JP6805233B2 - Dicing Die bonding sheet, semiconductor chip manufacturing method and semiconductor device manufacturing method - Google Patents

Description

The present invention relates to a method for manufacturing a dicing die bonding sheet, a semiconductor chip, and a method for manufacturing a semiconductor device.
The present application claims priority based on Japanese Patent Application No. 2016-046904 filed in Japan on March 10, 2016, the contents of which are incorporated herein by reference.

The dicing die bonding sheet is, for example, configured by providing an adhesive layer and a film-like adhesive on a base material in this order, and is used by being attached to a semiconductor wafer by the film-like adhesive. The semiconductor wafer fixed on the dicing die bonding sheet is divided together with the pressure-sensitive adhesive layer and the film-like adhesive by dicing and is separated into semiconductor chips. After that, for example, when the pressure-sensitive adhesive layer is curable, the pressure-sensitive adhesive layer is cured to reduce the adhesiveness, and the semiconductor chip provided with the film-like adhesive after cutting is subjected to the adhesion after curing. It is separated from the agent layer and picked up. The picked-up semiconductor chip is die-bonded to the circuit surface of the substrate by a film-like adhesive, and if necessary, one or more other semiconductor chips are laminated on the semiconductor chip, wire-bonded, and then the whole. Is sealed with resin. Finally, the target semiconductor device is manufactured using the semiconductor package thus obtained.

Dicing is performed, for example, by using a dicing blade and cutting a semiconductor wafer while rotating the dicing blade. However, in this dicing method, the dicing blade cuts at least a part of the semiconductor wafer and the dicing die bonding sheet, so that cutting chips are generated. Although dicing is performed while cleaning the cut portion with water, the cutting chips cannot be completely washed away. Therefore, if the amount of cutting chips is large, a part of the cutting chips will be obtained after dicing, or this semiconductor. It easily adheres to the cut film-like adhesive provided on the chip and remains. However, a semiconductor chip provided with a film-like adhesive after cutting may not be able to be picked up normally if cutting chips remain in this way. That is, if the amount of cutting chips generated during dicing is large, it causes a pickup failure.

On the other hand, when dicing a semiconductor wafer using a dicing blade, an adhesive having a storage elastic coefficient at 60 to 100 ° C. within a specific range can be used to suppress adhesion of cutting chips to the semiconductor chip. A semiconductor wafer fixing adhesive tape having a radiation-curable acrylic pressure-sensitive adhesive layer provided on a base film is disclosed (see Patent Document 1). This tape corresponds to a dicing sheet, and a film-like adhesive (that is, a die bond film) is further provided on the pressure-sensitive adhesive layer and used for dicing.

Japanese Unexamined Patent Publication No. 2007-0272115

However, according to Patent Document 1, when dicing using a dicing blade, the generation of cutting chips can be suppressed by using the dicing sheet (that is, the adhesive tape for fixing a semiconductor wafer) described in the above document. Although disclosed, the pick-up suitability of a semiconductor chip provided with a film-like adhesive is not disclosed.

Therefore, the present invention relates to a dicing die bonding sheet capable of reducing the amount of cutting chips generated during dicing of a semiconductor wafer using a dicing blade and suppressing the occurrence of pick-up defects of a semiconductor chip provided with a film-like adhesive. It is an object of the present invention to provide a method for manufacturing a semiconductor chip and a method for manufacturing a semiconductor device using the above.

In order to solve the above problems, the present invention comprises a pressure-sensitive adhesive layer on a base material and a film-like adhesive on the pressure-sensitive adhesive layer, and the thickness of the pressure-sensitive adhesive layer is 20 μm to 50 μm. Provided is a dicing die bonding sheet in which the breaking elongation of the pressure-sensitive adhesive layer is 5 to 50%.
In the dicing die bonding sheet of the present invention, it is preferable that the pressure-sensitive adhesive layer is non-energy ray-curable.
In the dicing die bonding sheet of the present invention, the adhesive force of the adhesive layer to the film-like adhesive is preferably 35 to 300 mN / 25 mm.

Further, the present invention is a method for manufacturing a semiconductor chip using the dicing die bonding sheet, which is opposite to the side of the film-like adhesive in the dicing die bonding sheet on which the pressure-sensitive adhesive layer is provided. A step of forming an intermediate structure in which a semiconductor wafer is provided on a side surface and a dicing blade are used to reach the pressure-sensitive adhesive layer from the surface of the semiconductor wafer in the intermediate structure and the base. Provided is a method for manufacturing a semiconductor chip, which comprises a step of dividing the semiconductor wafer to form a semiconductor chip by forming a notch that does not reach the material.
Further, in the present invention, after performing the step of forming the semiconductor chip by the method of manufacturing the semiconductor chip, a force is applied from the base material side to the dicing die bonding sheet after forming the notch. Provided is a method for manufacturing a semiconductor device, which comprises a step of separating the semiconductor chip from the pressure-sensitive adhesive layer together with the film-like adhesive after cutting.

According to the present invention, a dicing die bonding sheet capable of reducing the amount of cutting chips generated during dicing of a semiconductor wafer using a dicing blade and suppressing the occurrence of pick-up defects of a semiconductor chip provided with a film-like adhesive, and a dicing die bonding sheet. A method for manufacturing a semiconductor chip and a method for manufacturing a semiconductor device using this are provided.

It is sectional drawing which shows typically one Embodiment of the dicing die bonding sheet of this invention. It is sectional drawing which shows typically the other embodiment of the dicing die bonding sheet of this invention. It is sectional drawing which shows typically the other embodiment of the dicing die bonding sheet of this invention. It is sectional drawing for schematically explaining one Embodiment of the manufacturing method of the semiconductor chip of this invention. It is an enlarged cross-sectional view which shows typically one Embodiment of the semiconductor chip obtained by the manufacturing method of this invention. FIG. 5 is a cross-sectional view schematically showing an example of a state in which a notch is formed in an intermediate structure by using a dicing blade in a dicing step. It is an enlarged sectional view schematically showing an example of the semiconductor chip obtained by the conventional manufacturing method. It is sectional drawing for schematically explaining one Embodiment of the manufacturing method of the semiconductor device of this invention.

<< Dicing Die Bonding Sheet >>
The dicing die bonding sheet of the present invention comprises a pressure-sensitive adhesive layer on a base material and a film-like adhesive on the pressure-sensitive adhesive layer, and the thickness of the pressure-sensitive adhesive layer is 20 μm to 50 μm. The breaking elongation of the agent layer is 5 to 50%.
The dicing die bonding sheet of the present invention is a semiconductor chip provided with dicing using a dicing blade of a semiconductor wafer (that is, blade dicing) followed by a film-like adhesive after cutting (in the present specification, "film-like". It is suitable for use when picking up a semiconductor chip with an adhesive (sometimes referred to as "semiconductor chip with adhesive").

In dicing using a dicing blade, the dicing blade is rotated to cut a semiconductor wafer. At this time, since the dicing blade cuts at least a part of the semiconductor wafer and the dicing die bonding sheet, cutting chips are generated. The cutting chips are generated from any layer of the semiconductor wafer and the dicing die bonding sheet, and are suspended substances such as powdery or fibrous, or are not completely separated from any of the above-mentioned layers. , It remains like a whiskers. If the amount of cutting chips generated is large, a part of the cutting chips tends to adhere to the semiconductor chip or the cut film-like adhesive and remain. If the cutting chips remain in this way, the semiconductor chip with the film-like adhesive may not be picked up normally, which causes a pickup failure. Further, even if it can be picked up, the semiconductor device manufactured with the cutting chips remaining may not function normally.

On the other hand, in the dicing die bonding sheet of the present invention, the thickness of the pressure-sensitive adhesive layer and the elongation at break are within the above ranges, so that the amount of cutting chips generated during dicing of a semiconductor wafer using a dicing blade Can be reduced. As a result, it is possible to suppress the occurrence of pick-up defects in the semiconductor chip with a film-like adhesive.
Hereinafter, first, each layer constituting the dicing die bonding sheet of the present invention will be described.

<Base material>
The constituent material of the base material is preferably various resins, and specifically, for example, polyethylene (low density polyethylene (sometimes abbreviated as LDPE), linear low density polyethylene (sometimes abbreviated as LLDPE)). , High density polyethylene (sometimes abbreviated as HDPE), polypropylene, polybutene, polybutadiene, polymethylpentene, styrene / ethylenebutylene / styrene block copolymer, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, poly Butylene terephthalate, polyurethane, polyurethane acrylate, polyimide, ethylene vinyl acetate copolymer, ionomer resin, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, fluororesin, Examples thereof include water additives, modified products, crosslinked products, copolymers and the like of any of these resins.

In addition, in this specification, "(meth) acrylic acid" is a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth) acrylic acid. For example, "(meth) acrylate" is a concept that includes both "acrylate" and "methacrylate", and is referred to as "(meth) acryloyl group". Is a concept that includes both "acryloyl group" and "methacryloyl group".

The resin constituting the base material may be of only one type, may be of two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

The base material may be composed of one layer (that is, a single layer) or may be composed of two or more layers. When the base material is composed of a plurality of layers, the plurality of layers may be the same or different from each other. That is, all layers may be the same, all layers may be different, and only some layers may be the same. When the plurality of layers are different from each other, the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired. Here, when the plurality of layers are different from each other, it means that at least one of the material and the thickness of each layer is different from each other.
In the present specification, not only in the case of a base material, "a plurality of layers may be the same or different from each other" means "all layers may be the same or all layers are different". It means that only some of the layers may be the same, and that "plurality of layers are different from each other" means that "at least one of the constituent materials and thickness of each layer is different from each other". Means.

The thickness of the base material can be appropriately selected depending on the intended purpose, but is preferably 50 μm to 300 μm, and more preferably 60 μm to 100 μm.
Here, the "thickness of the base material" means the thickness of the entire base material, for example, the thickness of the base material composed of a plurality of layers means the total thickness of all the layers constituting the base material. means. Examples of the method for measuring the thickness of the base material include a method of measuring the thickness at any five points using a contact type thickness gauge and calculating the average of the measured values.

