JP6795774B1 - フラックス、やに入りはんだ及びはんだ付け方法 - Google Patents
フラックス、やに入りはんだ及びはんだ付け方法 Download PDFInfo
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- JP6795774B1 JP6795774B1 JP2019234270A JP2019234270A JP6795774B1 JP 6795774 B1 JP6795774 B1 JP 6795774B1 JP 2019234270 A JP2019234270 A JP 2019234270A JP 2019234270 A JP2019234270 A JP 2019234270A JP 6795774 B1 JP6795774 B1 JP 6795774B1
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- acid
- rosin
- range specified
- solder
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- OKQVTLCUHATGDD-UHFFFAOYSA-N n-(benzotriazol-1-ylmethyl)-2-ethyl-n-(2-ethylhexyl)hexan-1-amine Chemical compound C1=CC=C2N(CN(CC(CC)CCCC)CC(CC)CCCC)N=NC2=C1 OKQVTLCUHATGDD-UHFFFAOYSA-N 0.000 description 1
- QGLKNQRTHJUNFJ-UHFFFAOYSA-N n-(benzotriazol-1-ylmethyl)-2-ethylhexan-1-amine Chemical compound C1=CC=C2N(CNCC(CC)CCCC)N=NC2=C1 QGLKNQRTHJUNFJ-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002540 palm oil Substances 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229940081066 picolinic acid Drugs 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- LOAUVZALPPNFOQ-UHFFFAOYSA-N quinaldic acid Chemical compound C1=CC=CC2=NC(C(=O)O)=CC=C21 LOAUVZALPPNFOQ-UHFFFAOYSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005792 styrene-acrylic resin Polymers 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- WJCNZQLZVWNLKY-UHFFFAOYSA-N thiabendazole Chemical compound S1C=NC(C=2NC3=CC=CC=C3N=2)=C1 WJCNZQLZVWNLKY-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
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- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/0227—Rods, wires
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3616—Halogen compounds
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/0261—Rods, electrodes, wires
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
Description
本実施の形態のフラックスは、揮発性ロジン、あるいは、揮発性ロジン及び不揮発性ロジンと、活性剤を含む。
本実施の形態のやに入りはんだは、上述したフラックスが充填された線状のはんだ以外にも、ペレット、ディスク、リング、チップ、ボール、カラムと称す円柱等の柱状の形状でも良い。やに入りはんだに使用されるフラックスは、はんだを加工する工程で流れ出さないように常温で固形であること、あるいは流れ出さないような所定の高粘度であることが求められる。なお、やに入りはんだで使用される場合にフラックスに求められる粘度は、例えば3500Pa・s以上である。やに入りはんだの線径は、0.1mm以上1.6mm以下であり、好ましくは0.3mm以上1.3mm以下であり、より好ましくは0.6mm以上1.0mm以下である。また、やに入りはんだに充填されたフラックスの含有量は、やに入りはんだを100とした場合、0.5wt%以上6wt%以下であり、好ましくは1.5wt%以上4.5wt%以下であり、より好ましく2.0wt%以上4.0wt%以下である。
本実施の形態のフラックスコートはんだは、上述したフラックスで被覆されたはんだである。フラックスコートはんだは、線状のはんだ以外にも、ペレット、ディスク、リング、チップ、ボール、カラムと称す円柱等の柱状の形状でも良い。はんだを被覆した状態のフラックスは、常温でははんだの表面に付着した固形である。
揮発性ロジン、あるいは、揮発性ロジン及び不揮発性ロジンを含むフラックスは、常温で固形または所定の粘度を有する様態となる。また、活性剤を含むことで金属酸化物に対する十分な活性を持ち、かつ、はんだの融点を超える温度域までの加熱の過程で、揮発性ロジン及び不揮発性ロジンの粘度が低下して流れる。
