JP6787210B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP6787210B2 JP6787210B2 JP2017057878A JP2017057878A JP6787210B2 JP 6787210 B2 JP6787210 B2 JP 6787210B2 JP 2017057878 A JP2017057878 A JP 2017057878A JP 2017057878 A JP2017057878 A JP 2017057878A JP 6787210 B2 JP6787210 B2 JP 6787210B2
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- resin
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- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
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- C—CHEMISTRY; METALLURGY
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- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J2375/04—Polyurethanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
- C08J2375/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/02—Polyglycidyl ethers of bis-phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K2201/003—Additives being defined by their diameter
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- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C—CHEMISTRY; METALLURGY
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- H—ELECTRICITY
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Graft Or Block Polymers (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017057878A JP6787210B2 (ja) | 2017-03-23 | 2017-03-23 | 樹脂組成物 |
TW107108583A TWI779019B (zh) | 2017-03-23 | 2018-03-14 | 樹脂組成物 |
TW111133516A TWI835277B (zh) | 2017-03-23 | 2018-03-14 | 樹脂組成物 |
TW113104686A TW202421722A (zh) | 2017-03-23 | 2018-03-14 | 樹脂組成物 |
KR1020180032799A KR102610333B1 (ko) | 2017-03-23 | 2018-03-21 | 수지 조성물 |
CN202210325373.0A CN114806145A (zh) | 2017-03-23 | 2018-03-22 | 树脂组合物 |
CN201810239264.0A CN108624218B (zh) | 2017-03-23 | 2018-03-22 | 树脂组合物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017057878A JP6787210B2 (ja) | 2017-03-23 | 2017-03-23 | 樹脂組成物 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020179835A Division JP7131593B2 (ja) | 2020-10-27 | 2020-10-27 | 樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018159028A JP2018159028A (ja) | 2018-10-11 |
JP6787210B2 true JP6787210B2 (ja) | 2020-11-18 |
Family
ID=63696226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017057878A Active JP6787210B2 (ja) | 2017-03-23 | 2017-03-23 | 樹脂組成物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6787210B2 (ko) |
KR (1) | KR102610333B1 (ko) |
CN (2) | CN108624218B (ko) |
TW (3) | TWI835277B (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101972703B1 (ko) * | 2018-09-12 | 2019-04-25 | 동명대학교산학협력단 | 파이프 유지보수용 유체흐름 차단장치 |
WO2020067016A1 (ja) * | 2018-09-27 | 2020-04-02 | 日立化成株式会社 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
JP7131311B2 (ja) * | 2018-11-06 | 2022-09-06 | 味の素株式会社 | 樹脂組成物 |
JP7151550B2 (ja) * | 2019-02-26 | 2022-10-12 | 味の素株式会社 | 樹脂組成物 |
JP7294834B2 (ja) * | 2019-03-15 | 2023-06-20 | 太陽ホールディングス株式会社 | 硬化性組成物、ドライフィルム、硬化物、積層板および電子部品 |
JP7224984B2 (ja) * | 2019-03-19 | 2023-02-20 | 日東電工株式会社 | 封止用シート |
CN111961312B (zh) * | 2019-05-20 | 2023-09-12 | 苏州生益科技有限公司 | 树脂组合物及具有其的半固化片、绝缘薄膜、覆金属箔层压板、印制线路板 |
