 100, the supporting component 110 is used for supporting a silicon wafer box 120, a through hole 210 is relatively disposed at one end of the silicon wafer box 120, the supporting component 110 includes a mounting seat 320, a supporting arm 300 is relatively disposed on the mounting seat 320, a claw rod 302 capable of extending into the corresponding through hole 210 is disposed on the supporting arm 300, a driving component capable of adjusting the distance between the supporting arm 300 is disposed on the mounting seat 320, a locking component matched with the corresponding through hole 210 is disposed on the claw rod 302, and the locking component is used for locking the silicon wafer box 120.
In this embodiment, the mounting seat 320 is mounted at the moving end of the mechanical arm 100, the mechanical arm 100 is used for driving the pickup assembly 110 to move, and moving and loading the silicon wafer cassette 120 onto a silicon wafer cassette placement module (not shown in the figure) on the ACT series photoresist developing machine, the mechanical arm 100 can accurately position the silicon wafer cassette 120 in cooperation with the sensing device, and after determining the position to be placed, the alignment device can be aligned once, compared with the existing manual placement which may require multiple alignments, the alignment device of this embodiment has better efficiency of placing the silicon wafer cassette and can also reduce the workload of the staff, wherein the mechanical arm 100 is of the existing structure, and the principle thereof is not repeated herein;
The sensing device comprises a first sensing device and a second sensing device, wherein the first sensing device is used for sensing the number of the silicon wafers in the silicon wafer box 120 and comprises a weight sensor and a data processing module, the weight sensor is arranged in the silicon wafer box 120 and is used for detecting the weight of the silicon wafers and transmitting detection signals to the data processing module, and whether the silicon wafers exist in the silicon wafer box 120 or not and the number of the silicon wafers are obtained after the silicon wafers are processed by the data processing module;
The second sensing device is used for detecting whether the silicon wafer box 120 is aligned with a silicon wafer box placement module on the ACT series photoresist developing machine or not, and comprises a positioning sensor and a processing module, wherein the positioning sensor is provided with an output module arranged on the silicon wafer box and a receiving module arranged on the silicon wafer box placement module when in actual use, when signals output by the positioning sensor output module are received by the receiving module, the silicon wafer box 120 is aligned with the silicon wafer box placement module, the processing module transmits signals to the mechanical arm 100, the mechanical arm 100 drives the silicon wafer box 120 to descend, and the silicon wafer box 120 is placed in the silicon wafer box placement module;
Through the arrangement of the through hole 210 and the claw rod 302, the supporting and taking assembly 110 can pass through the through hole 210 through the supporting and taking claw rod 302 to support and take the silicon wafer box 120, so that the subsequent movement of the silicon wafer box 120 is facilitated;
wherein, by the arrangement of the supporting arm rod 300, the claw rod 302 can be installed at the front end part of the corresponding supporting arm rod 300, thereby realizing the installation of the claw rod 302 on the installation seat 320;
Compared with the existing manual placement of the silicon wafer box 120 by an operator, in the embodiment, the arrangement of the mechanical arm 100, the supporting component 110 and the sensing device ensures that the silicon wafer box 120 is not required to be aligned for multiple times in the placement process, so that the silicon wafer box 120 can be placed more quickly and efficiently, and the production efficiency is increased;
The locking component is arranged, so that the silicon wafer box 120 can be better fixed, and the silicon wafer box 120 can be fixed on the claw rod 302, so that the silicon wafer box 120 cannot be skewed in the moving process, namely, the silicon wafer box 120 is more stably supported by the supporting component;
Wherein, through the setting of the drive assembly, the distance between the support arm bars 300 can be adjusted, thereby enabling the support arm bars to adapt to silicon wafer boxes 120 with different sizes.
Referring to fig. 2-4, in this embodiment, one end of the through hole 210 is provided with a limiting hole 211, one end of the pawl 302 is provided with a limiting post 301 that can extend into the limiting hole 211, the other end of the through hole 210 is provided with a locking slot 212, and the other end of the pawl 302 is provided with a locking lever 431 that can rotate and extend into the locking slot 212.
In this embodiment, the setting of the limiting hole 211, the through hole 210, the locking slot 212, and the locking rod 431 of the limiting post 301 enables the holding component 110 to better clamp the silicon wafer box 120, so that the silicon wafer box 120 will not skew during the moving process;
wherein, the diameter of spacing hole 211 is greater than the diameter of through-hole 210, and the diameter of spacing post 301 and spacing hole 211 looks adaptation, through this kind of setting for spacing post 301 can stretch into spacing hole 211 in, in the locking groove 212 that the cooperation locking lever 431 card is gone into to correspond, thereby fix the position of silicon wafer box 120 on claw pole 302, make hold in the palm and get subassembly 110 can stably centre gripping silicon wafer box 120.
