JP6785735B2 - 切断装置及び半導体パッケージの搬送方法 - Google Patents

切断装置及び半導体パッケージの搬送方法 Download PDF

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JP6785735B2
JP6785735B2 JP2017171960A JP2017171960A JP6785735B2 JP 6785735 B2 JP6785735 B2 JP 6785735B2 JP 2017171960 A JP2017171960 A JP 2017171960A JP 2017171960 A JP2017171960 A JP 2017171960A JP 6785735 B2 JP6785735 B2 JP 6785735B2
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semiconductor package
cutting
transport mechanism
semiconductor
suction
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JP2017171960A
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Japanese (ja)
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JP2019047078A (ja
Inventor
幹司 石橋
幹司 石橋
直己 藤原
直己 藤原
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Towa Corp
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Towa Corp
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Priority to JP2017171960A priority Critical patent/JP6785735B2/ja
Priority to KR1020180080966A priority patent/KR102182956B1/ko
Priority to TW107129430A priority patent/TWI697042B/zh
Priority to CN201810980250.4A priority patent/CN109473376B/zh
Publication of JP2019047078A publication Critical patent/JP2019047078A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
JP2017171960A 2017-09-07 2017-09-07 切断装置及び半導体パッケージの搬送方法 Active JP6785735B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017171960A JP6785735B2 (ja) 2017-09-07 2017-09-07 切断装置及び半導体パッケージの搬送方法
KR1020180080966A KR102182956B1 (ko) 2017-09-07 2018-07-12 절단 장치 및 반도체 패키지의 반송 방법
TW107129430A TWI697042B (zh) 2017-09-07 2018-08-23 切斷裝置以及半導體封裝的搬送方法
CN201810980250.4A CN109473376B (zh) 2017-09-07 2018-08-27 切断装置以及半导体封装的搬送方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017171960A JP6785735B2 (ja) 2017-09-07 2017-09-07 切断装置及び半導体パッケージの搬送方法

Publications (2)

Publication Number Publication Date
JP2019047078A JP2019047078A (ja) 2019-03-22
JP6785735B2 true JP6785735B2 (ja) 2020-11-18

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JP2017171960A Active JP6785735B2 (ja) 2017-09-07 2017-09-07 切断装置及び半導体パッケージの搬送方法

Country Status (4)

Country Link
JP (1) JP6785735B2 (zh)
KR (1) KR102182956B1 (zh)
CN (1) CN109473376B (zh)
TW (1) TWI697042B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7154195B2 (ja) * 2019-07-26 2022-10-17 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
JP7149249B2 (ja) * 2019-10-31 2022-10-06 Ｔｏｗａ株式会社 搬送モジュール、切断装置及び切断品の製造方法
KR102610004B1 (ko) * 2020-11-19 2023-12-05 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 패키지 건조 장치
JP7456399B2 (ja) * 2021-02-12 2024-03-27 株式会社村田製作所 シート搬送装置
CN114571615B (zh) * 2022-01-21 2023-10-20 江西红板科技股份有限公司 一种芯片封装装置及其封装系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4309084B2 (ja) * 2001-11-26 2009-08-05 アピックヤマダ株式会社 ダイシング装置
US6746022B2 (en) 2001-12-26 2004-06-08 Asm Assembly Automation Ltd. Chuck for holding a workpiece
TW201001566A (en) * 2008-06-24 2010-01-01 Powertech Technology Inc Jig and method for picking up a die
JP5202493B2 (ja) * 2009-10-21 2013-06-05 シャープ株式会社 半導体装置の製造装置および半導体装置の製造方法
WO2011128981A1 (ja) * 2010-04-13 2011-10-20 パイオニア株式会社 部品移送装置及び方法
KR101322531B1 (ko) * 2012-05-21 2013-10-28 세메스 주식회사 반도체 소자들을 픽업하기 위한 장치
JP6257266B2 (ja) * 2013-10-29 2018-01-10 Ｔｏｗａ株式会社 電子部品の製造装置及び製造方法
JP6235391B2 (ja) * 2014-03-27 2017-11-22 Ｔｏｗａ株式会社 検査用治具、切断装置及び切断方法
JP6312554B2 (ja) * 2014-08-13 2018-04-18 株式会社ディスコ パッケージ基板の加工方法
KR102267946B1 (ko) * 2014-11-04 2021-06-22 세메스 주식회사 반도체 패키지 및 반도체 스트립 이송 장치
JP2017054956A (ja) * 2015-09-10 2017-03-16 株式会社ディスコ 被加工物の支持治具

Also Published As

Publication number Publication date
KR102182956B1 (ko) 2020-11-25
CN109473376A (zh) 2019-03-15
CN109473376B (zh) 2022-02-11
TWI697042B (zh) 2020-06-21
JP2019047078A (ja) 2019-03-22
TW201913772A (zh) 2019-04-01
KR20190027706A (ko) 2019-03-15

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