JP6805496B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6805496B2 JP6805496B2 JP2016006366A JP2016006366A JP6805496B2 JP 6805496 B2 JP6805496 B2 JP 6805496B2 JP 2016006366 A JP2016006366 A JP 2016006366A JP 2016006366 A JP2016006366 A JP 2016006366A JP 6805496 B2 JP6805496 B2 JP 6805496B2
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- 239000004065 semiconductor Substances 0.000 title claims description 205
- 238000001514 detection method Methods 0.000 claims description 109
- 239000000758 substrate Substances 0.000 claims description 41
- 230000000903 blocking effect Effects 0.000 description 20
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 11
- 239000000872 buffer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000002485 combustion reaction Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 239000000567 combustion gas Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P3/00—Other installations
- F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
- F02P3/04—Layout of circuits
- F02P3/055—Layout of circuits with protective means to prevent damage to the circuit, e.g. semiconductor devices or the ignition coil
- F02P3/0552—Opening or closing the primary coil circuit with semiconductor devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
- H02H3/20—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess voltage
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P15/00—Electric spark ignition having characteristics not provided for in, or of interest apart from, groups F02P1/00 - F02P13/00 and combined with layout of ignition circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/866—Zener diodes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
- H02H3/20—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess voltage
- H02H3/202—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess voltage for dc systems
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
- H03K17/0822—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in field-effect transistor switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
- H03K17/0826—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in bipolar transistor switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
- H03K17/0828—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in composite switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P11/00—Safety means for electric spark ignition, not otherwise provided for
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P17/00—Testing of ignition installations, e.g. in combination with adjusting; Testing of ignition timing in compression-ignition engines
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K2017/0806—Modifications for protecting switching circuit against overcurrent or overvoltage against excessive temperature
Description
特許文献1 特開2005−6464号公報
特許文献2 特開2009−247072号公報
特許文献3 特開2006−74937号公報
Claims (6)
- 制御信号に応じてゲートが制御されるパワー半導体素子と、
前記パワー半導体素子のコレクタ端子側の電圧が過電圧となったことを検出する過電圧検出部と、
前記過電圧が検出されたことに応じて、前記パワー半導体素子のゲートをオフ電圧へと制御する遮断部と、
前記パワー半導体素子をオンさせる前記制御信号が入力されたことに応じて、予め定められた期間の間、リセット信号を出力するリセット部と、
前記リセット信号に応じてリセットされ、前記過電圧が検出されたことをラッチするラッチ部と、
を備え、
前記遮断部は、前記ラッチ部が前記過電圧の検出をラッチしたことに応じて、前記パワー半導体素子のゲートをオフ電圧へと制御し、
前記リセット部は、前記パワー半導体素子をオンさせる前記制御信号が入力されてから、前記パワー半導体素子がオンとなるまでの時間よりも長い時間の間、前記リセット信号を出力し、
前記過電圧検出部は、前記パワー半導体素子のゲートに電源端子が接続されて前記制御信号がハイ電位となることに応じて動作するインバータまたはコンパレータを有する半導体装置。 - 前記遮断部は、前記過電圧が検出されたことに応じて、前記パワー半導体素子のゲートをプルダウンする請求項1に記載の半導体装置。