Referring to fig. 3 and 4, in this embodiment, a mounting cavity 400 is provided in the claw rod 302 and at the other end along the length direction, and a bar-shaped groove 440 through which the locking rod 431 can pass is provided on the side wall of the mounting cavity 400; the locking assembly comprises a mounting block 420 arranged in the mounting cavity 400, the mounting block 420 can be arranged in a movable mode along the extending direction of the mounting cavity 400, tooth grooves 422 are formed in two opposite side walls of the mounting block 420, gears 432 which can rotate and are meshed with the corresponding tooth grooves 422 are arranged on two opposite sides of the mounting block 420, one end of a locking rod 431 is fixedly connected to the corresponding gear 432, the other end of the locking rod 431 can rotate out of the corresponding bar groove 440, and the mounting block 420 is used for driving the locking rod 431 to rotate in or out of the mounting cavity 400 along the corresponding bar groove 440.
In this embodiment, the locking assembly is installed by the installation cavity 400;
wherein, the locking rod 431 can extend out of or into the mounting cavity 400 by the arrangement of the strip-shaped groove 440;
Wherein, by the arrangement of the mounting block 420, the tooth slot 422 and the gear 432, when the mounting block 420 moves in the mounting cavity 400, since the gear 432 and the tooth slot 422 are engaged,
Further, the gear 432 is driven to rotate, and the locking rod 431 is driven to extend out of the corresponding strip-shaped groove 440 or extend into the mounting cavity 400;
The gear 432 is fixedly installed on the rotating column 430, the rotating column 430 is installed in the installation cavity 400, two ends of the rotating column 430 are installed on corresponding side walls of the installation cavity 400 through bearing seats, and through the arrangement, the rotating installation of the gear 432 is preferably realized;
The locking rod 431 is initially retracted in the mounting cavity 400, and when the silicon wafer box 120 needs to be locked, the locking rod 431 is driven by the gear 432 to extend out through the bar-shaped groove 440 and is clamped into the corresponding locking groove 212, so that the silicon wafer box 120 is locked;
Wherein, the installation cavity 400 is provided with an opening at one end, the opening end faces to the outer end of the claw rod 302, a blocking block (not shown in the figure) is arranged at the opening, and the installation of the locking component in the installation cavity 400 is preferably realized through the arrangement of the blocking block;
Referring to fig. 4, in this embodiment, a threaded hole 423 is formed in the mounting block 420 along the length, a rotatable rotating shaft 411 is disposed in the mounting cavity 400, and the rotating shaft 411 is threaded through the threaded hole 423.
In the present embodiment, by providing the screw hole 423 and the rotation shaft 411, the installation block 420 can be moved along with the rotation shaft 411 when it rotates, so that the locking rod 431 is extended out of or into the installation cavity 400;
One end of the rotating shaft 411 is rotatably mounted on the block through a bearing, and the other end is connected with a motor 410, so that when the motor 410 is started, the rotating shaft 411 can be driven to rotate, and then the mounting block 420 is driven to move, so that the locking rod 431 extends out of or into the mounting cavity 400; wherein the motor 410 is fixedly mounted on the bottom sidewall of the mounting cavity 400.
Referring to fig. 4, in this embodiment, a first sliding groove 401 is provided on the bottom wall of the mounting cavity 400 along the extending direction thereof, and a first sliding block extending into the first sliding groove 401 is provided on one side of the mounting block 420.
In this embodiment, the first sliding groove 401 and the first sliding block are disposed, so that the mounting block 420 can slide along the first sliding groove 401, and a fixed effect is achieved on the mounting block 420, and when the rotation shaft 411 rotates, the mounting block 420 will not rotate along with it, but slide along the first sliding groove 401.
Referring to fig. 4, in this embodiment, limiting blocks 421 are disposed on opposite sidewalls of the mounting cavity 400, and limiting plates 424 corresponding to the limiting blocks 421 are disposed on the mounting block 420.
In this embodiment, the setting of the limiting plate 424 and the limiting block 421 makes the mounting block 420 limited in the moving process, and not separate from the mounting cavity 400.
Referring to fig. 3, in this embodiment, a second sliding groove 310 with a T-shaped cross section is provided on a side of the mounting base 320 facing the supporting arm 300 along the length direction, a second sliding block extending into the second sliding groove 310 is provided at one end of one of the two supporting arm 300, the driving assembly includes an electric push rod 311 disposed between the mounting bases 320, and the electric push rod 311 is used for driving the supporting arm 300 to approach or separate from the other supporting arm 300.
In this embodiment, the second sliding chute 310 and the second sliding block are arranged, so that the supporting arm 300 can move along the second sliding chute 310;
The electric push rod 311 is used for adjusting the distance between the supporting arm rods 300 to adapt to silicon wafer boxes 120 with different sizes;
the second sliding groove 310 is provided in a T-shape, so that the supporting arm 300 cannot be separated from the second sliding groove 310 during the sliding process.