In order to improve the adhesion of the base material to other layers such as the pressure-sensitive adhesive layer provided on the base material, unevenness treatment by sandblasting treatment, solvent treatment, embossing treatment, etc., corona discharge treatment, electron beam irradiation, etc. The surface may be subjected to oxidation treatment such as treatment, plasma treatment, ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, and hot air treatment.
Further, the base material may have a surface surface treated with a primer.
Further, the base material is a layer that prevents the base material from adhering to another sheet or the base material from adhering to the adsorption table when the antistatic coat layer and the dicing die bonding sheet are stacked and stored. It may have.

<Adhesive layer>
The pressure-sensitive adhesive layer satisfies the conditions of thickness and elongation at break shown below, and is preferably non-energy ray-curable.
In the present invention, "non-energy ray curable" means a property that does not cure even when irradiated with energy rays. On the contrary, the property of being cured by irradiating with energy rays is called "energy ray curability".
In the present invention, the "energy beam" means an electromagnetic wave or a charged particle beam having an energy quantum, and examples thereof include ultraviolet rays and electron beams.
Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion H lamp, a xenon lamp, or the like as an ultraviolet source. The electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.

The pressure-sensitive adhesive layer may be only one layer (that is, a single layer), may be a plurality of layers of two or more layers, and when there are a plurality of layers, the plurality of layers may be the same or different from each other, and the plurality of layers may be used. The combination is not particularly limited.

The thickness of the pressure-sensitive adhesive layer is 20 μm to 50 μm, preferably 20 μm to 45 μm, more preferably 20 μm to 40 μm, and particularly preferably 20 μm to 35 μm. When the thickness of the pressure-sensitive adhesive layer is at least the above lower limit value, higher adhesive strength can be obtained with respect to the adherend (that is, the film-like adhesive). On the other hand, when the thickness of the pressure-sensitive adhesive layer is not more than the upper limit value, the semiconductor chip with a film-like adhesive can be more easily separated and picked up in the separation step described later, and the semiconductor wafer is diced using a dicing blade. At times, the amount of cutting chips generated can be further reduced. Further, it is possible to avoid an excessive thickness of the pressure-sensitive adhesive layer, reduce the production cost of the dicing die bonding sheet, stably form the pressure-sensitive adhesive layer, and further stabilize the production of the dicing die bonding sheet. ..
Here, the "thickness of the pressure-sensitive adhesive layer" means the thickness of the entire pressure-sensitive adhesive layer, and for example, the thickness of the pressure-sensitive adhesive layer composed of a plurality of layers is the sum of all the layers constituting the pressure-sensitive adhesive layer. Means the thickness of. Examples of the method for measuring the thickness of the pressure-sensitive adhesive layer include a method in which the thickness is measured at any five locations using a contact-type thickness gauge and the average of the measured values is calculated.

The elongation at break of the pressure-sensitive adhesive layer is 5 to 50%, preferably 6 to 46%, more preferably 7 to 44%, and particularly preferably 8 to 42%. When the breaking elongation of the pressure-sensitive adhesive layer is at least the above lower limit value, the pressure-sensitive adhesive layer is stretched (that is, expanded) in the process of pulling the semiconductor chip with the film-like adhesive from the pressure-sensitive adhesive layer and picking it up. Occasionally, cracking of the pressure-sensitive adhesive layer at an unintended location is highly suppressed, and the dicing die bonding sheet has better properties. On the other hand, when the breaking elongation of the pressure-sensitive adhesive layer is not more than the above upper limit value, the amount of cutting chips generated during dicing of a semiconductor wafer using a dicing blade can be reduced, and the semiconductor chip with a film-like adhesive after dicing can be reduced. Can be easily pulled away from the adhesive layer and picked up.

In the present specification, "breaking elongation of the pressure-sensitive adhesive layer" means "breaking elongation of the pressure-sensitive adhesive layer before curing" when the pressure-sensitive adhesive layer is curable, unless otherwise specified. means. Further, the breaking elongation means the breaking elongation of the pressure-sensitive adhesive layer at room temperature unless otherwise specified. In the present specification, the "room temperature" means a temperature that is not particularly cooled or heated, that is, a normal temperature, and examples thereof include a temperature of 15 to 25 ° C.

In the present invention, the breaking elongation of the pressure-sensitive adhesive layer is such that the pressure-sensitive adhesive layer having a width of 10 mm and a thickness of 0.03 mm is fixed at two places so that the distance between the fixing places is 10 mm, and the tensile speed is 1000 mm / min. As a result, the pressure-sensitive adhesive layer is pulled between the fixed portions, and the elongation of the pressure-sensitive adhesive layer when the pressure-sensitive adhesive layer is broken is measured.
In the present specification, "the elongation at break is X% (X is a positive number in the formula)" means that the pressure-sensitive adhesive layer is pulled and the pressure-sensitive adhesive layer is pulled by the above-mentioned measuring method. When extended by X% of the original length (ie, the length when not pulled) in the direction, that is, the total length of the pressure-sensitive adhesive layer in the tensile direction is the length before pulling [1 + X It means that the pressure-sensitive adhesive layer breaks when it becomes / 100] times.

The elongation at break of the pressure-sensitive adhesive layer can be appropriately adjusted by, for example, adjusting the type and amount of the components contained in the pressure-sensitive adhesive layer. For example, the breaking elongation of the pressure-sensitive adhesive layer can be easily adjusted by adjusting the type of the constituent unit and the content ratio thereof in the pressure-sensitive adhesive resin, which is a component contained in the pressure-sensitive adhesive layer. Further, by adjusting the content of the adhesive resin or the cross-linking agent of the pressure-sensitive adhesive layer, the breaking elongation of the pressure-sensitive adhesive layer can be easily adjusted. However, these adjustment methods are only examples.

In the present invention, the adhesive force of the pressure-sensitive adhesive layer to the film-like adhesive is not particularly limited as long as the effect of the present invention is not impaired, but is preferably 35 to 300 mN / 25 mm, and preferably 45 to 100 mN / 25 mm. More preferred.
When the adhesive strength is 35 mN / 25 mm or more, the laminated structure of the adhesive layer and the film-like adhesive can be more stably maintained in the dicing die bonding sheet. Further, when the adhesive force is 45 mN / 25 mm or more, so-called chip skipping, in which the semiconductor chip is scattered by the force applied to the semiconductor chip during dicing of the semiconductor wafer, is further suppressed.
On the other hand, when the adhesive force is 300 mN / 25 mm or less, the adhesive force of the adhesive layer to the film-like adhesive becomes appropriately small, and as will be described later, the adhesive layer is not cured by energy ray irradiation or the like. However, the semiconductor chip with a film-like adhesive after dying can be easily separated from the adhesive layer and picked up. Further, at this time, it is possible to prevent the semiconductor chip with the film-like adhesive from being picked up while a part of the pressure-sensitive adhesive layer remains attached to the film-like adhesive. Further, since the adhesive force is 100 mN / 25 mm or less, when a semiconductor chip with a film-like adhesive is pushed up and pulled away from the pressure-sensitive adhesive layer for picking up, it can be easily picked up with a small amount of pushing up, for example, a semiconductor chip. So-called chipping, in which cracks and chips occur, is further suppressed.

In addition, in this specification, "adhesive force of an adhesive layer to a film-like adhesive" means "a film of an adhesive layer before curing" when the adhesive layer is curable, unless otherwise specified. It means "adhesive strength to adhesive". Further, the adhesive strength means the adhesive strength of the pressure-sensitive adhesive layer at room temperature unless otherwise specified.

In the present invention, the adhesive strength (mN / 25 mm) can be measured by the following method. That is, the dicing die bonding sheet having a width of 25 mm and an arbitrary length is produced.
Next, at room temperature (for example, 23 ° C.), the dicing die bonding sheet is attached to the fixing base material with a film-like adhesive. Here, the "fixing base material" may be any shape as long as it can firmly fix the film-like adhesive of the dicing die bonding sheet, and the shape may be a sheet shape or any other shape. Often, for example, an adhesive base material having an adhesive surface as a fixing surface of a film-like adhesive (in other words, a dicing die bonding sheet) can be mentioned.
Next, at room temperature (for example, 23 ° C.), the laminate of the base material and the pressure-sensitive adhesive layer is formed from the film-like adhesive, and the surfaces of the film-like adhesive and the pressure-sensitive adhesive layer that are in contact with each other are at an angle of 180 °. As a result, peeling is performed at a peeling speed of 300 mm / min, so-called 180 ° peeling. The peeling force at this time is measured, and the measured value is defined as the adhesive force (mN / 25 mm).
The length of the dicing die bonding sheet used for the measurement is not particularly limited as long as the peeling force can be stably measured.

The adhesive strength of the pressure-sensitive adhesive layer to the film-like adhesive can be appropriately adjusted by, for example, adjusting the type and amount of the components contained in the pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive layer, and the like. For example, the adhesive strength can be easily adjusted by adjusting the type of the structural unit and the content ratio thereof in the adhesive resin described later, which is a component contained in the pressure-sensitive adhesive layer. Further, the adhesive force can be easily adjusted by adjusting the content of the adhesive resin or the cross-linking agent in the adhesive layer. However, these adjustment methods are only examples.

In the present invention, the elastic modulus of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 30 to 140 MPa, more preferably 35 to 130 MPa, and particularly preferably 40 to 120 MPa. When the elastic coefficient of the pressure-sensitive adhesive layer is equal to or higher than the lower limit value, the pressure-sensitive adhesive layer is not excessively soft, so that excessive followability to the film-like adhesive is suppressed, and the semiconductor chip with the film-like adhesive is prevented from becoming excessive. Tends to be easier to pick up when picking up away from the adhesive layer. Further, since the elastic modulus of the pressure-sensitive adhesive layer is not more than the upper limit value and the pressure-sensitive adhesive layer is not excessively hard, when the semiconductor chip with a film-like adhesive is pushed up and pulled away from the pressure-sensitive adhesive layer for picking up. , The adhesive layer is easily deformed and can be picked up more easily.

