JP6748776B2 - 伸縮性配線体及び伸縮性基板 - Google Patents
伸縮性配線体及び伸縮性基板 Download PDFInfo
- Publication number
- JP6748776B2 JP6748776B2 JP2019504607A JP2019504607A JP6748776B2 JP 6748776 B2 JP6748776 B2 JP 6748776B2 JP 2019504607 A JP2019504607 A JP 2019504607A JP 2019504607 A JP2019504607 A JP 2019504607A JP 6748776 B2 JP6748776 B2 JP 6748776B2
- Authority
- JP
- Japan
- Prior art keywords
- stretchable
- soft resin
- conductor portion
- binder
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Insulated Conductors (AREA)
- Insulated Conductors (AREA)
Description
文献の参照による組み込みが認められる指定国については、2017年3月9日に日本国に出願された特願2017−044581に記載された内容を参照により本明細書に組み込み、本明細書の記載の一部とする。
D>L … (1)
但し、上記(1)式において、Dは前記導電性粒子の粒径であり、Lは前記軟質樹脂の長さである。
D>L … (2)
20…伸縮性基材
21…主面
30…伸縮性配線体
301…第1の領域
302…第2の領域
40…導体部
41…バインダ
42…導電性粒子
50…軟質樹脂
Claims (6)
- バインダ及び前記バインダ中に分散された導電性粒子を含む導体部と、
前記バインダに埋設され、前記バインダよりも相対的に軟らかい軟質樹脂と、を備え、
前記導電性粒子は、前記軟質樹脂によって覆われていない伸縮性配線体。 - 請求項1に記載の伸縮性配線体であって、
下記(1)式を満たす伸縮性配線体。
D>L … (1)
但し、上記(1)式において、Dは前記導電性粒子の粒径であり、Lは前記軟質樹脂の長さである。 - 請求項1又は2に記載の伸縮性配線体であって、
前記軟質樹脂の形状は、粒状である伸縮性配線体。 - 請求項3に記載の伸縮性配線体であって、
前記軟質樹脂は、前記バインダ中に分散されている伸縮性配線体。 - 請求項1〜4の何れか一項に記載の伸縮性配線体と、
前記導体部が設けられた伸縮性基材と、を備える伸縮性基板。 - 請求項5に記載の伸縮性基板であって、
前記軟質樹脂の少なくとも一部は、前記伸縮性基材の一部が突出した突起である伸縮性基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017044581 | 2017-03-09 | ||
JP2017044581 | 2017-03-09 | ||
PCT/JP2018/008586 WO2018164125A1 (ja) | 2017-03-09 | 2018-03-06 | 伸縮性配線体及び伸縮性基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018164125A1 JPWO2018164125A1 (ja) | 2019-11-07 |
JP6748776B2 true JP6748776B2 (ja) | 2020-09-02 |
Family
ID=63448859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019504607A Active JP6748776B2 (ja) | 2017-03-09 | 2018-03-06 | 伸縮性配線体及び伸縮性基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210136912A1 (ja) |
JP (1) | JP6748776B2 (ja) |
CN (1) | CN110268809A (ja) |
TW (1) | TWI668107B (ja) |
WO (1) | WO2018164125A1 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4098945A (en) * | 1973-07-30 | 1978-07-04 | Minnesota Mining And Manufacturing Company | Soft conductive materials |
JPH077607B2 (ja) * | 1990-12-27 | 1995-01-30 | イナバゴム株式会社 | 変形導電性エラストマー |
JP5486268B2 (ja) * | 2008-11-18 | 2014-05-07 | 東海ゴム工業株式会社 | 導電膜、およびそれを備えたトランスデューサ、フレキシブル配線板 |
JP2011228481A (ja) * | 2010-04-20 | 2011-11-10 | Sumitomo Electric Printed Circuit Inc | 導電性ペースト、フレキシブルプリント配線板、電子機器 |
CN102617955B (zh) * | 2011-01-26 | 2015-11-25 | 聚鼎科技股份有限公司 | 过电流保护装置及其制备方法 |
JP6023548B2 (ja) * | 2011-12-07 | 2016-11-09 | フタムラ化学株式会社 | 導電性連通多孔質フィルムの製造方法 |
WO2014007334A1 (ja) * | 2012-07-05 | 2014-01-09 | 積水化学工業株式会社 | 導電性粒子、樹脂粒子、導電材料及び接続構造体 |
WO2015053160A1 (ja) * | 2013-10-08 | 2015-04-16 | 東洋紡株式会社 | 導電性ペースト、導電性薄膜及び回路 |
JP2015210927A (ja) * | 2014-04-25 | 2015-11-24 | 住友理工株式会社 | 導電膜、それを用いた導電性テープ部材および電子部品 |
KR102192757B1 (ko) * | 2014-07-22 | 2020-12-18 | 알파 어셈블리 솔루션스 인크. | 가요성 전자 표면을 위한 연신성 상호접속재 |
-
2018
- 2018-03-06 US US16/492,322 patent/US20210136912A1/en not_active Abandoned
- 2018-03-06 CN CN201880008505.9A patent/CN110268809A/zh active Pending
- 2018-03-06 WO PCT/JP2018/008586 patent/WO2018164125A1/ja active Application Filing
- 2018-03-06 JP JP2019504607A patent/JP6748776B2/ja active Active
- 2018-03-07 TW TW107107669A patent/TWI668107B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2018164125A1 (ja) | 2018-09-13 |
US20210136912A1 (en) | 2021-05-06 |
TW201841756A (zh) | 2018-12-01 |
CN110268809A (zh) | 2019-09-20 |
TWI668107B (zh) | 2019-08-11 |
JPWO2018164125A1 (ja) | 2019-11-07 |
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