Working principle: when the silicon wafer box 120 needs to be moved to the silicon wafer box placement module, the distance between the supporting arm rods 300 is adjusted according to the size of the silicon wafer box 120, the claw rods 302 extend into the corresponding through holes 210, the limiting columns 301 fix one ends of the silicon wafer box 120, the starting motor 410 drives the mounting blocks 420 to move, tooth grooves 422 on the mounting blocks 420 drive the gears 432 to rotate, the gears 432 rotate to drive the locking rods 431 to extend into the corresponding locking grooves 212, clamping of the silicon wafer box 120 is completed, and then the mechanical arm 100 drives the supporting assembly 110 to align and place the silicon wafer box 120 into the silicon wafer box placement module.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a silicon chip box alignment device which characterized in that: including arm (100), be equipped with on arm (100) and hold in the palm and get subassembly (110), hold in the palm and get subassembly (110) and be used for holding in the palm and get silicon chip box (120), be equipped with through-hole (210) relatively on the terminal surface of silicon chip box (120), hold in the palm and get subassembly (110) including mount pad (320), be equipped with on mount pad (320) relatively and hold in the palm and get arm lever (300), hold in the palm and be equipped with on getting arm lever (300) and be equipped with claw pole (302) that can stretch into in corresponding through-hole (210), be equipped with on mount pad (320) and be used for adjusting to hold in the palm and get the drive assembly of distance between arm lever (300), be equipped with on claw pole (302) with corresponding through-hole (210) complex locking subassembly, locking subassembly is used for locking silicon chip box (120).
2. The wafer cassette alignment device of claim 1, wherein: one end of the through hole (210) is provided with a limiting hole (211), one end of the claw rod (302) is provided with a limiting column (301) which can extend into the limiting hole (211), the other end of the through hole (210) is provided with a locking groove (212), and the other end of the claw rod (302) is provided with a locking rod (431) which can rotate and extend into the locking groove (212).
3. The wafer cassette alignment device of claim 2, wherein: a mounting cavity (400) is arranged in the claw rod (302) and positioned at the other end along the length direction, and a strip-shaped groove (440) through which the locking rod (431) can pass is arranged on the side wall of the mounting cavity (400); the locking assembly comprises a mounting block (420) arranged in a mounting cavity (400), the mounting block (420) can be arranged in a moving mode along the extending direction of the mounting cavity (400), tooth grooves (422) are formed in two opposite side walls of the mounting block (420), gears (432) which are rotatable and meshed with the corresponding tooth grooves (422) are arranged on two opposite sides of the mounting block (420), one end of a locking rod (431) is fixedly connected to the corresponding gears (432), the other end of the locking rod can be rotated out of the corresponding bar-shaped groove (440), and the movement of the mounting block (420) is used for driving the locking rod (431) to rotate into or out of the mounting cavity (400) along the corresponding bar-shaped groove (440).
4. A silicon wafer cassette alignment device as defined in claim 3 wherein: threaded holes (423) are formed in the inner edge of the mounting block (420) in a penetrating mode, rotatable rotating shafts (411) are arranged in the mounting cavity (400), and the rotating shafts (411) penetrate through the threaded holes (423) in a threaded mode.
5. The wafer cassette alignment device of claim 4, wherein: a first sliding groove (401) is formed in the bottom wall of the mounting cavity (400) along the extending direction of the bottom wall, and a first sliding block extending into the first sliding groove (401) to slide is arranged on one side face of the mounting block (420).
6. The wafer cassette alignment device of claim 5, wherein: limiting blocks (421) are oppositely arranged on the opposite side walls of the mounting cavity (400), and limiting plates (424) matched with the corresponding limiting blocks (421) are arranged on the mounting blocks (420).
7. The wafer cassette alignment device of claim 1, wherein: the mounting seat (320) is provided with a second sliding groove (310) with a T-shaped cross section along the length direction on one side surface of the supporting arm rod (300), one end part of one of the two supporting arm rods (300) is provided with a second sliding block extending into the second sliding groove (310) to slide, the driving assembly comprises an electric push rod (311) arranged between the mounting seats (320), and the electric push rod (311) is used for driving the supporting arm rod (300) to be close to or far away from the other supporting arm rod (300).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322857313.6U CN221164955U (en) | 2023-10-24 | 2023-10-24 | Silicon wafer box alignment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322857313.6U CN221164955U (en) | 2023-10-24 | 2023-10-24 | Silicon wafer box alignment device |
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CN221164955U true CN221164955U (en) | 2024-06-18 |
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CN202322857313.6U Active CN221164955U (en) | 2023-10-24 | 2023-10-24 | Silicon wafer box alignment device |
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CN (1) | CN221164955U (en) |
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2023
- 2023-10-24 CN CN202322857313.6U patent/CN221164955U/en active Active
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