In the present specification, the "elastic modulus of the pressure-sensitive adhesive layer" is the same as the case of the above-mentioned "breaking elongation of the pressure-sensitive adhesive layer" when the pressure-sensitive adhesive layer is curable unless otherwise specified. Means "elastic modulus of the pressure-sensitive adhesive layer before curing". Further, the elastic modulus means the elastic modulus of the pressure-sensitive adhesive layer at room temperature unless otherwise specified.

In the present invention, the elastic modulus of the pressure-sensitive adhesive layer can be measured at the same time as the above-mentioned measurement of the elongation at break of the pressure-sensitive adhesive layer.

The elastic modulus of the pressure-sensitive adhesive layer can be appropriately adjusted by, for example, adjusting the type and amount of the components contained in the pressure-sensitive adhesive layer. For example, the elastic modulus of the pressure-sensitive adhesive layer can be easily adjusted by adjusting the type of the constituent unit and the content ratio thereof in the pressure-sensitive adhesive resin, which is a component contained in the pressure-sensitive adhesive layer. Further, by adjusting the content of the adhesive resin or the cross-linking agent of the pressure-sensitive adhesive layer, the elastic modulus of the pressure-sensitive adhesive layer can be easily adjusted. However, these adjustment methods are only examples.

The pressure-sensitive adhesive layer can form a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive. For example, the pressure-sensitive adhesive layer can be formed on a target portion by applying the pressure-sensitive adhesive composition to the surface to be formed of the pressure-sensitive adhesive layer and drying it if necessary. A more specific method for forming the pressure-sensitive adhesive layer will be described in detail later together with a method for forming the other layers. The ratio of the contents of the components that do not vaporize at room temperature in the pressure-sensitive adhesive composition is usually the same as the ratio of the contents of the components in the pressure-sensitive adhesive layer.

The pressure-sensitive adhesive composition may be applied by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, and a screen coater. , A method using various coaters such as a Meyer bar coater and a kiss coater.

The drying conditions of the pressure-sensitive adhesive composition are not particularly limited, but when the pressure-sensitive adhesive composition contains a solvent described later, it is preferably dried by heating. In this case, for example, at 70 to 130 ° C. for 10 seconds to It is preferable to dry under the condition of 5 minutes.

[Adhesive composition]
The pressure-sensitive adhesive composition is preferably non-energy ray-curable.
Examples of the non-energy ray-curable pressure-sensitive adhesive composition include an acrylic resin (that is, a resin having a (meth) acryloyl group), a urethane resin (that is, a resin having a urethane bond), and a rubber resin (that is, a resin having a urethane bond). Adhesive resin such as rubber structure resin), silicone resin (that is, resin having siloxane bond), epoxy resin (that is, resin having epoxy group), polyvinyl ether, or polycarbonate (hereinafter, "adhesive resin") (I) ") is included.

(Adhesive resin (i))
The adhesive resin (i) is preferably an acrylic resin.
Examples of the acrylic resin in the adhesive resin (i) include an acrylic polymer having a structural unit derived from at least a (meth) acrylic acid alkyl ester.
The structural unit of the acrylic resin may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

Examples of the (meth) acrylic acid alkyl ester include those in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms, and the alkyl group is linear or branched. Is preferable.
More specifically, as the (meth) acrylic acid alkyl ester, methyl (meth) acrylic acid, ethyl (meth) acrylic acid, n-propyl (meth) acrylic acid, isopropyl (meth) acrylic acid, (meth) acrylic acid. n-butyl, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, 2-Ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, (meth) ) Undecyl acrylate, dodecyl (meth) acrylate (also called (meth) lauryl acrylate), tridecyl (meth) acrylate, tetradecyl (meth) acrylate (also called myristyl (meth) acrylate), (meth) acrylic Pentadecyl acrylate, hexadecyl (meth) acrylate (also called palmityl acrylate), heptadecyl (meth) acrylate, octadecyl (meth) acrylate (also called stearyl acrylate), nonadecil (meth) acrylate , (Meta) icosyl acrylate and the like.

From the viewpoint of improving the adhesive strength of the pressure-sensitive adhesive layer, the acrylic polymer preferably has a structural unit derived from a (meth) acrylic acid alkyl ester having 4 or more carbon atoms in the alkyl group. The alkyl group preferably has 4 to 12 carbon atoms, and more preferably 4 to 8 carbon atoms, from the viewpoint of further improving the adhesive force of the pressure-sensitive adhesive layer. Further, the (meth) acrylic acid alkyl ester having 4 or more carbon atoms in the alkyl group is preferably an acrylic acid alkyl ester.

The acrylic polymer preferably has a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the (meth) acrylic acid alkyl ester.
The functional group-containing monomer may be, for example, a starting point of cross-linking when the functional group reacts with a cross-linking agent described later, or when the functional group reacts with an unsaturated group in an unsaturated group-containing compound. Examples thereof include those capable of introducing an unsaturated group into the side chain of the acrylic polymer.

Examples of the functional group in the functional group-containing monomer include a hydroxyl group, a carboxy group, an amino group, an epoxy group and the like.
That is, examples of the functional group-containing monomer include a hydroxyl group-containing monomer, a carboxy group-containing monomer, an amino group-containing monomer, and an epoxy group-containing monomer.

Examples of the hydroxyl group-containing monomer include hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and (meth). (Meta) hydroxyalkyl acrylates such as 2-hydroxybutyl acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate; non- (meth) acrylics such as vinyl alcohol and allyl alcohol. Saturated alcohols (ie, unsaturated alcohols that do not have a (meth) acrylic skeleton) and the like can be mentioned.

Examples of the carboxy group-containing monomer include ethylenically unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid (that is, monocarboxylic acids having ethylenically unsaturated bonds); fumaric acid, itaconic acid, and maleic acid. , Citraconic acid and other ethylenically unsaturated dicarboxylic acids (ie, dicarboxylic acids with ethylenically unsaturated bonds); the anhydrides of the ethylenically unsaturated dicarboxylic acids; carboxyalkyl (meth) acrylates such as 2-carboxyethyl methacrylate. Examples include esters.

As the functional group-containing monomer, a hydroxyl group-containing monomer and a carboxy group-containing monomer are preferable, and a hydroxyl group-containing monomer is more preferable.

The functional group-containing monomer constituting the acrylic polymer may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be arbitrarily selected.

In the acrylic polymer, the content of the structural unit derived from the functional group-containing monomer is preferably 1 to 35% by mass, more preferably 3 to 32% by mass, based on the total amount of the structural units. , 5 to 30% by mass is particularly preferable.

The acrylic polymer may further have a structural unit derived from another monomer in addition to the structural unit derived from the (meth) acrylic acid alkyl ester and the structural unit derived from the functional group-containing monomer.
The other monomer is not particularly limited as long as it can be copolymerized with a (meth) acrylic acid alkyl ester or the like.
Examples of the other monomer include styrene, α-methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile, acrylamide and the like.

The other monomer constituting the acrylic polymer may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be arbitrarily selected.

It is preferable that the adhesive resin (i) other than the acrylic polymer also has a structural unit derived from the functional group-containing monomer, like the acrylic polymer.

The pressure-sensitive adhesive resin (i) contained in the pressure-sensitive adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition, the ratio of the content of the pressure-sensitive adhesive resin (i) to the total content of the components other than the solvent (that is, the content of the pressure-sensitive adhesive resin (i) in the pressure-sensitive adhesive layer) is 40 to 95% by mass. It is preferably 50 to 95% by mass, more preferably 60 to 90% by mass, and particularly preferably 60 to 90% by mass. When the ratio of the content of the adhesive resin (i) is in such a range, the adhesiveness of the pressure-sensitive adhesive layer becomes better.

(Crosslinking agent (ii))
The pressure-sensitive adhesive composition preferably contains a cross-linking agent (ii).
The cross-linking agent (ii) is, for example, one that reacts with the functional group to cross-link the adhesive resins (i) with each other.
Examples of the cross-linking agent (ii) include isocyanate-based cross-linking agents such as tolylene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates (that is, cross-linking agents having an isocyanate group); ethylene glycol glycidyl ether and the like. Epoxy-based cross-linking agent (ie, cross-linking agent having a glycidyl group); Aziridine-based cross-linking agent such as hexa [1- (2-methyl) -aziridinyl] triphosphatriazine (ie, cross-linking agent having an aziridinyl group); aluminum chelate And the like (that is, a cross-linking agent having a metal chelate structure); an isocyanurate-based cross-linking agent (that is, a cross-linking agent having an isocyanurate skeleton) and the like.
The cross-linking agent (ii) is preferably an isocyanate-based cross-linking agent from the viewpoints of improving the cohesive force of the pressure-sensitive adhesive to improve the adhesive force of the pressure-sensitive adhesive layer and being easily available.

The cross-linking agent (ii) contained in the pressure-sensitive adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

When the pressure-sensitive adhesive composition contains a cross-linking agent (ii), the content of the cross-linking agent (ii) in the pressure-sensitive adhesive composition is 5 to 5 when the content of the pressure-sensitive adhesive resin (i) is 100 parts by mass. It is preferably 100 parts by mass, more preferably 10 to 80 parts by mass, and particularly preferably 15 to 60 parts by mass. When the content of the cross-linking agent (ii) is at least the lower limit value, the effect of using the cross-linking agent (ii) can be obtained more remarkably. Further, when the content of the cross-linking agent (ii) is not more than the upper limit value, it becomes easier to adjust the adhesive force of the pressure-sensitive adhesive layer to the film-like adhesive.

(Other additives)
The pressure-sensitive adhesive composition may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
The other additives include, for example, antistatic agents, antioxidants, softeners (ie, plasticizers), fillers (ie, fillers), rust inhibitors, colorants (ie, pigments or dyes), augmentations. Known additives such as sensitizers, tackifiers, reaction retarders, cross-linking accelerators (ie, catalysts) and the like can be mentioned.
The "reaction retarder" is, for example, a substance that suppresses the progress of an unintended cross-linking reaction in the pressure-sensitive adhesive composition during storage due to the action of a catalyst mixed in the pressure-sensitive adhesive composition. is there. Examples of the reaction retarder include those that form a chelate complex by chelating to a catalyst, and more specifically, those having two or more carbonyl groups (-C (= O)-) in one molecule. Can be mentioned.

