JP6762220B2 - 加工装置の搬送機構 - Google Patents

加工装置の搬送機構 Download PDF

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Publication number
JP6762220B2
JP6762220B2 JP2016243760A JP2016243760A JP6762220B2 JP 6762220 B2 JP6762220 B2 JP 6762220B2 JP 2016243760 A JP2016243760 A JP 2016243760A JP 2016243760 A JP2016243760 A JP 2016243760A JP 6762220 B2 JP6762220 B2 JP 6762220B2
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Japan
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workpiece
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Active
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JP2016243760A
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English (en)
Japanese (ja)
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JP2018098425A (ja
Inventor
福岡　武臣
武臣 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2016243760A priority Critical patent/JP6762220B2/ja
Priority to TW106138567A priority patent/TWI737848B/zh
Priority to CN201711294061.3A priority patent/CN108231641B/zh
Publication of JP2018098425A publication Critical patent/JP2018098425A/ja
Application granted granted Critical
Publication of JP6762220B2 publication Critical patent/JP6762220B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2016243760A 2016-12-15 2016-12-15 加工装置の搬送機構 Active JP6762220B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016243760A JP6762220B2 (ja) 2016-12-15 2016-12-15 加工装置の搬送機構
TW106138567A TWI737848B (zh) 2016-12-15 2017-11-08 加工裝置的搬運機構
CN201711294061.3A CN108231641B (zh) 2016-12-15 2017-12-08 加工装置的搬送机构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016243760A JP6762220B2 (ja) 2016-12-15 2016-12-15 加工装置の搬送機構

Publications (2)

Publication Number Publication Date
JP2018098425A JP2018098425A (ja) 2018-06-21
JP6762220B2 true JP6762220B2 (ja) 2020-09-30

Family

ID=62631428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016243760A Active JP6762220B2 (ja) 2016-12-15 2016-12-15 加工装置の搬送機構

Country Status (3)

Country Link
JP (1) JP6762220B2 (zh)
CN (1) CN108231641B (zh)
TW (1) TWI737848B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7294777B2 (ja) * 2018-07-09 2023-06-20 株式会社ディスコ 被加工物の乾燥方法及び切削装置
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
CN116329975B (zh) * 2023-04-03 2023-09-05 东莞市腾信精密仪器有限公司 一种工业零组件精密机加工数控设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5248987B2 (ja) * 2008-11-11 2013-07-31 株式会社ディスコ 搬送機構
JP5773841B2 (ja) * 2011-10-27 2015-09-02 株式会社ディスコ ユニット搬出入装置
JP2014135333A (ja) * 2013-01-09 2014-07-24 Mitsuboshi Diamond Industrial Co Ltd 吸着昇降装置
JP2015233065A (ja) * 2014-06-09 2015-12-24 株式会社ディスコ 搬送装置
JP6456177B2 (ja) * 2015-02-12 2019-01-23 株式会社ディスコ ウェーハ処理システム
JP6491017B2 (ja) * 2015-04-08 2019-03-27 株式会社ディスコ 被加工物の搬送トレー
JP6441737B2 (ja) * 2015-04-28 2018-12-19 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
CN108231641B (zh) 2023-04-07
TW201830559A (zh) 2018-08-16
CN108231641A (zh) 2018-06-29
TWI737848B (zh) 2021-09-01
JP2018098425A (ja) 2018-06-21

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