JP6732706B2 - プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板 - Google Patents

プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板 Download PDF

Info

Publication number
JP6732706B2
JP6732706B2 JP2017168562A JP2017168562A JP6732706B2 JP 6732706 B2 JP6732706 B2 JP 6732706B2 JP 2017168562 A JP2017168562 A JP 2017168562A JP 2017168562 A JP2017168562 A JP 2017168562A JP 6732706 B2 JP6732706 B2 JP 6732706B2
Authority
JP
Japan
Prior art keywords
resin
printed wiring
wiring board
polymerization initiator
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017168562A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019046968A5 (enExample
JP2019046968A (ja
Inventor
治之 芦ヶ原
治之 芦ヶ原
梅田　裕明
裕明 梅田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP2017168562A priority Critical patent/JP6732706B2/ja
Priority to PCT/JP2018/018706 priority patent/WO2019044051A1/ja
Priority to TW107116655A priority patent/TW201914387A/zh
Publication of JP2019046968A publication Critical patent/JP2019046968A/ja
Publication of JP2019046968A5 publication Critical patent/JP2019046968A5/ja
Application granted granted Critical
Publication of JP6732706B2 publication Critical patent/JP6732706B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
JP2017168562A 2017-09-01 2017-09-01 プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板 Active JP6732706B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017168562A JP6732706B2 (ja) 2017-09-01 2017-09-01 プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板
PCT/JP2018/018706 WO2019044051A1 (ja) 2017-09-01 2018-05-15 プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板
TW107116655A TW201914387A (zh) 2017-09-01 2018-05-16 印刷配線板之製造方法、印刷配線板、多層印刷配線板之製造方法、及多層印刷配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017168562A JP6732706B2 (ja) 2017-09-01 2017-09-01 プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板

Publications (3)

Publication Number Publication Date
JP2019046968A JP2019046968A (ja) 2019-03-22
JP2019046968A5 JP2019046968A5 (enExample) 2019-08-08
JP6732706B2 true JP6732706B2 (ja) 2020-07-29

Family

ID=65525448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017168562A Active JP6732706B2 (ja) 2017-09-01 2017-09-01 プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板

Country Status (3)

Country Link
JP (1) JP6732706B2 (enExample)
TW (1) TW201914387A (enExample)
WO (1) WO2019044051A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7223672B2 (ja) * 2019-11-08 2023-02-16 日本特殊陶業株式会社 多層配線基板
FR3111637B1 (fr) * 2020-06-18 2022-09-02 Arkema France Compositions et procédés de formation de matériaux imprimables 3d capables d’une faible perte diélectrique
WO2022163065A1 (ja) * 2021-01-26 2022-08-04 東洋紡株式会社 積層体の製造方法、積層体、及び、多層積層体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963795A (ja) * 1982-10-05 1984-04-11 住友ベークライト株式会社 アデイテイブめつき用積層板の製造方法
JPH0818241A (ja) * 1994-06-24 1996-01-19 Sony Corp 多層プリント配線板及びその製造方法
JPH08174755A (ja) * 1994-12-21 1996-07-09 Toagosei Co Ltd 銅張絶縁シートおよび多層プリント配線板の製造方法
JP2003078250A (ja) * 2001-09-04 2003-03-14 Matsushita Electric Ind Co Ltd 部品内蔵モジュールおよびその製造方法
JP2007088004A (ja) * 2005-09-20 2007-04-05 Seiko Epson Corp 多層回路基板の製造方法、多層回路基板、及び電気光学装置、並びに電子機器
JP5930704B2 (ja) * 2011-12-22 2016-06-08 太陽インキ製造株式会社 プリント配線板の製造方法、プリント配線板およびフリップチップ実装基板
JP2017076763A (ja) * 2015-10-16 2017-04-20 日本特殊陶業株式会社 配線基板及びその製造方法

Also Published As

Publication number Publication date
WO2019044051A1 (ja) 2019-03-07
TW201914387A (zh) 2019-04-01
JP2019046968A (ja) 2019-03-22

Similar Documents

Publication Publication Date Title
JP7323314B2 (ja) 樹脂材料、積層フィルム及び多層プリント配線板
JP4938910B1 (ja) 予備硬化物、粗化予備硬化物及び積層体
JP6732706B2 (ja) プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板
KR102340503B1 (ko) 수지 조성물 및 다층 기판
JP5464304B1 (ja) エポキシ樹脂、エポキシ樹脂の製造方法、エポキシ樹脂組成物、その硬化物、及び放熱樹脂材料
US20150014028A1 (en) Insulating film for printed circuit board and product manufactured by using the same
JP6579309B2 (ja) 硬化性組成物
WO2017057561A1 (ja) 樹脂組成物及び多層基板
KR20160016664A (ko) 수지 시트
KR20230132723A (ko) 수지 조성물
JP7593348B2 (ja) 樹脂組成物
KR20140109376A (ko) 수지 조성물, 프리프레그 및 적층판
JP5524525B2 (ja) 樹脂付銅箔、積層板およびプリント配線板
JP7707999B2 (ja) 樹脂組成物
JP2022077908A (ja) 樹脂組成物
KR20210014596A (ko) 에폭시 수지 조성물, 에폭시 수지 조성물의 경화물, 수지 시트, 프린트 배선판 및 반도체 장치
JP2020100728A (ja) フェノキシ樹脂、その樹脂組成物、その硬化物、およびその製造方法。
JP2021004297A (ja) 樹脂組成物
KR20230009838A (ko) 수지 조성물
JP2019006980A (ja) 絶縁フィルム用樹脂組成物、絶縁フィルム及び多層プリント配線板
TW202212417A (zh) 樹脂組成物
JP6356587B2 (ja) エポキシ樹脂組成物およびその利用
JP5508342B2 (ja) プリント配線板用ｂステージフィルム及び多層基板
JP5977969B2 (ja) 絶縁シート、絶縁シートの製造方法及び多層基板
JP2011084697A (ja) 重合性リン含有（ポリ）キシリレンアリールエーテル化合物、その製造方法、難燃性熱硬化性樹脂組成物、硬化物及び積層板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190626

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190626

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200630

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200708

R150 Certificate of patent or registration of utility model

Ref document number: 6732706

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250