The other additives contained in the pressure-sensitive adhesive composition may be only one kind, two or more kinds, and when two or more kinds, the combination and ratio thereof can be arbitrarily selected.

The content of the other additives in the pressure-sensitive adhesive composition is not particularly limited, and may be appropriately selected depending on the type thereof.

(solvent)
The pressure-sensitive adhesive composition may contain a solvent. Since the pressure-sensitive adhesive composition contains a solvent, the suitability for coating on the surface to be coated is improved.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; carboxylic acid esters such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; aliphatic groups such as cyclohexane and n-hexane. Hydrocarbons; aromatic hydrocarbons such as toluene and xylene; alcohols such as 1-propanol and 2-propanol.

As the solvent, for example, the solvent used in the production of the adhesive resin (i) may be used as it is in the adhesive composition without removing it from the adhesive resin (i), or the adhesive resin (i) may be used as it is. The same or different type of solvent as that used in the production may be added separately in the production of the pressure-sensitive adhesive composition.

The solvent contained in the pressure-sensitive adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition, the content of the solvent is not particularly limited and may be appropriately adjusted.

[Manufacturing method of adhesive composition]
The pressure-sensitive adhesive composition is obtained by blending each component for constituting the pressure-sensitive adhesive composition.
The order of addition of each component at the time of blending is not particularly limited, and two or more kinds of components may be added at the same time.
When a solvent is used, the solvent may be mixed with any compounding component other than the solvent and diluted in advance, or any compounding component other than the solvent may be diluted in advance. You may use it by mixing the solvent with these compounding components without leaving.

The method of mixing each component at the time of blending is not particularly limited, and from known methods such as a method of rotating a stirrer or a stirring blade to mix; a method of mixing using a mixer; a method of adding ultrasonic waves to mix. It may be selected as appropriate.
The temperature and time at the time of addition and mixing of each component are not particularly limited as long as each compounding component does not deteriorate, and may be appropriately adjusted, but the temperature is preferably 15 to 30 ° C.

<Film-like adhesive>
The film-like adhesive is not particularly limited as long as the effects of the present invention are not impaired, and known ones can be appropriately used.

The film-like adhesive has curability, preferably thermosetting, and preferably pressure-sensitive adhesive. The film-like adhesive having both thermosetting property and pressure-sensitive adhesive property can be attached by lightly pressing against various adherends in an uncured state. Further, the film-like adhesive may be one that can be attached to various adherends by heating and softening. The film-like adhesive eventually becomes a cured product having high impact resistance by curing, and this cured product can retain sufficient adhesive properties even under severe high temperature and high humidity conditions.

The film-like adhesive may be composed of one layer (that is, a single layer) or may be composed of two or more layers. When the film-like adhesive consists of a plurality of layers, the plurality of layers may be the same or different from each other. That is, all layers may be the same, all layers may be different, and only some layers may be the same. When the plurality of layers are different from each other, the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired. Here, when the plurality of layers are different from each other, it means that at least one of the material and the thickness of each layer is different from each other.

The thickness of the film-like adhesive is not particularly limited, but is preferably 1 μm to 50 μm, and more preferably 3 μm to 40 μm. When the thickness of the film-like adhesive is at least the above lower limit value, a higher adhesive force can be obtained with respect to the adherend (that is, the semiconductor chip). On the other hand, when the thickness of the film-like adhesive is not more than the upper limit value, the film-like adhesive can be cut more easily in the division step described later, and the film-like adhesive is cut during dicing of the semiconductor wafer using the dicing blade. The amount of waste generated can be further reduced.
Here, the "thickness of the film-like adhesive" means the thickness of the entire film-like adhesive, and for example, the thickness of the film-like adhesive composed of a plurality of layers is all that constitute the film-like adhesive. Means the total thickness of the layers of. Examples of the method for measuring the thickness of the film-like adhesive include a method of measuring the thickness at any five locations using a contact-type thickness gauge and calculating the average of the measured values.

Preferred film-like adhesives include, for example, those containing a polymer component (a) and an epoxy-based thermosetting resin (b). Examples of the epoxy-based thermosetting resin (b) include those made of an epoxy resin (b1) and a thermosetting agent (b2).
In addition to the polymer component (a) and the epoxy-based thermosetting resin (b), the film-like adhesive has other components that do not correspond to these, if necessary, in order to improve its various physical properties. May be contained. Preferred other components include, for example, a curing accelerator (c), a filler (d), a coupling agent (e), a cross-linking agent (f), an energy ray-curable resin (g), and photopolymerization initiation. Examples thereof include the agent (h) and the general-purpose additive (i). The general-purpose additive (i) may be a known one, and may be arbitrarily selected depending on the intended purpose, and is not particularly limited, but preferred ones are, for example, a plasticizer, an antistatic agent, an antioxidant, and a colorant (that is,). , Dyes or pigments), gettering agents and the like.

[Adhesive composition]
The film-like adhesive can form an adhesive composition containing its constituent materials. For example, a film-like adhesive can be formed on a target portion by applying the adhesive composition to the surface to be formed of the film-like adhesive and drying it if necessary. A more specific method for forming the film-like adhesive will be described in detail later together with a method for forming other layers. The ratio of the contents of the components that do not vaporize at room temperature in the adhesive composition is usually the same as the ratio of the contents of the components in the film-like adhesive.

The coating of the adhesive composition can be carried out in the same manner as in the case of coating the adhesive composition described above.

The drying conditions of the adhesive composition are not particularly limited, but when the adhesive composition contains a solvent described later, it is preferably heat-dried. In this case, for example, at 70 to 130 ° C. for 10 seconds to It is preferable to dry under the condition of 5 minutes.

Preferred adhesive compositions include, for example, those containing the above-mentioned polymer component (a), epoxy-based thermosetting resin (b), and, if necessary, the other components and solvent.

Examples of the solvent contained in the adhesive composition include hydrocarbons such as toluene and xylene; methanol, ethanol, 2-propanol, isobutyl alcohol (that is, 2-methylpropan-1-ol), 1-butanol and the like. Examples thereof include alcohols; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (that is, compounds having an amide bond).
The solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the adhesive composition can be mixed more uniformly.

As the solvent contained in the adhesive composition, for example, the solvent used in the production of each component such as the polymer component (a) may be used as it is in the adhesive composition without being removed from each component. The same or different types of solvents used in the production of each component such as the polymer component (a) may be added separately during the production of the adhesive composition.

Each component such as the polymer component (a) contained in the adhesive composition and the film-like adhesive may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof are It can be selected arbitrarily.
The content of each component such as the polymer component (a) in the adhesive composition and the film-like adhesive is not particularly limited and may be appropriately selected depending on the intended purpose.

[Manufacturing method of adhesive composition]
The adhesive composition can be obtained by blending each component for constituting the adhesive composition, and can be produced by the same method as the above-mentioned manufacturing method of the pressure-sensitive adhesive composition except that the compounding components are different.

Next, the dicing die bonding sheet of the present invention will be described in more detail with reference to the drawings. In addition, in the figure used in the following description, in order to make it easy to understand the features of the present invention, the main part may be enlarged for convenience, and the dimensional ratio of each component is the same as the actual one. Is not always the case.

FIG. 1 is a cross-sectional view schematically showing an embodiment of a dicing die bonding sheet of the present invention.
The dicing die bonding sheet 101 shown here is provided with an adhesive layer 12 on the base material 11 and a film-like adhesive 13 on the adhesive layer 12. Further, the dicing die bonding sheet 101 further includes a release film 15 on the film-like adhesive 13.

In the dicing die bonding sheet 101, the pressure-sensitive adhesive layer 12 is laminated on one surface of the base material 11 (hereinafter, may be referred to as “first surface 11a”), and the base material 11 of the pressure-sensitive adhesive layer 12 is provided. The film-like adhesive 13 is laminated on the entire surface of the surface opposite to the side facing the surface (hereinafter, may be referred to as "first surface 12a"), and the pressure-sensitive adhesive layer 12 of the film-like adhesive 13 is provided. The adhesive layer 14 for jigs is laminated on a part of the surface (hereinafter, may be referred to as "first surface 13a") on the side opposite to the side where the adhesive is provided, that is, in the region near the peripheral edge, and the film-like adhesive is formed. Of the first surfaces 13a of 13, the surface on which the jig adhesive layer 14 is not laminated and the surface of the jig adhesive layer 14 that are not in contact with the film-like adhesive 13 (that is, the first surface 14a). The release film 15 is laminated on the side surface 14c). Here, the first surface 14a of the jig adhesive layer 14 is the surface of the jig adhesive layer 14 opposite to the side in contact with the film-like adhesive 13, and is used for jig adhesion. In some cases, the boundary between the first surface 14a and the side surface 14c of the agent layer 14 cannot be clearly distinguished.
As described above, the pressure-sensitive adhesive layer 12 has a thickness of 20 μm to 50 μm and a breaking elongation of 5 to 50%.

The adhesive layer 14 for jigs may have, for example, a single-layer structure containing an adhesive component, or a plurality of layers in which layers containing an adhesive component are laminated on both sides of a sheet serving as a core material. It may be of a structure.

In the dicing die bonding sheet 101 shown in FIG. 1, in a state where the release film 15 is removed, the first surface 13a of the film-like adhesive 13 is a surface on which a circuit of a semiconductor wafer (not shown) is formed (the present specification). It is affixed to the surface opposite to the "circuit forming surface" (which may be abbreviated as "circuit forming surface" in the present specification) (which may be abbreviated as "back surface" in this specification), and further, the adhesive layer for jig 14 The first surface 14a of the above is attached to a jig such as a ring frame and used.

FIG. 2 is a cross-sectional view schematically showing another embodiment of the dicing die bonding sheet of the present invention. In the drawings after FIG. 2, the same components as those shown in FIG. 1 are designated by the same reference numerals as in the case of FIG. 1, and detailed description thereof will be omitted.

