JP6762024B2 - レーザ加工装置及びレーザ加工方法 - Google Patents

レーザ加工装置及びレーザ加工方法 Download PDF

Info

Publication number
JP6762024B2
JP6762024B2 JP2016148327A JP2016148327A JP6762024B2 JP 6762024 B2 JP6762024 B2 JP 6762024B2 JP 2016148327 A JP2016148327 A JP 2016148327A JP 2016148327 A JP2016148327 A JP 2016148327A JP 6762024 B2 JP6762024 B2 JP 6762024B2
Authority
JP
Japan
Prior art keywords
resin layer
laser
resin
layer
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016148327A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018015783A (ja
Inventor
剛史 池田
剛史 池田
美紀 荒川
美紀 荒川
百加 橋本
百加 橋本
山本 幸司
山本  幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2016148327A priority Critical patent/JP6762024B2/ja
Priority to KR1020170032075A priority patent/KR20180013675A/ko
Priority to TW106111313A priority patent/TWI722162B/zh
Priority to CN201710498822.0A priority patent/CN107662050B/zh
Publication of JP2018015783A publication Critical patent/JP2018015783A/ja
Application granted granted Critical
Publication of JP6762024B2 publication Critical patent/JP6762024B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced
    • B23K2103/166Multilayered materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
JP2016148327A 2016-07-28 2016-07-28 レーザ加工装置及びレーザ加工方法 Active JP6762024B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016148327A JP6762024B2 (ja) 2016-07-28 2016-07-28 レーザ加工装置及びレーザ加工方法
KR1020170032075A KR20180013675A (ko) 2016-07-28 2017-03-14 레이저 가공 장치 및 레이저 가공 방법
TW106111313A TWI722162B (zh) 2016-07-28 2017-04-05 雷射加工裝置以及雷射加工方法
CN201710498822.0A CN107662050B (zh) 2016-07-28 2017-06-27 激光加工装置以及激光加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016148327A JP6762024B2 (ja) 2016-07-28 2016-07-28 レーザ加工装置及びレーザ加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018034119A Division JP6744634B2 (ja) 2018-02-28 2018-02-28 レーザ加工方法

Publications (2)

Publication Number Publication Date
JP2018015783A JP2018015783A (ja) 2018-02-01
JP6762024B2 true JP6762024B2 (ja) 2020-09-30

Family

ID=61078974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016148327A Active JP6762024B2 (ja) 2016-07-28 2016-07-28 レーザ加工装置及びレーザ加工方法

Country Status (4)

Country Link
JP (1) JP6762024B2 (zh)
KR (1) KR20180013675A (zh)
CN (1) CN107662050B (zh)
TW (1) TWI722162B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200127078A (ko) * 2019-04-30 2020-11-10 세메스 주식회사 기판 처리 방법, 기판 처리 장치 및 기판 처리 설비
WO2020245957A1 (ja) * 2019-06-05 2020-12-10 三菱重工業株式会社 レーザ加工方法及びレーザ加工装置
JP7324499B2 (ja) * 2019-08-29 2023-08-10 三星ダイヤモンド工業株式会社 溝形成方法及び溝形成装置
CN114126229A (zh) * 2021-11-19 2022-03-01 深圳市大族数控科技股份有限公司 激光钻孔方法及加工设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5536579A (en) * 1994-06-02 1996-07-16 International Business Machines Corporation Design of high density structures with laser etch stop
JP4589760B2 (ja) * 2005-03-08 2010-12-01 住友重機械工業株式会社 レーザ加工方法
JP5454080B2 (ja) * 2008-10-23 2014-03-26 住友電気工業株式会社 レーザ加工方法およびレーザ加工装置
JP2013500869A (ja) * 2009-07-28 2013-01-10 スリーエム イノベイティブ プロパティズ カンパニー 被覆研磨物品及び被覆研磨物品をアブレーションする方法
JP5525246B2 (ja) * 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
KR101203106B1 (ko) * 2010-04-05 2012-11-20 김원옥 씨오피층이 포함된 다층필름의 레이저 절단방법
JP2012045567A (ja) * 2010-08-26 2012-03-08 Sumitomo Electric Ind Ltd レーザ加工方法および装置
JP2012061480A (ja) * 2010-09-14 2012-03-29 Sumitomo Electric Ind Ltd 基板の製造方法
JP5773629B2 (ja) * 2010-12-01 2015-09-02 キヤノン株式会社 シャッター装置
JP5340447B2 (ja) * 2012-03-28 2013-11-13 日東電工株式会社 レーザー加工方法及びレーザー加工品
JP7260993B2 (ja) * 2017-12-07 2023-04-19 住友化学株式会社 積層フィルムの切断方法及び製造方法

Also Published As

Publication number Publication date
CN107662050B (zh) 2022-02-25
KR20180013675A (ko) 2018-02-07
JP2018015783A (ja) 2018-02-01
TWI722162B (zh) 2021-03-21
TW201811479A (zh) 2018-04-01
CN107662050A (zh) 2018-02-06

Similar Documents

Publication Publication Date Title
JP6762024B2 (ja) レーザ加工装置及びレーザ加工方法
JP6814459B2 (ja) レーザ加工方法
KR102623538B1 (ko) 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
JP5096040B2 (ja) レーザー加工方法及びレーザー加工品
TWI464029B (zh) Laser processing method
JP2007296533A (ja) レーザ加工方法及び装置
CN104859062B (zh) 晶片的加工方法
JP6744634B2 (ja) レーザ加工方法
JP2017037912A (ja) 検査用ウエーハおよび検査用ウエーハの使用方法
JP2006253432A (ja) ウエーハのレーザー加工方法および加工装置
WO2011128929A1 (ja) レーザ切断方法及びレーザ切断装置
JP5160868B2 (ja) 基板への改質層形成方法
CN103035570A (zh) 烧蚀加工方法
JP6366486B2 (ja) ウエーハの生成方法
JP6370648B2 (ja) ワークの分割方法
JP2020019070A (ja) 多層基板を切断する方法及び切断装置
KR20150102164A (ko) 기판 절단장치 및 이를 이용한 디스플레이 장치 제조방법
JP5340447B2 (ja) レーザー加工方法及びレーザー加工品
JP2017034200A (ja) ウェーハの加工方法
KR102269138B1 (ko) 기판 절단장치 및 이를 이용한 디스플레이 장치 제조방법
JP2020088217A (ja) 基板小片の切り出し方法及び切出装置
KR20200012737A (ko) 다층 기판을 절단하는 방법 및 절단 장치
KR101398562B1 (ko) 투명도전성 필름 가공 방법
KR102204685B1 (ko) 플렉시블 유기 el 디스플레이의 제조 방법
JP2020053208A (ja) 基板小片の切り出し方法及び切出装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190701

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200519

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200602

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200729

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200825

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200901

R150 Certificate of patent or registration of utility model

Ref document number: 6762024

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250