図1は、本実施の形態のはんだ付け方法で使用されるはんだごての一例を示す説明図、図2A、図2B、図2C及び図2Dは、本実施の形態のはんだ付け方法を示す説明図である。
(1)検証方法
TG法(熱重量測定法)による試験評価方法として、アルミパンに各実施例及び各比較例のフラックスを10mg詰めて、ULVAC社製TGD9600を用いてN2雰囲気下で25℃〜350℃まで、昇温速度10℃/minにて加熱した。加熱後の各フラックスの重量が、加熱前の20%以下になったかどうかを測定した。
◎:重量が加熱前の15%以下になった
○:重量が加熱前の15%超、20%以下になった
×:重量が加熱前の20%より大きかった
(1)検証方法
はんだの濡れ広がり性の評価は、実施例、比較例のフラックスを使用したやに入りはんだを試料として用意した。はんだは、Sn−3Ag−0.5Cuと表記される組成であり、Agを3.0wt%、Cuを0.5wt%含み、残部がSnである。やに入りはんだの直径はφ0.8mm、やに入りはんだの全量を100とした場合、はんだが97wt%、フラックスが3wt%である。このやに入りハンダを使用し、JIS Z 3197 8.3.1.1に準拠して濡れ広がり率を算出した。
〇:濡れ広がり率が70%以上であった
×:濡れ広がり率が70%未満であった
(1)検証方法
実施例、比較例のフラックスを試料とし、25℃における状態を観察して、固形及び液体のいずれであるかを判定した。フラックスが液体である場合、フラックスをレオメータ(Thermo Scientific HAAKE MARS III(商標))のプレート間に挟んだ後、6Hzでプレートを回転させることによりフラックスの粘度を測定した。そして、やに入りはんだを製造する際の加工性を、下記に示す基準で評価した。
〇:25℃における状態が固形であった。または、25℃における状態が液体であるが、レオメータで測定した粘度が3500Pa・s以上であった。フラックスの25℃における状態が固形、または、25℃における状態が液体であるが、レオメータで測定した粘度が3500Pa・s以上であると、やに入りはんだを作ることができる。
×:25℃における状態が液体であり、レオメータで測定した粘度が3500Pa・s未満であった。フラックスの25℃における状態が液体であり、レオメータで測定した粘度が3500Pa・s未満であると、フラックスが流れ、やに入りはんだを作ることができない。
(1)検証方法
実施例、比較例のフラックスを試料とし、JIS Z 3197に基づき銅鏡腐食試験を行い、銅鏡試験片に対するフラックス塗布箇所の腐食の度合いを透過率で評価した。
〇:透過率が50%以下であった
×:透過率が50%超であった
〇:残渣量評価が◎または〇、かつ、はんだの濡れ広がり性、加工性評価及び腐食性評価の何れも〇であった
×:残渣量、はんだの濡れ広がり性、加工性評価及び腐食性評価の何れか、または全てが×であった
Claims (6)
- はんだごての中心軸に沿って形成された貫通孔にやに入りはんだを供給し、前記やに入りはんだのはんだの融点を超える温度まで前記はんだごてを加熱して、接合対象物を加熱すると共に、前記やに入りはんだを溶融させ、前記はんだごてを接合対象物から離すはんだ付け方法に用いられる前記やに入りはんだに使用されるフラックスであって、
揮発性ロジンを70wt%以上〜98wt%以下、
不揮発性ロジンを0wt%以上10wt%以下、
活性剤を2wt%以上30wt%以下含み、
前記活性剤は、有機酸を0wt%以上15wt%以下、有機ハロゲン化合物を0.5wt%以上15wt%以下、アミンを0wt%以上5wt%以下、アミンハロゲン化水素酸塩を0wt%以上2.5wt%以下含み、
10mgの当該フラックスを、N 2 雰囲気下で、25℃〜350℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の20%以下である
ことを特徴とするフラックス。 - 25℃で固形または粘度が3500Pa・s以上の液体である
ことを特徴とする請求項1に記載のフラックス。 - 10mgの当該フラックスを、N2雰囲気下で、25℃〜350℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の15%以下である
ことを特徴とする請求項1または請求項2に記載のフラックス。 - 前記揮発性ロジンは、水添ロジン、水添不均化ロジン、アクリル酸変性水添ロジン、アクリル酸変性ロジン、天然ロジンのいずれか、または、水添ロジン、水添不均化ロジン、アクリル酸変性水添ロジン、アクリル酸変性ロジン、天然ロジンの2つ以上の組み合わせである
ことを特徴とする請求項1〜請求項3の何れか1項に記載のフラックス。 - 請求項1〜請求項4の何れか1項に記載のフラックスがはんだに充填された
ことを特徴とするやに入りはんだ。 - 揮発性ロジンを70wt%以上〜98wt%以下、不揮発性ロジンを0wt%以上10wt%以下、活性剤を2wt%以上30wt%以下含み、前記活性剤は、有機酸を0wt%以上15wt%以下、有機ハロゲン化合物を0.5%以上15wt%以下、アミンを0wt%以上5wt%以下、アミンハロゲン化水素酸塩を0wt%以上2.5wt%以下含むフラックスであって、10mgの当該フラックスを、N 2 雰囲気下で、25℃〜350℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の20%以下であるフラックスと、前記フラックスが充填されたはんだからなるやに入りはんだを、はんだごての中心軸に沿って形成された貫通孔に供給し、前記はんだの融点を超える温度まで前記はんだごてを加熱して、接合対象物を加熱すると共に、前記やに入りはんだを溶融させ、前記はんだごてを接合対象物から離す
ことを特徴とするはんだ付け方法。