The dicing die bonding sheet 102 shown here is the same as the dicing die bonding sheet 101 shown in FIG. 1 except that the jig adhesive layer 14 is not provided.
That is, in the dicing die bonding sheet 102, the pressure-sensitive adhesive layer 12 is laminated on the first surface 11a of the base material 11, and the film-like adhesive 13 is laminated on the entire surface of the first surface 12a of the pressure-sensitive adhesive layer 12 to form a film. The release film 15 is laminated on the entire surface of the first surface 13a of the adhesive 13.

In the dicing die bonding sheet 102 shown in FIG. 2, in a state where the release film 15 is removed, a part of the first surface 13a of the film-like adhesive 13 on the central side is a semiconductor wafer (not shown). It is attached to the back surface, and a region of the first surface 13a of the film-like adhesive 13 near the peripheral edge is attached to a jig such as a ring frame for use.

FIG. 3 is a cross-sectional view schematically showing still another embodiment of the dicing die bonding sheet of the present invention.
The dicing die bonding sheet 103 shown here is the same as the dicing die bonding sheet 101 shown in FIG. 1, except that the shape of the film-like adhesive is different.
That is, the dicing die bonding sheet 103 includes the pressure-sensitive adhesive layer 12 on the base material 11, and the film-like adhesive 23 on the pressure-sensitive adhesive layer 12. Further, the dicing die bonding sheet 103 further includes a release film 15 on the film-like adhesive 23.

In the dicing die bonding sheet 103, the pressure-sensitive adhesive layer 12 is laminated on the first surface 11a of the base material 11, and the film-like adhesive 23 is formed on a part of the first surface 12a of the pressure-sensitive adhesive layer 12, that is, the central region. Are laminated. Then, of the first surface 12a of the pressure-sensitive adhesive layer 12, the surface on which the film-like adhesive 23 is not laminated and the surface that is not in contact with the pressure-sensitive adhesive layer 12 of the film-like adhesive 23 (that is, the first surface 23a). The release film 15 is laminated on the side surface 23c). In some cases, the boundary between the first surface 23a and the side surface 23c of the film-like adhesive 23 cannot be clearly distinguished.

When the dicing die bonding sheet 103 is viewed in a plan view from above on the film-like adhesive 23 side, the film-like adhesive 23 has a smaller surface area than the pressure-sensitive adhesive layer 12, and has a shape such as a circular shape, for example.

In the dicing die bonding sheet 103 shown in FIG. 3, with the release film 15 removed, the first surface 23a of the film-like adhesive 23 is attached to the back surface of the semiconductor wafer (not shown), and further, the adhesive layer Of the first surfaces 12a of 12, the surface on which the film-like adhesive 23 is not laminated is attached to a jig such as a ring frame and used.

In the dicing die bonding sheet 103 shown in FIG. 3, the surface 12a of the first surface 12a of the pressure-sensitive adhesive layer 12 on which the film-like adhesive 23 is not laminated is used for jigs in the same manner as shown in FIG. Adhesive layers may be laminated (not shown). Similar to the dicing die bonding sheet 101 shown in FIG. 1, the dicing die bonding sheet 103 provided with such a jig adhesive layer has a jig such as a ring frame on the first surface of the jig adhesive layer. It is affixed to and used.

The dicing die bonding sheet of the present invention is not limited to the one shown in FIGS. 1 to 3, and a part of the configurations shown in FIGS. 1 to 3 are changed or deleted within the range not impairing the effect of the present invention. Alternatively, it may be added.

<< Manufacturing method of dicing die bonding sheet >>
The dicing die bonding sheet can be manufactured by sequentially laminating the above-mentioned layers so as to have a corresponding positional relationship. The method of forming each layer is as described above.

For example, the pressure-sensitive adhesive layer can be laminated on the base material by applying the above-mentioned pressure-sensitive adhesive composition on the base material and drying it if necessary.

On the other hand, for example, when a film-like adhesive is further laminated on the pressure-sensitive adhesive layer already laminated on the base material, the above-mentioned adhesive composition is applied on the pressure-sensitive adhesive layer, and if necessary. By drying, it is possible to directly form a film-like adhesive. As described above, when a continuous two-layer laminated structure is formed by using any of the compositions, the composition is further applied on the layer formed from the composition to form a new layer. It is possible to form. However, of these two layers, the layer to be laminated afterwards is formed in advance on another release film using the composition, and the side of the formed layer in contact with the release film is It is preferable to form a laminated structure of two continuous layers by laminating the exposed surface on the opposite side with the exposed surface of the remaining layers that have already been formed. At this time, it is preferable that the composition is applied to the peeled surface of the release film. The release film may be removed if necessary after the laminated structure is formed.

That is, by applying the pressure-sensitive adhesive composition on the base material and drying it as necessary, the pressure-sensitive adhesive layer is laminated on the base material, and the adhesive composition is separately applied on the release film. Then, a film-like adhesive is formed on the release film by drying as necessary, and the exposed surface of the film-like adhesive is attached to the exposed surface of the adhesive layer already laminated on the base material. At the same time, the dicing die bonding sheet can be obtained by laminating the film-like adhesive on the pressure-sensitive adhesive layer.

When the pressure-sensitive adhesive layer is laminated on the base material, the pressure-sensitive adhesive composition is applied on the release film instead of the method of applying the pressure-sensitive adhesive composition on the base material as described above. A pressure-sensitive adhesive layer may be formed on the release film by drying if necessary, and the exposed surface of the pressure-sensitive adhesive layer may be laminated by adhering it to one surface of the base material.
In either method, the release film may be removed at an arbitrary timing after the desired laminated structure is formed.

In this way, all the layers other than the base material constituting the dicing die bonding sheet can be laminated in advance by forming them on the release film and laminating them on the surface of the target layer. Therefore, this is necessary. A dicing die bonding sheet may be produced by appropriately selecting a layer that employs such a process.

The dicing die bonding sheet is usually stored in a state where a release film is attached to the surface of the outermost layer (for example, a film-like adhesive) on the side where the film-like adhesive is provided. Therefore, a composition for forming a layer constituting the outermost layer, such as an adhesive composition, is applied onto the release film (preferably the release-treated surface thereof), and the film is dried if necessary. A layer constituting the outermost layer is formed on the release film, and the remaining layers are laminated on the exposed surface on the side opposite to the side in contact with the release film of this layer by any of the above methods. A dicing die bonding sheet can also be obtained by leaving the release film in a bonded state without removing it.

<< Manufacturing method of semiconductor chip >>
The method for manufacturing a semiconductor chip of the present invention is a method for manufacturing a semiconductor chip using the dicing die bonding sheet of the present invention described above, wherein the pressure-sensitive adhesive layer of the film-like adhesive in the dicing die bonding sheet is formed. A step of forming an intermediate structure in which a semiconductor wafer is provided on a surface (that is, the first surface) opposite to the provided side (hereinafter, abbreviated as "intermediate structure forming step"). The semiconductor wafer is divided by using a dicing blade to form a notch in the intermediate structure that reaches the pressure-sensitive adhesive layer from the surface of the semiconductor wafer and does not reach the base material. It has a step of forming a semiconductor chip (hereinafter, may be abbreviated as “dicing step”).

By using the dicing die bonding sheet of the present invention, in the dicing step, the amount of cutting chips generated during dicing of a semiconductor wafer using a dicing blade can be significantly reduced as compared with the conventional case. Here, the "cutting waste" is the one described above.

Hereinafter, a method for manufacturing the semiconductor chip will be described with reference to FIG. FIG. 4 is a cross-sectional view for schematically explaining an embodiment of the method for manufacturing a semiconductor chip of the present invention.
Here, a manufacturing method when the dicing die bonding sheet shown in FIG. 1 is used will be described.

<Intermediate structure forming process>
In the intermediate structure forming step, as shown in FIG. 4A, the intermediate structure 201 in which the semiconductor wafer 9'is provided on the first surface 13a of the film-like adhesive 13 in the dicing die bonding sheet 101. To form.
The thickness of the semiconductor wafer 9'in the intermediate structure 201 is not particularly limited, but is preferably 10 μm to 100 μm, and more preferably 30 μm to 90 μm.

<Dicing process>
Next, in the dicing step, as shown in FIG. 4B, the adhesive layer 12 is used from the surface (that is, the circuit forming surface) 9a'of the semiconductor wafer 9'in the intermediate structure 201 by using the dicing blade. The semiconductor wafer 9'is divided to form the semiconductor chip 9 by forming a notch 10 that does not reach the base material 11 at the same time.
The thickness of the semiconductor chip 9 is the same as the thickness of the semiconductor wafer 9'described above.

FIG. 5 is an enlarged cross-sectional view schematically showing the obtained semiconductor chip 9 together with the dicing die bonding sheet 101 in which the notch 10 is formed.
As shown in FIG. 5, in this step, the thickness T _{1 of} the pressure-sensitive adhesive layer 12 and the depth T ₂ of the notch 10 from the first surface 12 a of the pressure-sensitive adhesive layer 12 have a relationship of T ₁ > T ₂ . A notch 10 is formed to fill. When the bottom surface 120a of the notch portion in the pressure-sensitive adhesive layer 12 is not flat, the portion closest to the base material 11 of the bottom surface 120a (that is, the portion having the deepest depth of the notch 10 in the pressure-sensitive adhesive layer 12) is used. It may be used as one of the criteria for calculating T ₂ .

In this way, by forming the notch 10 so as to stay in the pressure-sensitive adhesive layer 12 without reaching the first surface 11a of the base material 11, the amount of cutting chips generated can be reduced, and the film-like adhesive can be formed. It is possible to suppress the occurrence of pickup failure of the attached semiconductor chip 9.
The fact that the amount of cutting chips generated in the dicing step can be reduced is that, for example, after picking up the semiconductor chip 9 with a film-like adhesive, when the pressure-sensitive adhesive layer and the base material are observed using SEM, they are on the dicing line. It can be confirmed by the fact that the amount of cutting chips remaining in is reduced.

