JP6778021B2 - テープ剥離装置 - Google Patents
テープ剥離装置 Download PDFInfo
- Publication number
- JP6778021B2 JP6778021B2 JP2016112563A JP2016112563A JP6778021B2 JP 6778021 B2 JP6778021 B2 JP 6778021B2 JP 2016112563 A JP2016112563 A JP 2016112563A JP 2016112563 A JP2016112563 A JP 2016112563A JP 6778021 B2 JP6778021 B2 JP 6778021B2
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- tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Description
11:移動手段 110:可動板 111:ガイドレール
30:保持テーブル 300:吸着部 300a:保持面 301:枠体
302:連結部材
31:リングフレーム保持部 310:挟持クランプ
311:昇降手段 311a:シリンダチューブ 311b:ピストンロッド
2:挟持手段 20:一対の挟持板
4:剥離テープ貼着手段 40:剥離テープ供給手段 400:支持ローラ
401:一対の駆動ローラ 401c:一対の駆動ローラの外周面 41:カッター
41a:刃先 42:押し付け部 42b:押し付け部の底面
43:昇降手段
44:加熱手段 440:一対のヒータ部
45:冷却手段 450:一対の冷却ノズル 450a:噴射口
46:温度センサ
9:制御手段
W:ウエーハ Wa:ウエーハの一方の面 Wb:ウエーハの他方の面
T1:ダイシングテープ
T2:保護テープ T2a:保護テープの露出面 T2b:保護テープの粘着面
T3:剥離テープ T3a:剥離テープの基材面 T3b:剥離テープの粘着面
T3c:剥離テープの一端 T3d:剥離テープの他端
1A:テープ剥離装置
4A:剥離テープ貼着手段
44A:加熱手段 440:一対のヒータ部 441:加熱手段移動手段
45A:冷却手段
451:一対の冷却フィン 451a:フィン表面 451b:電動ファン
452:冷却手段移動手段
T20:保護テープ
Claims (1)
- ウエーハの一方の面に貼着された保護テープに剥離テープを貼着し該剥離テープを引っ張って該保護テープをウエーハから剥離するテープ剥離装置であって、ウエーハの他方の面側を保持する保持テーブルと、該保持テーブルに保持されるウエーハの該保護テープの上面に押し付け部で該剥離テープを押し付けて貼着する剥離テープ貼着手段と、該剥離テープ貼着手段で貼着された該剥離テープの一端を挟持する挟持手段と、該挟持手段と該保持テーブルとを相対的にウエーハの外側から中心に向かって移動させ該剥離テープを引っ張って該保護テープをウエーハから剥離する移動手段と、少なくとも該押し付け部の温度を制御する制御手段とを備え、
該剥離テープ貼着手段は、該押し付け部と、該押し付け部を該保持テーブルに接近又は離間させる昇降手段と、該押し付け部を加熱する加熱手段と、該押し付け部を冷却する冷却手段と、該押し付け部の温度を検知する温度センサと、を備え、
該加熱手段は、該押し付け部を挟むように配設される少なくとも一対のヒータ部と、該一対のヒータ部が該押し付け部を挟み込むように該一対のヒータ部を移動させる加熱手段移動手段とを備え、
該冷却手段は、該押し付け部を挟むように配設される少なくとも一対の冷却フィンと、該一対の冷却フィンが該押し付け部を挟み込むように該一対の冷却フィンを移動させる冷却手段移動手段とを備え、
該制御手段は、該加熱手段と該冷却手段とを用いて該保護テープの品質に応じてあらかじめ設定された接着温度と該温度センサが検知する該押し付け部の温度とを一致させるために、
該押し付け部を加熱するときは、該加熱手段移動手段で該少なくとも一対のヒータ部を移動させ該少なくとも一対のヒータ部で該押し付け部を挟み込み該押し付け部が所定の温度になるまで加熱させ、該押し付け部を冷却するときは、該冷却手段移動手段で該少なくとも一対の該冷却フィンを移動させ該少なくとも一対の冷却フィンで該押し付け部が所定の温度になるまで冷却させる制御を行う、
テープ剥離装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016112563A JP6778021B2 (ja) | 2016-06-06 | 2016-06-06 | テープ剥離装置 |
TW106114783A TWI728106B (zh) | 2016-06-06 | 2017-05-04 | 膠帶剝離裝置 |
KR1020170064617A KR102242435B1 (ko) | 2016-06-06 | 2017-05-25 | 테이프 박리 장치 |
CN201710407687.4A CN107464767B (zh) | 2016-06-06 | 2017-06-02 | 带剥离装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016112563A JP6778021B2 (ja) | 2016-06-06 | 2016-06-06 | テープ剥離装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017220506A JP2017220506A (ja) | 2017-12-14 |