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EP20215972.9A EP3842177A1 (en) | 2019-12-25 | 2020-12-21 | Flux, resin flux cored solder using the flux, and a soldering method |
US17/128,239 US20210197323A1 (en) | 2019-12-25 | 2020-12-21 | Flux, Resin Flux Cored Solder Using the Flux, and Soldering Method |
MYPI2020006976A MY196946A (en) | 2019-12-25 | 2020-12-23 | Flux, resin flux cored solder using the flux, and a soldering method |
CN202011547818.7A CN113020841B (zh) | 2019-12-25 | 2020-12-24 | 助焊剂、包芯软钎料和软钎焊方法 |
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JP2022093258A (ja) * | 2020-12-11 | 2022-06-23 | 株式会社デンソー | はんだ付け製品の製造方法 |
EP4260971A4 (en) * | 2020-12-11 | 2024-05-29 | Senju Metal Industry Co., Ltd. | FLUXES FOR RESIN-FILLED SOLDER, RESIN-FILLED SOLDER AND SOLDERING PROCESSES |
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US11618109B2 (en) * | 2020-06-30 | 2023-04-04 | Electronics And Telecommunications Research Institute | Wire for electric bonding |
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JPS61256952A (ja) | 1985-05-02 | 1986-11-14 | 宇部興産株式会社 | 鋼材防食性のセメント混練物およびセメント硬化体の製造法 |
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JP2007069258A (ja) * | 2005-09-09 | 2007-03-22 | Uchihashi Estec Co Ltd | はんだ付け用フラックス組成物及びヤニ入りはんだ並びにソルダペースト |
JP2007069259A (ja) * | 2005-09-09 | 2007-03-22 | Uchihashi Estec Co Ltd | ヤニ入りはんだ |
CN101622094B (zh) * | 2007-01-04 | 2014-03-19 | 弗赖斯金属有限公司 | 焊剂组合物 |
JP2009195938A (ja) * | 2008-02-21 | 2009-09-03 | Mitsuo Ebisawa | 半田鏝、それを用いて電子機器を製造する方法 |
JP2010046689A (ja) * | 2008-08-21 | 2010-03-04 | Uchihashi Estec Co Ltd | はんだ付け用フラックス及びソルダペースト並びにやに入りはんだ |
CN102284809B (zh) * | 2009-10-12 | 2015-04-15 | 宁波喜汉锡焊料有限公司 | 锡丝芯用无卤免清洗助焊剂 |
JP5520973B2 (ja) * | 2012-01-17 | 2014-06-11 | 株式会社デンソー | やに入りはんだ用フラックス及びやに入りはんだ |
JP6136690B2 (ja) * | 2012-08-01 | 2017-05-31 | 三菱マテリアル株式会社 | ハンダペースト |
JP2017113776A (ja) * | 2015-12-24 | 2017-06-29 | 荒川化学工業株式会社 | やに入りはんだ用フラックス、やに入りはんだ |
CN105458552B (zh) * | 2015-12-31 | 2018-07-17 | 深圳市兴鸿泰锡业有限公司 | 一种自动锡焊用高性能焊锡丝助焊剂及其制备方法 |
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CN109676284A (zh) * | 2018-12-13 | 2019-04-26 | 上海锡喜材料科技有限公司 | 助焊膏及其制作方法 |
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JP2022093258A (ja) * | 2020-12-11 | 2022-06-23 | 株式会社デンソー | はんだ付け製品の製造方法 |
JP7394097B2 (ja) | 2020-12-11 | 2023-12-07 | 株式会社デンソー | はんだ付け製品の製造方法 |
EP4260971A4 (en) * | 2020-12-11 | 2024-05-29 | Senju Metal Industry Co., Ltd. | FLUXES FOR RESIN-FILLED SOLDER, RESIN-FILLED SOLDER AND SOLDERING PROCESSES |
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