The ratio of the depth T ₂ of the notch 10 in the pressure-sensitive adhesive layer 12 to the thickness T ₁ of the pressure-sensitive adhesive layer 12 (T ₂ / T ₁ ) is greater than 0 and less than 1 and is 0.1 to 0.9. It is preferably, more preferably 0.2 to 0.8, and particularly preferably 0.3 to 0.7. When the ratio is at least the lower limit value, the size of the protruding portion of the pressure-sensitive adhesive layer, that is, the amount of protrusion can be reduced at the formation site of the notch 10 of the pressure-sensitive adhesive layer. By reducing the amount of protrusion of the pressure-sensitive adhesive layer, it is possible to further highly suppress the occurrence of pick-up defects in the semiconductor chip 9 with a film-like adhesive. On the other hand, when the ratio is not more than the upper limit value, the amount of cutting chips generated can be further reduced.

FIG. 6 is a cross-sectional view schematically showing an example of a state in which a notch 10 is formed in the intermediate structure 201 by using a dicing blade in the dicing step. Here, the tip portion 8a of the dicing blade 8 in the radial direction is located in the pressure-sensitive adhesive layer 12 and does not reach the base material 11. In FIG. 6, only the configuration related to the dicing die bonding sheet is shown in cross section. Further, as the notch 10, a state in which a gap is present between the dicing blade 8 and the adhesive layer 12 is shown, but the adhesive layer 12 protrudes to the dicing blade 8 side and remains as described above. , There may be a protruding portion, and the gap may be further narrowed or absent.

In the present invention, the width W of the dicing blade 8 is preferably 20 μm to 50 μm, and more preferably 30 μm to 35 μm. By using the dicing blade 8 having such a width W, the superior effect of the present invention can be obtained. When a semiconductor wafer is divided into semiconductor chips by using a dicing blade having a width W, the distance between adjacent semiconductor chips (that is, calf width) is usually the same as W or W. It is an approximate value of.

In the present invention, in the radial direction of the region near the tip 8a of the dicing blade 8, the width W becomes narrower toward the radial outer side of the dicing blade 8 (that is, toward the tip 8a). The length L is preferably less than the thickness T ₁ (L <T ₁ ) of the pressure-sensitive adhesive layer 12, for example, preferably less than 50 μm, more preferably less than 45 μm, and less than 40 μm. More preferably, it is particularly preferably less than 35 μm. By using such a dicing blade 8 having a length L, the superior effect of the present invention can be obtained.
On the other hand, the lower limit of the length L is not particularly limited as long as it is larger than 0 μm, but is usually preferably 10 μm, more preferably 15 μm. The length L is represented by L = (W × tan θ) / 2, using an angle θ described later.

In the present invention, the angle formed by the tip portion 8a of the dicing blade 8 with the surface to be formed of the notch (in the present specification, such an angle may be referred to as “the tip angle of the dicing blade”) θ. Those larger than 0 ° and less than 90 ° can be used. In such a dicing blade 8, for example, θ may be larger than 0 ° and 80 ° or less, but is preferably larger than 0 ° and 70 ° or less. By using the dicing blade 8 having such a tip angle θ, the superior effect of the present invention can be obtained.

Although the case where the above-mentioned tip angle θ is larger than 0 ° and less than 90 ° is used as the dicing blade is described here, the dicing blade used in the dicing step is limited to such a dicing blade. Not done. For example, in the dicing blade 8 shown in FIG. 6, the tip angle θ is 0 °, that is, in a region near the tip 8a of the dicing blade 8, toward the radial outer side of the dicing blade 8 (that is, the tip). A dicing blade having no region where the width W becomes narrower (toward the portion 8a) may be used in the dicing step.

On the other hand, as shown in FIG. 7, the adhesive layer 12 is penetrated from the surface 9a'of the semiconductor wafer 9'so as to satisfy the relationship of T ₁ = T _{2 in} the intermediate structure 201 by the conventional manufacturing method. Then, when the notch 10 reaching the base material 11 is formed, the above-mentioned effect of the present invention cannot be obtained. In FIG. 7, T ₃ (T ₃ > 0) means the depth of the notch 10 from the first surface 11a of the base material 11. Further, the portion with reference numeral 110a indicates the bottom surface of the base material 11 at the notched portion.

In the dicing step, the rotation speed of the dicing blade is preferably 1000 to 60,000 rpm, more preferably 2000 to 50000 rpm.
The moving speed of the dicing blade is preferably 20 to 80 mm / sec, more preferably 40 to 60 mm / sec.
Further, when the dicing blade is operated, it is preferable to flow cutting water at an amount of, for example, about 0.5 to 1.5 L / min to the portion where the dicing is performed.

<< Manufacturing method of semiconductor devices >>
The method for manufacturing a semiconductor device of the present invention is a dicing die bonding sheet after performing the step of forming the semiconductor chip (that is, the dicing step) and then forming the notch by the method for manufacturing the semiconductor chip of the present invention described above. On the other hand, a step of applying a force from the base material side and pulling the semiconductor chip away from the pressure-sensitive adhesive layer together with the film-like adhesive after cutting (hereinafter, may be abbreviated as "pull-off step"). Have.

In the method for manufacturing a semiconductor device of the present invention, the amount of cutting chips generated in the dicing step can be significantly reduced by using the above-mentioned method for manufacturing a semiconductor chip of the present invention.
As a result, in the pulling step, the occurrence of pick-up failure of the semiconductor chip provided with the film-like adhesive (that is, the semiconductor chip with the film-like adhesive) is suppressed.

Hereinafter, a method for manufacturing the semiconductor device will be described with reference to FIG. FIG. 8 is a cross-sectional view for schematically explaining an embodiment of the method for manufacturing a semiconductor device of the present invention. Here, a manufacturing method when the dicing die bonding sheet shown in FIG. 1 is used will be described. In FIG. 8, only the configuration related to the dicing die bonding sheet and the semiconductor chip is shown in cross section.

<Pulling process>
In the pulling step, as shown in FIG. 8, a force is applied to the dicing die bonding sheet 101 after forming the notch 10 from the base material 11 side, and the semiconductor chip 9 is bonded to the film after cutting. It is pulled away from the pressure-sensitive adhesive layer 12 together with the agent 13 (that is, picked up).

Here, a protrusion (that is, a pin) 70 is projected from a push-up portion (not shown) in a semiconductor device manufacturing apparatus, and the tip portion of the protrusion 70 pushes up the dicing die bonding sheet 101 from the base material 11 side. An example is shown in which a force is applied to the intermediate structure 201 in which the notch 10 and the semiconductor chip 9 are formed in the protruding direction of the protrusion 70. At this time, the pushing conditions such as the protruding amount (that is, the pushing amount), the protruding speed (that is, the pushing speed), and the holding time of the protruding state (that is, the lifting waiting time) of the protrusion 70 can be appropriately adjusted. The number of protrusions 70 is not particularly limited and may be appropriately selected.

In the pulling step, the method of pushing up the dicing die bonding sheet 101 may be a known method. For example, in addition to the method of pushing up by the protrusions as described above, the slider is moved along the dicing die bonding sheet 101. A method of pushing up the dicing die bonding sheet 101 can be mentioned.

Further, here, an example is shown in which the semiconductor chip 9 is peeled from the pressure-sensitive adhesive layer 12 together with the film-like adhesive 13 by pulling up the semiconductor chip 9 by the pull-up portion 71 of the semiconductor device manufacturing apparatus. Here, the pulling direction of the semiconductor chip 9 is indicated by an arrow I.
The method of pulling up the semiconductor chip 9 may be a known method, and examples thereof include a method of adsorbing and pulling up the surface of the semiconductor chip 9 with a vacuum collet.

In the pulling step, by using the dicing die bonding sheet 101 of the present invention and using the method for manufacturing the semiconductor chip of the present invention, the occurrence of pick-up failure of the semiconductor chip 9 with a film-like adhesive is suppressed.

In the method for manufacturing a semiconductor device of the present invention, as described above, an energy ray irradiation is performed by using a dicing die bonding sheet in which the adhesive force of the adhesive layer to the film-like adhesive is equal to or less than a specific value in the peeling step. The semiconductor chip with a film-like adhesive can be easily separated from the adhesive layer and picked up without curing the adhesive layer with or the like. Then, since the semiconductor chip with the film-like adhesive can be picked up without curing the pressure-sensitive adhesive layer, the manufacturing process of the semiconductor device can be simplified.

In the method for manufacturing a semiconductor device of the present invention, a semiconductor chip separated (that is, picked up) together with a film-like adhesive (that is, a semiconductor chip with a film-like adhesive) is used, and thereafter, the same as the conventional method is used. A semiconductor device can be manufactured by a method, that is, through a step of die-bonding the semiconductor chip to a circuit surface of a substrate with a film-like adhesive. For example, the semiconductor chip is die-bonded to the circuit surface of the substrate with a film-like adhesive, and if necessary, one or more semiconductor chips are further laminated on the semiconductor chip to perform wire bonding, and then the whole is resin. By sealing with, it becomes a semiconductor package. Then, the target semiconductor device may be manufactured by using this semiconductor package.

Hereinafter, the present invention will be described in more detail with reference to specific examples. However, the present invention is not limited to the examples shown below.
In the following, the unit of time "msec" means "millisecond".

[Example 1]
<Manufacturing of dicing die bonding sheet>
A film-like adhesive (manufactured by Lintec Corporation) is applied to the pressure-sensitive adhesive layer of a dicing sheet (base material thickness 80 μm, pressure-sensitive adhesive layer thickness 30 μm) provided with a non-energy ray-curable pressure-sensitive adhesive layer on the base material. "ADWILL LE61-25 *" (thickness 25 μm) was attached at room temperature. As described above, a dicing die bonding sheet having a pressure-sensitive adhesive layer on the base material and a film-like adhesive on the pressure-sensitive adhesive layer was obtained.