JP6778021B2 true JP6778021B2 (ja) | 2020-10-28 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016112563A Active JP6778021B2 (ja) | 2016-06-06 | 2016-06-06 | テープ剥離装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6778021B2 (ja) |
KR (1) | KR102242435B1 (ja) |
CN (1) | CN107464767B (ja) |
TW (1) | TWI728106B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111029292B (zh) * | 2019-12-25 | 2022-08-02 | 山东天岳先进科技股份有限公司 | 一种晶锭的粘结分离装置及方法 |
JP2022084207A (ja) | 2020-11-26 | 2022-06-07 | 株式会社ディスコ | テープ剥離装置 |
CN113327878B (zh) * | 2021-08-03 | 2021-10-08 | 四川明泰微电子有限公司 | 晶圆上料装置及晶圆贴膜装置 |
JP2023059151A (ja) * | 2021-10-14 | 2023-04-26 | 株式会社東京精密 | ワーク加工装置 |
CN114683443B (zh) * | 2022-03-11 | 2023-09-12 | 安徽科技学院 | 一种pvc绝缘胶带回收处理装置及方法 |
CN115410979B (zh) * | 2022-09-06 | 2023-06-06 | 西湖仪器(杭州)技术有限公司 | 一种晶圆片的剥离方法及激光分片方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002367931A (ja) * | 2001-06-07 | 2002-12-20 | Lintec Corp | ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法 |
KR20070022626A (ko) * | 2003-10-17 | 2007-02-27 | 린텍 가부시키가이샤 | 접착 테이프의 박리장치 |
JP4326519B2 (ja) * | 2005-03-31 | 2009-09-09 | 日東電工株式会社 | 保護テープ剥離方法およびこれを用いた装置 |
JP4295271B2 (ja) * | 2005-07-06 | 2009-07-15 | 日東電工株式会社 | 保護テープ剥離方法およびこれを用いた装置 |
JP5292057B2 (ja) * | 2008-10-30 | 2013-09-18 | リンテック株式会社 | テーブル及びこれを用いたシート剥離装置並びに剥離方法 |
JP2011171530A (ja) * | 2010-02-19 | 2011-09-01 | Mitsubishi Electric Corp | 保護テープの剥離方法および剥離装置、ならびに半導体装置の製造方法 |
JP2011204860A (ja) | 2010-03-25 | 2011-10-13 | Disco Corp | テープ剥離装置 |
JP6315784B2 (ja) * | 2014-03-24 | 2018-04-25 | リンテック株式会社 | シート剥離装置および剥離方法 |
JP6349195B2 (ja) * | 2014-08-07 | 2018-06-27 | リンテック株式会社 | シート剥離装置および剥離方法 |
-
2016
- 2016-06-06 JP JP2016112563A patent/JP6778021B2/ja active Active
-
2017
- 2017-05-04 TW TW106114783A patent/TWI728106B/zh active
- 2017-05-25 KR KR1020170064617A patent/KR102242435B1/ko active IP Right Grant
- 2017-06-02 CN CN201710407687.4A patent/CN107464767B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20170138039A (ko) | 2017-12-14 |
TW201743376A (zh) | 2017-12-16 |
CN107464767B (zh) | 2023-03-14 |
TWI728106B (zh) | 2021-05-21 |
KR102242435B1 (ko) | 2021-04-19 |
JP2017220506A (ja) | 2017-12-14 |
CN107464767A (zh) | 2017-12-12 |
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