JP6762024B2 - レーザ加工装置及びレーザ加工方法 - Google Patents
レーザ加工装置及びレーザ加工方法 Download PDFInfo
- Publication number
- JP6762024B2 JP6762024B2 JP2016148327A JP2016148327A JP6762024B2 JP 6762024 B2 JP6762024 B2 JP 6762024B2 JP 2016148327 A JP2016148327 A JP 2016148327A JP 2016148327 A JP2016148327 A JP 2016148327A JP 6762024 B2 JP6762024 B2 JP 6762024B2
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- laser
- resin
- layer
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016148327A JP6762024B2 (ja) | 2016-07-28 | 2016-07-28 | レーザ加工装置及びレーザ加工方法 |
KR1020170032075A KR20180013675A (ko) | 2016-07-28 | 2017-03-14 | 레이저 가공 장치 및 레이저 가공 방법 |
TW106111313A TWI722162B (zh) | 2016-07-28 | 2017-04-05 | 雷射加工裝置以及雷射加工方法 |
CN201710498822.0A CN107662050B (zh) | 2016-07-28 | 2017-06-27 | 激光加工装置以及激光加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016148327A JP6762024B2 (ja) | 2016-07-28 | 2016-07-28 | レーザ加工装置及びレーザ加工方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018034119A Division JP6744634B2 (ja) | 2018-02-28 | 2018-02-28 | レーザ加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018015783A JP2018015783A (ja) | 2018-02-01 |
JP6762024B2 true JP6762024B2 (ja) | 2020-09-30 |
Family
ID=61078974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016148327A Active JP6762024B2 (ja) | 2016-07-28 | 2016-07-28 | レーザ加工装置及びレーザ加工方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6762024B2 (zh) |
KR (1) | KR20180013675A (zh) |
CN (1) | CN107662050B (zh) |
TW (1) | TWI722162B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200127078A (ko) * | 2019-04-30 | 2020-11-10 | 세메스 주식회사 | 기판 처리 방법, 기판 처리 장치 및 기판 처리 설비 |
WO2020245957A1 (ja) * | 2019-06-05 | 2020-12-10 | 三菱重工業株式会社 | レーザ加工方法及びレーザ加工装置 |
JP7324499B2 (ja) * | 2019-08-29 | 2023-08-10 | 三星ダイヤモンド工業株式会社 | 溝形成方法及び溝形成装置 |
CN114126229A (zh) * | 2021-11-19 | 2022-03-01 | 深圳市大族数控科技股份有限公司 | 激光钻孔方法及加工设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5536579A (en) * | 1994-06-02 | 1996-07-16 | International Business Machines Corporation | Design of high density structures with laser etch stop |
JP4589760B2 (ja) * | 2005-03-08 | 2010-12-01 | 住友重機械工業株式会社 | レーザ加工方法 |
JP5454080B2 (ja) * | 2008-10-23 | 2014-03-26 | 住友電気工業株式会社 | レーザ加工方法およびレーザ加工装置 |
JP2013500869A (ja) * | 2009-07-28 | 2013-01-10 | スリーエム イノベイティブ プロパティズ カンパニー | 被覆研磨物品及び被覆研磨物品をアブレーションする方法 |
JP5525246B2 (ja) * | 2009-11-25 | 2014-06-18 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
KR101203106B1 (ko) * | 2010-04-05 | 2012-11-20 | 김원옥 | 씨오피층이 포함된 다층필름의 레이저 절단방법 |
JP2012045567A (ja) * | 2010-08-26 | 2012-03-08 | Sumitomo Electric Ind Ltd | レーザ加工方法および装置 |
JP2012061480A (ja) * | 2010-09-14 | 2012-03-29 | Sumitomo Electric Ind Ltd | 基板の製造方法 |
JP5773629B2 (ja) * | 2010-12-01 | 2015-09-02 | キヤノン株式会社 | シャッター装置 |
JP5340447B2 (ja) * | 2012-03-28 | 2013-11-13 | 日東電工株式会社 | レーザー加工方法及びレーザー加工品 |
JP7260993B2 (ja) * | 2017-12-07 | 2023-04-19 | 住友化学株式会社 | 積層フィルムの切断方法及び製造方法 |
-
2016
- 2016-07-28 JP JP2016148327A patent/JP6762024B2/ja active Active
-
2017
- 2017-03-14 KR KR1020170032075A patent/KR20180013675A/ko not_active Application Discontinuation
- 2017-04-05 TW TW106111313A patent/TWI722162B/zh active
- 2017-06-27 CN CN201710498822.0A patent/CN107662050B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN107662050B (zh) | 2022-02-25 |
KR20180013675A (ko) | 2018-02-07 |
JP2018015783A (ja) | 2018-02-01 |
TWI722162B (zh) | 2021-03-21 |
TW201811479A (zh) | 2018-04-01 |
CN107662050A (zh) | 2018-02-06 |
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