The pressure-sensitive adhesive layer of the dicing sheet used here includes 2-ethylhexyl acrylate (hereinafter abbreviated as "2EHA") (60 parts by mass) and methyl methacrylate (hereinafter, "MMA") as the pressure-sensitive adhesive resin. Acrylic polymer (weight average molecular weight 450,000, glass transition temperature) obtained by copolymerizing (abbreviated) (30 parts by mass) and 2-hydroxyethyl acrylate (hereinafter abbreviated as "HEA") (10 parts by mass). −31 ° C.) (100 parts by mass) and a trimylene isocyanate trimer adduct of trimethylrolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (18.85) by mass as a cross-linking agent. ..

Table 1 shows the breaking elongation and elastic modulus of this pressure-sensitive adhesive layer measured by the following method, and the pressure-sensitive adhesive force against the film-like adhesive.

(Measurement of breaking elongation and elastic modulus of adhesive layer)
The pressure-sensitive adhesive layer was cut out to have a length of 30 mm, a width of 10 mm, and a thickness of 0.03 mm to prepare a test piece.
Next, this test piece was installed in a measuring device (“Autograph” manufactured by Shimadzu Corporation). At this time, the length from both ends of the test piece in the length direction to the portion having a length of 10 mm was sandwiched between chucks so that the length of the measurement target portion of the test piece was 10 mm.
Next, the test piece was pulled in the length direction at a tensile speed of 1000 mm / min in an environment of a temperature of 23 ° C. and a relative humidity of 50%, and the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer were measured.

(Measurement of adhesive strength of the adhesive layer to the film-like adhesive)
The dicing die bonding sheet was cut out so as to have a width of 25 mm and a length of 200 mm to prepare a test piece.
Then, at room temperature (23 ° C.), this test piece was attached to the adhesive surface of the adhesive sheet with a film-like adhesive.
Next, at room temperature (23 ° C.), the laminate of the base material and the pressure-sensitive adhesive layer is formed from the film-like adhesive so that the surfaces of the film-like adhesive and the pressure-sensitive adhesive layer that were in contact with each other form an angle of 180 °. Then, it was peeled off at a peeling speed of 300 mm / min to perform 180 ° peeling, and the peeling force at this time was measured to obtain the adhesive force (mN / 25 mm) of the adhesive layer to the film-like adhesive.

<Manufacturing and evaluation of semiconductor chips>
(Intermediate structure forming process)
Using a fully automatic multi-wafer mounter (“ADWILL RAD-2700” manufactured by Lintec Corporation) on the polished surface of a 12-inch silicon wafer (thickness 75 μm) that has undergone a dry-polished finish, the dicing die bonding sheet obtained above is applied. , The film-like adhesive was applied to obtain an intermediate structure.

(Dicing process)
Next, the obtained intermediate structure was attached to and fixed to the dicing ring frame by the exposed surface of the pressure-sensitive adhesive layer.
Next, a dicing device (“DFD6361” manufactured by Disco Corporation) was used to form a notch in the intermediate structure obtained above. The conditions at that time are as follows. A notch was formed by penetrating the film-like adhesive from the surface of the silicon wafer and cutting to a depth of 20 μm from the surface of the pressure-sensitive adhesive layer on the side provided with the film-like adhesive using a dicing blade. That is, the notch is formed in the intermediate structure so as not to reach the base material, and the ratio of the notch depth T ₂ in the pressure-sensitive adhesive layer to the thickness T ₁ of the pressure-sensitive adhesive layer (T ₂ / T). ₁ ) was set to 0.67. As the dicing blade, a dicing blade having a width W of 30 μm to 35 μm, an angle θ of the tip portion of 30 °, and a length L in the radial direction of 9 μm to 10 μm is used, and the dicing blade moves at a rotation speed of 40,000 rpm. The speed was set to 50 mm / sec. Further, dicing was performed while flowing cutting water at an amount of 1 L / min to the portion where the dicing was performed.
As described above, when the surface of the silicon wafer was looked down from above, dicing was performed so that the silicon chips had a size of 8 mm × 8 mm at intervals of 8 mm in two orthogonal directions.

(Evaluation of semiconductor chip pickup suitability)
Next, the intermediate structure after forming the notch and forming the silicon chip was installed in a pickup die bonding device (“BESTEM-D02” manufactured by Canon Machinery Co., Ltd.). Then, at room temperature, the push-up speed is set to 20 mm / sec, the holding time is set to 300 msec, the push-up amount is set to a specific value, and the dicing die bonding sheet after forming a notch by the 5-pin push-up method is used. Applying force from the base material side to push up the intermediate structure after forming the notch and silicon chip, and using a collet with a size of 8 mm × 8 mm at the part where the semiconductor chip is separated, with the obtained film-like adhesive. Attempts were made to separate (ie, pick up) the semiconductor chip from the pressure-sensitive adhesive layer. The push-up amount when the intermediate structure is pushed up and the semiconductor chip with the film-like adhesive is pulled apart continuously by changing the push-up amount and can be carried out 30 times in a row without any abnormality. Was determined and used as an index for evaluating the pickup suitability of semiconductor chips with film-like adhesives. In addition, using a scanning electron microscope (SEM, "VE-9800" manufactured by KEYENCE), the surfaces of the base material and the adhesive layer after pickup were observed, and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 1.

<Manufacturing of dicing die bonding sheet, manufacturing and evaluation of semiconductor chips>
[Example 2]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 1. Table 1 also shows the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive.
(Adhesive layer)
Crosslinked with an acrylic polymer (weight average molecular weight 700,000, glass transition temperature -63 ° C.) (100 parts by mass) obtained by copolymerizing 2EHA (85 parts by mass) and HEA (15 parts by mass) as an adhesive resin. A pressure-sensitive adhesive layer containing a trimylene isocyanate trimer adduct of trimethylolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (28.28 parts by mass) as an agent.

[Example 3]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 1. Table 1 also shows the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive.
(Adhesive layer)
Crosslinked with an acrylic polymer (weight average molecular weight 850000, glass transition temperature -61 ° C.) (100 parts by mass) obtained by copolymerizing 2EHA (80 parts by mass) and HEA (20 parts by mass) as an adhesive resin. A pressure-sensitive adhesive layer containing a trimylene isocyanate trimer adduct of trimethylolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (37.70 parts by mass) as an agent.

[Example 4]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 1. Table 1 also shows the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive.
(Adhesive layer)
An acrylic polymer obtained by copolymerizing 2EHA (60 parts by mass), MMA (30 parts by mass), and HEA (10 parts by mass) as an adhesive resin (weight average molecular weight 450,000, glass transition temperature −31 ° C.) ( A pressure-sensitive adhesive layer containing 100 parts by mass) and a trimylene isocyanate trimer adduct of trimethylolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (56.55 parts by mass) as a cross-linking agent.

[Example 5]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 1. Table 1 also shows the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive.
(Adhesive layer)
Acrylic weight obtained by copolymerizing 2EHA (60 parts by mass), MMA (30 parts by mass), and 4-hydroxybutyl acrylate (hereinafter abbreviated as "4HBA") (10 parts by mass) as an adhesive resin. Coalescence (weight average molecular weight 300,000, glass transition temperature -30 ° C) (100 parts by mass) and trimylene isocyanate trimer adduct of trimethylolpropane as a cross-linking agent (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (15.19 mass) Part), and a pressure-sensitive adhesive layer containing.

[Comparative Example 1]
<Manufacturing of dicing die bonding sheet>
A dicing die bonding sheet was manufactured by the same method as in Example 1.

<Manufacturing and evaluation of semiconductor chips>
(Intermediate structure forming process)
An intermediate structure was obtained in the same manner as in Example 1.

(Dicing process)
Next, the obtained intermediate structure was attached to and fixed to the dicing ring frame by the exposed surface of the pressure-sensitive adhesive layer.
Next, a dicing device (“DFD6361” manufactured by Disco Corporation) was used to form a notch in the intermediate structure obtained above. The conditions at that time are as follows. A notch is formed by cutting from the surface of the silicon wafer through the film-like adhesive and the pressure-sensitive adhesive layer to a depth of 20 μm from the surface of the base material on the side provided with the pressure-sensitive adhesive layer using a dicing blade. did. That is, the notch is formed in the intermediate structure over the entire area in the thickness direction of the pressure-sensitive adhesive layer, and the ratio of the depth of cut T ₂ in the pressure-sensitive adhesive layer to the thickness T ₁ of the pressure-sensitive adhesive layer ( T ₂ / T ₁ ) was set to 1, and a notch was further formed in the base material to set the depth of cut T ₃ in the base material to 20 μm. The rotation speed and moving speed of the dicing blade and the dicing blade were the same as in the case of Example 1.
As described above, when the surface of the silicon wafer was looked down from above, dicing was performed so that the silicon chips had a size of 8 mm × 8 mm at intervals of 8 mm in two orthogonal directions.

(Evaluation of semiconductor chip pickup suitability)
In the same method as in Example 1, the semiconductor chip with a film-like adhesive was attempted to be separated from the adhesive layer (that is, picked up), the minimum value of the push-up amount was obtained, and the amount of cutting chips on the dicing line was confirmed. .. The results are shown in Table 2.

[Comparative Example 2]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 2. Table 2 also shows the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive.
(Adhesive layer)
An acrylic polymer obtained by copolymerizing 2EHA (70 parts by mass), MMA (20 parts by mass), and HEA (10 parts by mass) as an adhesive resin (weight average molecular weight 510000, glass transition temperature −44 ° C.) ( A pressure-sensitive adhesive layer containing (100 parts by mass) and a trimylene isocyanate trimer adduct of trimethylolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (18.85 parts by mass) as a cross-linking agent.

[Comparative Example 3]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 2. Table 2 also shows the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive.
(Adhesive layer)
Crosslinked with an acrylic polymer (weight average molecular weight 700,000, glass transition temperature -66 ° C.) (100 parts by mass) obtained by copolymerizing 2EHA (90 parts by mass) and HEA (10 parts by mass) as an adhesive resin. A pressure-sensitive adhesive layer containing a trimylene isocyanate trimer adduct of trimethylolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (18.85 parts by mass) as an agent.

