JP6805233B2 - ダイシングダイボンディングシート、半導体チップの製造方法及び半導体装置の製造方法 - Google Patents

ダイシングダイボンディングシート、半導体チップの製造方法及び半導体装置の製造方法 Download PDF

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Publication number
JP6805233B2
JP6805233B2 JP2018504372A JP2018504372A JP6805233B2 JP 6805233 B2 JP6805233 B2 JP 6805233B2 JP 2018504372 A JP2018504372 A JP 2018504372A JP 2018504372 A JP2018504372 A JP 2018504372A JP 6805233 B2 JP6805233 B2 JP 6805233B2
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Japan
Prior art keywords
pressure
adhesive layer
sensitive adhesive
film
dicing
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JP2018504372A
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English (en)
Japanese (ja)
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JPWO2017154619A1 (ja
Inventor
鈴木　英明
英明 鈴木
さやか 土山
さやか 土山
明徳 佐藤
明徳 佐藤
なつき 梅本
なつき 梅本
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Lintec Corp
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Lintec Corp
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Publication of JPWO2017154619A1 publication Critical patent/JPWO2017154619A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP2018504372A 2016-03-10 2017-02-24 ダイシングダイボンディングシート、半導体チップの製造方法及び半導体装置の製造方法 Active JP6805233B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016046904 2016-03-10
JP2016046904 2016-03-10
PCT/JP2017/007103 WO2017154619A1 (ja) 2016-03-10 2017-02-24 ダイシングダイボンディングシート、半導体チップの製造方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2017154619A1 JPWO2017154619A1 (ja) 2019-01-10
JP6805233B2 true JP6805233B2 (ja) 2020-12-23

Family

ID=59790379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018504372A Active JP6805233B2 (ja) 2016-03-10 2017-02-24 ダイシングダイボンディングシート、半導体チップの製造方法及び半導体装置の製造方法

Country Status (6)

Country Link
JP (1) JP6805233B2 (zh)
KR (1) KR102637302B1 (zh)
CN (1) CN108713241B (zh)
SG (1) SG11201807714QA (zh)
TW (1) TWI702645B (zh)
WO (1) WO2017154619A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6978890B2 (ja) * 2017-10-16 2021-12-08 リンテック株式会社 ダイシングダイボンディングシート及び半導体チップの製造方法
EP3760423A1 (en) * 2019-07-02 2021-01-06 Essilor International Method for making optical lenses using 3d printed functional wafers
WO2021193936A1 (ja) * 2020-03-27 2021-09-30 リンテック株式会社 半導体装置製造用シート
JP7005805B1 (ja) 2021-04-28 2022-02-10 藤森工業株式会社 テープ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235795A (ja) * 2004-02-17 2005-09-02 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着テープ
JP4550680B2 (ja) 2005-07-12 2010-09-22 古河電気工業株式会社 半導体ウエハ固定用粘着テープ
CN101772831B (zh) * 2007-07-19 2011-12-21 积水化学工业株式会社 切割和芯片接合用带以及半导体芯片的制造方法
MY151354A (en) * 2007-10-09 2014-05-15 Hitachi Chemical Co Ltd Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
JP5069662B2 (ja) * 2007-11-12 2012-11-07 リンテック株式会社 粘着シート
JP2012222002A (ja) * 2011-04-04 2012-11-12 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP5786505B2 (ja) * 2011-07-08 2015-09-30 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP6287200B2 (ja) * 2013-12-27 2018-03-07 日立化成株式会社 ダイシング・ダイボンディング一体型テープ用ダイシングテープ

Also Published As

Publication number Publication date
TWI702645B (zh) 2020-08-21
CN108713241A (zh) 2018-10-26
SG11201807714QA (en) 2018-10-30
JPWO2017154619A1 (ja) 2019-01-10
CN108713241B (zh) 2023-04-11
KR20180122618A (ko) 2018-11-13
KR102637302B1 (ko) 2024-02-15
TW201802900A (zh) 2018-01-16
WO2017154619A1 (ja) 2017-09-14

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