CN110446356A (zh) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | 一种大功率密度led载板的制作方法 |
US20230002532A1 (en) * | 2019-11-29 | 2023-01-05 | Nippon Soda Co., Ltd. | Terminally modified polybutadiene, resin composition for metal-clad laminates, prepreg, and metal-clad laminate |
CN110931208A (zh) * | 2019-12-05 | 2020-03-27 | 百胜电气有限公司 | 一种干式变压器 |
JP7298466B2 (ja) * | 2019-12-11 | 2023-06-27 | 味の素株式会社 | 樹脂組成物 |
JP6997834B1 (ja) * | 2020-06-26 | 2022-01-24 | デクセリアルズ株式会社 | 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート |
CN111799243A (zh) * | 2020-06-30 | 2020-10-20 | 深圳明阳芯蕊半导体有限公司 | 芯片封装基板及其制作方法、芯片封装结构及封装方法 |
JP7409262B2 (ja) * | 2020-08-24 | 2024-01-09 | 味の素株式会社 | 樹脂組成物 |
US20220149020A1 (en) * | 2020-11-10 | 2022-05-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure, semiconductor device and manufacturing method thereof |
CN116162391B (zh) * | 2022-12-28 | 2023-08-01 | 河南省科学院化学研究所 | 光热驱动限域固-液转变自修复防腐涂层材料及制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004018720A (ja) * | 2002-06-18 | 2004-01-22 | Mitsui Chemicals Inc | 半導体装置用接着剤 |
JP4380684B2 (ja) * | 2006-10-20 | 2009-12-09 | 住友ベークライト株式会社 | 半導体用接着フィルム、ダイシングフィルムおよび半導体装置 |
CN101679612B (zh) * | 2007-06-14 | 2013-07-17 | 味之素株式会社 | 多层印刷电路板的层间绝缘用树脂组合物 |
US20100279469A1 (en) * | 2007-11-20 | 2010-11-04 | Hwail Jin | Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same |
JP2009155370A (ja) * | 2007-12-25 | 2009-07-16 | Gun Ei Chem Ind Co Ltd | モーター封止用エポキシ樹脂成形材料及び成形品 |
JP6308713B2 (ja) * | 2012-08-07 | 2018-04-11 | 味の素株式会社 | 樹脂組成物 |
TWI694109B (zh) * | 2013-06-12 | 2020-05-21 | 日商味之素股份有限公司 | 樹脂組成物 |
CN105308121B (zh) * | 2013-06-25 | 2018-09-18 | 味之素株式会社 | 树脂组合物 |
JP2015030819A (ja) * | 2013-08-05 | 2015-02-16 | 株式会社ジェイテクト | アクリルゴム組成物およびこれを備えたシール装置 |
JP5915610B2 (ja) * | 2013-09-18 | 2016-05-11 | 味の素株式会社 | 樹脂組成物 |
CN103755989B (zh) * | 2014-01-14 | 2017-01-11 | 广东生益科技股份有限公司 | 电路基板及其制备方法 |
WO2016125664A1 (ja) * | 2015-02-05 | 2016-08-11 | 味の素株式会社 | 樹脂組成物 |
JP6558055B2 (ja) * | 2015-04-30 | 2019-08-14 | 味の素株式会社 | 樹脂組成物 |
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2017
- 2017-03-23 JP JP2017057878A patent/JP6787210B2/ja active Active
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2018
- 2018-03-14 TW TW111133516A patent/TWI835277B/zh active
- 2018-03-14 TW TW107108583A patent/TWI779019B/zh active
- 2018-03-14 TW TW113104686A patent/TW202421722A/zh unknown
- 2018-03-21 KR KR1020180032799A patent/KR102610333B1/ko active IP Right Grant
- 2018-03-22 CN CN201810239264.0A patent/CN108624218B/zh active Active
- 2018-03-22 CN CN202210325373.0A patent/CN114806145A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
TW202421722A (zh) | 2024-06-01 |
CN108624218B (zh) | 2022-03-29 |
TW202305059A (zh) | 2023-02-01 |
CN114806145A (zh) | 2022-07-29 |
KR20180108482A (ko) | 2018-10-04 |
TWI835277B (zh) | 2024-03-11 |
TW201842062A (zh) | 2018-12-01 |
KR102610333B1 (ko) | 2023-12-07 |
JP2018159028A (ja) | 2018-10-11 |
CN108624218A (zh) | 2018-10-09 |
TWI779019B (zh) | 2022-10-01 |
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