[Comparative Example 4]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 2. Table 2 also shows the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive.
(Adhesive layer)
Crosslinked with an acrylic polymer (weight average molecular weight 700,000, glass transition temperature -63 ° C.) (100 parts by mass) obtained by copolymerizing 2EHA (85 parts by mass) and HEA (15 parts by mass) as an adhesive resin. A pressure-sensitive adhesive layer containing a trimylene isocyanate trimer adduct of trimethylolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (28.28 parts by mass) as an agent.

[Comparative Example 5]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 2. Table 2 also shows the breaking elongation of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive. The elastic modulus of the pressure-sensitive adhesive layer could not be measured.
(Adhesive layer)
Crosslinked with an acrylic polymer (weight average molecular weight 850000, glass transition temperature -61 ° C.) (100 parts by mass) obtained by copolymerizing 2EHA (80 parts by mass) and HEA (20 parts by mass) as an adhesive resin. A pressure-sensitive adhesive layer containing a trimylene isocyanate trimer adduct of trimethylolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (113.10 parts by mass) as an agent.

[Comparative Example 6]
An attempt was made to produce a dicing die bonding sheet by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) was used as the pressure-sensitive adhesive layer, but the pressure-sensitive adhesive layer was in the form of a film. The adhesive could not be attached and the dicing die bonding sheet could not be manufactured.
(Adhesive layer)
Crosslinked with an acrylic polymer (weight average molecular weight 850000, glass transition temperature -61 ° C.) (100 parts by mass) obtained by copolymerizing 2EHA (80 parts by mass) and HEA (20 parts by mass) as an adhesive resin. A pressure-sensitive adhesive layer containing a trimylene isocyanate trimer adduct of trimethylolpropane (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (188.50 parts by mass) as an agent.

[Comparative Example 7]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and the pushing-up amount is minimized. The value was calculated and the amount of cutting chips on the dicing line was confirmed. The results are shown in Table 3. Table 3 also shows the breaking elongation and elastic modulus of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive force against the film-like adhesive.
(Adhesive layer)
An acrylic polymer obtained by copolymerizing 2EHA (60 parts by mass), MMA (30 parts by mass), and HEA (10 parts by mass) as an adhesive resin (weight average molecular weight 450,000, glass transition temperature −31 ° C.) ( A pressure-sensitive adhesive layer containing 100 parts by mass) and a trimylene isocyanate trimer adduct of trimethylolpropane as a cross-linking agent (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (94.25 parts by mass).

[Comparative Example 8]
A dicing die bonding sheet and a semiconductor chip are manufactured by the same method as in Example 1 except that a dicing sheet provided with the following (thickness 30 μm) is used as the pressure-sensitive adhesive layer, and cutting chips on the dicing line are manufactured. The amount of was confirmed. The results are shown in Table 3. Table 3 also shows the breaking elongation of the pressure-sensitive adhesive layer and the pressure-sensitive adhesive strength against the film-like adhesive. In this comparative example, the semiconductor chip with a film-like adhesive could not be separated from the pressure-sensitive adhesive layer (that is, picked up), and the minimum value of the push-up amount could not be obtained. Moreover, the elastic modulus of the pressure-sensitive adhesive layer could not be measured.
(Adhesive layer)
As the adhesive resin, an acrylic polymer (weight average molecular weight 720000, glass transition temperature) obtained by copolymerizing lauryl acrylate (hereinafter abbreviated as "LA") (80 parts by mass) and HEA (20 parts by mass). -27 ° C.) (100 parts by mass) and a pressure-sensitive adhesive layer containing a trimylene isocyanate trimer adduct of trimethylolpropane as a cross-linking agent (“BHS8515” manufactured by Toyo Ink Co., Ltd.) (137.70 parts by mass). ..

In Examples 1 to 5, a dicing die bonding sheet having a thickness of the pressure-sensitive adhesive layer in the range of 20 μm to 50 μm and a breaking elongation of the pressure-sensitive adhesive layer in the range of 8.7% to 40.2% was used. In the intermediate structure used in the dicing step, a notch was formed which reached the pressure-sensitive adhesive layer from the surface of the semiconductor wafer and did not reach the base material. As a result, as is clear from the above results, the minimum value of the push-up amount was 200 μm or less, and the pickup suitability of the semiconductor chip with the film-like adhesive was good. In particular, in Examples 2 to 4 in which the adhesive force of the adhesive layer to the film-like adhesive was smaller, the minimum value of the push-up amount was smaller, and the pick-up suitability of the semiconductor chip with the film-like adhesive was extremely excellent. Further, in Examples 1 to 5, the amount of cutting chips on the dicing line was small, and in particular, in Examples 2 to 4, it was extremely small.
As described above, the amount of cutting chips on the dicing line was correlated with the pick-up suitability of the semiconductor chip with a film-like adhesive.
In Examples 1 to 5, so-called chip skipping, in which the semiconductor chips were scattered during dicing of the semiconductor wafer, was not observed.

On the other hand, in Comparative Example 1, as a result of forming a notch reaching from the surface of the semiconductor wafer to the base material in the intermediate structure in the dicing step, the adhesive layer is the same as that in Example 1. The minimum value of the push-up amount was 300 μm, and the pick-up suitability of the semiconductor chip with a film-like adhesive was inferior.
Further, in Comparative Examples 2 and 3, the elongation at break of the pressure-sensitive adhesive layer was too large, and accordingly, the minimum value of the push-up amount was large, and the pickup suitability of the semiconductor chip with a film-like adhesive was inferior.

Further, in Comparative Example 4, the elongation at break of the pressure-sensitive adhesive layer was too large, and accordingly, as will be described later, a large amount of cutting chips remained on the dicing line, and the minimum value of the push-up amount was also large. ..

Further, in Comparative Examples 5 and 7, the breaking elongation of the pressure-sensitive adhesive layer was too small, cracks were observed at locations other than the intended purpose of the pressure-sensitive adhesive layer, and the characteristics of the pressure-sensitive adhesive layer were inferior. The dicing die bonding sheet of this comparative example was not suitable for practical use.
Further, in Comparative Example 6, the content of the cross-linking agent in the pressure-sensitive adhesive layer was too large, and there was a problem in the composition of the pressure-sensitive adhesive layer. Therefore, as described above, the film-like adhesive could not be attached to the pressure-sensitive adhesive layer. , Dicing Die bonding sheet could not be manufactured.
Further, in Comparative Example 8, the type of the adhesive resin in the pressure-sensitive adhesive layer was inappropriate, the breaking elongation of the pressure-sensitive adhesive layer was too large, and the adhesive strength of the pressure-sensitive adhesive layer to the film-like adhesive was too large. As mentioned above, the semiconductor chip with the film-like adhesive could not be picked up.

In Comparative Examples 1 to 4 and 8, there was a large amount of cutting chips on the dicing line, in Comparative Examples 1 to 4, the minimum value of the push-up amount was 250 μm or more, and in Comparative Example 8, measurement was impossible. In Comparative Examples 5 and 7, the amount of cutting chips on the dicing line was small, and the minimum value of the push-up amount was as small as 75 μm. As described above, even in these comparative examples, the amount of cutting chips on the dicing line was correlated with the pick-up suitability of the semiconductor chip with the film-like adhesive.
Further, in Comparative Examples 1 to 5 and 7, as a result of observing the semiconductor chip with a film-like adhesive that failed to be picked up and the adhesive layer and the base material at the corresponding positions using SEM, cutting on the dicing line It was confirmed that the debris was in close contact with the film-like adhesive, and the cutting debris remaining on the dicing line was one of the causes of the pickup failure. Further, in Comparative Examples 1, 3 and 8, the amount of cutting chips remaining on the dicing line was extremely large.
In Comparative Examples 5 and 7, chip skipping was observed, but in Comparative Examples 1 to 4 and 8, chip skipping was not observed.

The present invention can be used in the manufacture of semiconductor devices.

101, 102, 103 ... Dicing die bonding sheet, 11 ... Base material, 11a ... First surface of base material, 12 ... Adhesive layer, 12a ... First surface of adhesive layer , 13, 23 ... film-like adhesive, 13a, 23a ... first surface of film-like adhesive, 201 ... intermediate structure, 8 ... dicing blade, 9 ... semiconductor chip, 9 '・ ・ ・ Semiconductor wafer, 9a' ・ ・ ・ Surface of semiconductor wafer, 10 ・ ・ ・ Notch, T ₁・ ・ ・ Thickness of adhesive layer

Claims (5)

A pressure-sensitive adhesive layer is provided on the base material, and a film-like adhesive is provided on the pressure-sensitive adhesive layer.
The thickness of the pressure-sensitive adhesive layer is 20 μm to 50 μm.
The adhesive layer having a width of 10 mm was fixed at two places so that the distance between the fixing points was 10 mm, the tensile speed was set to 1000 mm / min, and the adhesive layer was pulled between the fixed points, and the adhesive layer broke. A dicing die bonding sheet in which the required elongation at break of the pressure-sensitive adhesive layer is 5 to 50% by measuring the elongation of the pressure-sensitive adhesive layer . The dicing die bonding sheet according to claim 1, wherein the pressure-sensitive adhesive layer is non-energy ray-curable. The dicing die bonding sheet according to claim 1 or 2, wherein the adhesive force of the pressure-sensitive adhesive layer on the film-like adhesive is 35 to 300 mN / 25 mm. A method for manufacturing a semiconductor chip using the dicing die bonding sheet according to any one of claims 1 to 3.
A step of forming an intermediate structure in which a semiconductor wafer is provided on a surface of the film-like adhesive in the dicing die bonding sheet opposite to the side on which the pressure-sensitive adhesive layer is provided.
The semiconductor wafer is divided into semiconductor chips by using a dicing blade to form a notch in the intermediate structure that reaches the pressure-sensitive adhesive layer from the surface of the semiconductor wafer and does not reach the base material. A method for manufacturing a semiconductor chip, which comprises a step of forming a semiconductor chip. After performing the step of forming the semiconductor chip by the method for manufacturing a semiconductor chip according to claim 4.
A semiconductor device having a step of applying a force to the dicing die bonding sheet after forming the notch from the base material side and separating the semiconductor chip from the pressure-sensitive adhesive layer together with the film-like adhesive after cutting. Manufacturing method.

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