- 前記過電圧検出部は、前記過電圧の基準となる閾値電圧を生成するためのツェナーダイオード、デプレッション型MOSFET、およびインバータの少なくとも1つを有する請求項1または2に記載の半導体装置。
- 前記パワー半導体素子は、基板の第1面側に設けられたコレクタ端子、並びに前記基板の第2面側に設けられたゲート端子およびエミッタ端子を有し、
前記過電圧検出部は、前記基板の前記第1面側に設けられた、前記パワー半導体素子のコレクタ端子と接続される前記基板の前記第2面側に設けられたドレイン端子と、前記基板の前記第2面側に設けられたゲート端子およびソース端子とを含み、前記ゲート端子および前記ソース端子が電気的に接続された半導体素子を有する
請求項1から3のいずれか一項に記載の半導体装置。 - 前記パワー半導体素子は、IGBT(絶縁ゲートバイポーラトランジスタ)または縦型MOSFETである請求項1から4のいずれか一項に記載の半導体装置。
- 当該半導体装置は、前記制御信号に応じて点火コイルに流れる電流を制御するイグナイタである請求項1から5のいずれか一項に記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016006366A JP6805496B2 (ja) | 2016-01-15 | 2016-01-15 | 半導体装置 |
CN201611069072.7A CN107070438B (zh) | 2016-01-15 | 2016-11-28 | 半导体装置 |
US15/364,182 US10554037B2 (en) | 2016-01-15 | 2016-11-29 | Semiconductor apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016006366A JP6805496B2 (ja) | 2016-01-15 | 2016-01-15 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2017126953A JP2017126953A (ja) | 2017-07-20 |
JP6805496B2 true JP6805496B2 (ja) | 2020-12-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016006366A Active JP6805496B2 (ja) | 2016-01-15 | 2016-01-15 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10554037B2 (ja) |
JP (1) | JP6805496B2 (ja) |
CN (1) | CN107070438B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10243551B1 (en) * | 2017-09-06 | 2019-03-26 | Alpha And Omega Semiconductor (Cayman) Ltd. | Over voltage protection for cascode switching power device |
US11448178B2 (en) * | 2018-03-13 | 2022-09-20 | Rohm Co., Ltd. | Switch control circuit and igniter |
JP7305303B2 (ja) * | 2018-03-20 | 2023-07-10 | 三菱電機株式会社 | 駆動装置及びパワーモジュール |
JP7443679B2 (ja) * | 2019-06-18 | 2024-03-06 | 富士電機株式会社 | 半導体装置 |
JP7456353B2 (ja) * | 2020-10-27 | 2024-03-27 | 株式会社デンソー | 内燃機関の点火装置 |
DE102020215994A1 (de) * | 2020-12-16 | 2022-06-23 | Robert Bosch Gesellschaft mit beschränkter Haftung | Zündeinrichtung für eine Brennkraftmaschine |
Family Cites Families (24)
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JP2591078B2 (ja) * | 1987-07-03 | 1997-03-19 | 日本電装株式会社 | 内燃機関用点火装置 |
JP2678817B2 (ja) * | 1990-09-21 | 1997-11-19 | 三菱電機株式会社 | 半導体装置 |
JP3193827B2 (ja) * | 1994-04-28 | 2001-07-30 | 三菱電機株式会社 | 半導体パワーモジュールおよび電力変換装置 |
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JP4455972B2 (ja) * | 2004-10-08 | 2010-04-21 | 三菱電機株式会社 | 半導体装置 |
JP2008045514A (ja) * | 2006-08-18 | 2008-02-28 | Hitachi Ltd | 内燃機関用点火装置 |
JP2008206239A (ja) * | 2007-02-17 | 2008-09-04 | Seiko Instruments Inc | 半導体装置 |
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JP5423377B2 (ja) * | 2009-12-15 | 2014-02-19 | 三菱電機株式会社 | イグナイタ用電力半導体装置 |
JP2011130564A (ja) | 2009-12-17 | 2011-06-30 | Hitachi Ltd | パワー半導体スイッチ素子の保護装置および保護方法 |
CN102418643B (zh) * | 2011-08-08 | 2013-06-26 | 同济大学 | 用于火花点燃式发动机失火控制的装置及方法 |
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WO2014034895A1 (ja) * | 2012-08-30 | 2014-03-06 | 富士電機株式会社 | イグナイタ、イグナイタの制御方法および内燃機関用点火装置 |
JP5893213B2 (ja) * | 2013-04-02 | 2016-03-23 | 三菱電機株式会社 | 半導体装置 |
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2016
- 2016-01-15 JP JP2016006366A patent/JP6805496B2/ja active Active
- 2016-11-28 CN CN201611069072.7A patent/CN107070438B/zh active Active
- 2016-11-29 US US15/364,182 patent/US10554037B2/en not_active Expired - Fee Related
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US20170207618A1 (en) | 2017-07-20 |
JP2017126953A (ja) | 2017-07-20 |
CN107070438A (zh) | 2017-08-18 |
CN107070438B (zh) | 2022-01-14 |
US10554037B2 (en) | 2020-02-04 |
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