JP6784505B2 - コンデンサ実装構造 - Google Patents
コンデンサ実装構造 Download PDFInfo
- Publication number
- JP6784505B2 JP6784505B2 JP2016080850A JP2016080850A JP6784505B2 JP 6784505 B2 JP6784505 B2 JP 6784505B2 JP 2016080850 A JP2016080850 A JP 2016080850A JP 2016080850 A JP2016080850 A JP 2016080850A JP 6784505 B2 JP6784505 B2 JP 6784505B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- multilayer
- mounting structure
- circuit board
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 title claims description 232
- 238000010586 diagram Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000012795 verification Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
Claims (2)
- 複数個の積層コンデンサを直列接続下で回路基板に実装したコンデンサ実装構造であって、
前記積層コンデンサは、相対する端部それぞれに設けられた外部電極の一方に複数の内部電極層の一部が接続され他方に当該複数の内部電極層の残部が接続された構造にあり、
前記複数個の積層コンデンサは、(1)前記回路基板の一面に設けられた直列接続用配線に、(2)積層コンデンサそれぞれが間隔をおいて平行となる位置関係で、(3)積層コンデンサそれぞれの内部電極層が前記回路基板の一面と略直角となる向きで、(4)隣接する積層コンデンサそれぞれの内部電極層が向き合うように、(5)隣接する積層コンデンサそれぞれに流れる信号の方向が逆向きになるように、直列接続され、
前記複数個の積層コンデンサの数は3個であり、前記直列接続用配線を含む当該3個の積層コンデンサの直列接続経路は前記回路基板の一面において略S字状である、
コンデンサ実装構造。 - 前記複数個の積層コンデンサには、仕様が同じ積層コンデンサと、仕様が異なる積層コンデンサの一方が用いられている、
請求項1に記載のコンデンサ実装構造。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016080850A JP6784505B2 (ja) | 2016-04-14 | 2016-04-14 | コンデンサ実装構造 |
US15/485,126 US10123421B2 (en) | 2016-04-14 | 2017-04-11 | Capacitor mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016080850A JP6784505B2 (ja) | 2016-04-14 | 2016-04-14 | コンデンサ実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017191866A JP2017191866A (ja) | 2017-10-19 |
JP6784505B2 true JP6784505B2 (ja) | 2020-11-11 |
Family
ID=60038423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016080850A Active JP6784505B2 (ja) | 2016-04-14 | 2016-04-14 | コンデンサ実装構造 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10123421B2 (ja) |
JP (1) | JP6784505B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI742110B (zh) * | 2016-07-21 | 2021-10-11 | 美商席利通公司 | 具備改良電極壽命之快速脈波電動液壓脈衝產生裝置及使用該裝置生成壓縮聲波之方法 |
KR20210149124A (ko) | 2019-04-03 | 2021-12-08 | 솔리톤, 인코포레이티드 | 비침습적 음향 서브시전으로 조직 및 셀룰라이트를 치료하는 시스템, 장치 및 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59191723U (ja) * | 1983-06-07 | 1984-12-19 | 日本電気株式会社 | 積層セラミツクコンデンサ |
JP2882994B2 (ja) * | 1994-03-11 | 1999-04-19 | 株式会社ピーエフユー | コンデンサを実装したプリント板 |
JPH0855752A (ja) * | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層コンデンサの実装方法及び積層コンデンサ |
JP2001023849A (ja) * | 1999-07-13 | 2001-01-26 | Hitachi Ltd | コンデンサを備える回路および配線基板 |
US6337798B1 (en) * | 2000-01-25 | 2002-01-08 | Dell Usa, L.P. | Digital circuit decoupling for EMI reduction |
JP2002232110A (ja) * | 2001-02-02 | 2002-08-16 | Tohoku Pioneer Corp | 積層セラミックコンデンサを実装した回路基板 |
US6618266B2 (en) * | 2001-03-06 | 2003-09-09 | Hewlett-Packard Development Company, L.P. | Method for high-density, low-via-count, decoupling capacitor placement |
JP3948321B2 (ja) * | 2002-03-26 | 2007-07-25 | 株式会社村田製作所 | 3端子コンデンサの実装構造 |
JP4290385B2 (ja) * | 2002-04-26 | 2009-07-01 | 太陽誘電株式会社 | コンデンサの回路基板実装方法及びコンデンサ実装回路基板 |
JP4152905B2 (ja) * | 2004-02-26 | 2008-09-17 | 三菱電機株式会社 | コンデンサモジュール装置 |
JP5534566B2 (ja) * | 2009-05-26 | 2014-07-02 | 株式会社村田製作所 | 3端子コンデンサ実装構造 |
JP2012129773A (ja) * | 2010-12-15 | 2012-07-05 | Tdk Corp | 電子部品の実装構造 |
JP5413376B2 (ja) * | 2011-01-24 | 2014-02-12 | Tdk株式会社 | 積層型電子部品及び電子部品の実装構造 |
JP2013080773A (ja) * | 2011-10-03 | 2013-05-02 | Tdk Corp | 複合電子部品及び複合電子部品の実装構造 |
JP2013251495A (ja) | 2012-06-04 | 2013-12-12 | Toshiba Mitsubishi-Electric Industrial System Corp | 高電圧コンデンサユニット |
US9609753B2 (en) * | 2013-07-11 | 2017-03-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board for mounting of the same |
WO2015107810A1 (ja) * | 2014-01-17 | 2015-07-23 | 株式会社村田製作所 | ノイズフィルタ |
JP6481446B2 (ja) * | 2014-06-13 | 2019-03-13 | 株式会社村田製作所 | 積層コンデンサの実装構造体 |
-
2016
- 2016-04-14 JP JP2016080850A patent/JP6784505B2/ja active Active
-
2017
- 2017-04-11 US US15/485,126 patent/US10123421B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017191866A (ja) | 2017-10-19 |
US10123421B2 (en) | 2018-11-06 |
US20170301474A1 (en) | 2017-10-19 |
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