WO2022163065A1 - 積層体の製造方法、積層体、及び、多層積層体 - Google Patents
積層体の製造方法、積層体、及び、多層積層体 Download PDFInfo
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- WO2022163065A1 WO2022163065A1 PCT/JP2021/041458 JP2021041458W WO2022163065A1 WO 2022163065 A1 WO2022163065 A1 WO 2022163065A1 JP 2021041458 W JP2021041458 W JP 2021041458W WO 2022163065 A1 WO2022163065 A1 WO 2022163065A1
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- Prior art keywords
- laminate
- resin film
- metal layer
- layer
- metal
- Prior art date
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- RMTGISUVUCWJIT-UHFFFAOYSA-N n-[3-[3-aminopropoxy(dimethoxy)silyl]propyl]-1-phenylprop-2-en-1-amine;hydrochloride Chemical compound Cl.NCCCO[Si](OC)(OC)CCCNC(C=C)C1=CC=CC=C1 RMTGISUVUCWJIT-UHFFFAOYSA-N 0.000 description 1
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- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
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- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
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- 229920001230 polyarylate Polymers 0.000 description 1
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- 229920000515 polycarbonate Polymers 0.000 description 1
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
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- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
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- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- 239000002243 precursor Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- 239000010935 stainless steel Substances 0.000 description 1
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- GEKDEMKPCKTKEC-UHFFFAOYSA-N tetradecane-1-thiol Chemical compound CCCCCCCCCCCCCCS GEKDEMKPCKTKEC-UHFFFAOYSA-N 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- SIPHWXREAZVVNS-UHFFFAOYSA-N trichloro(cyclohexyl)silane Chemical compound Cl[Si](Cl)(Cl)C1CCCCC1 SIPHWXREAZVVNS-UHFFFAOYSA-N 0.000 description 1
- HLWCOIUDOLYBGD-UHFFFAOYSA-N trichloro(decyl)silane Chemical compound CCCCCCCCCC[Si](Cl)(Cl)Cl HLWCOIUDOLYBGD-UHFFFAOYSA-N 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- LFXJGGDONSCPOF-UHFFFAOYSA-N trichloro(hexyl)silane Chemical compound CCCCCC[Si](Cl)(Cl)Cl LFXJGGDONSCPOF-UHFFFAOYSA-N 0.000 description 1
- PYJJCSYBSYXGQQ-UHFFFAOYSA-N trichloro(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](Cl)(Cl)Cl PYJJCSYBSYXGQQ-UHFFFAOYSA-N 0.000 description 1
- RCHUVCPBWWSUMC-UHFFFAOYSA-N trichloro(octyl)silane Chemical compound CCCCCCCC[Si](Cl)(Cl)Cl RCHUVCPBWWSUMC-UHFFFAOYSA-N 0.000 description 1
- KWDQAHIRKOXFAV-UHFFFAOYSA-N trichloro(pentyl)silane Chemical compound CCCCC[Si](Cl)(Cl)Cl KWDQAHIRKOXFAV-UHFFFAOYSA-N 0.000 description 1
- HKFSBKQQYCMCKO-UHFFFAOYSA-N trichloro(prop-2-enyl)silane Chemical compound Cl[Si](Cl)(Cl)CC=C HKFSBKQQYCMCKO-UHFFFAOYSA-N 0.000 description 1
- DOEHJNBEOVLHGL-UHFFFAOYSA-N trichloro(propyl)silane Chemical compound CCC[Si](Cl)(Cl)Cl DOEHJNBEOVLHGL-UHFFFAOYSA-N 0.000 description 1
- LPMVYGAHBSNGHP-UHFFFAOYSA-N trichloro(tetradecyl)silane Chemical compound CCCCCCCCCCCCCC[Si](Cl)(Cl)Cl LPMVYGAHBSNGHP-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- NKLYMYLJOXIVFB-UHFFFAOYSA-N triethoxymethylsilane Chemical compound CCOC([SiH3])(OCC)OCC NKLYMYLJOXIVFB-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- TUQLLQQWSNWKCF-UHFFFAOYSA-N trimethoxymethylsilane Chemical compound COC([SiH3])(OC)OC TUQLLQQWSNWKCF-UHFFFAOYSA-N 0.000 description 1
- CCIDWXHLGNEQSL-UHFFFAOYSA-N undecane-1-thiol Chemical compound CCCCCCCCCCCS CCIDWXHLGNEQSL-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
- B32B5/147—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces by treatment of the layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
Definitions
- the present invention relates to a method for manufacturing a laminate, a laminate, and a multilayer laminate.
- the method for producing the laminate includes (a) preparing a first laminate in which a patterned metal layer is laminated on a first resin film, and forming a second resin film on the metal layer of the first laminate; (b) preparing a first laminate in which a patterned metal layer is laminated on a first resin film; (c) placing a patterned metal layer in the center of a mold and filling the mold with resin powder; A method of compression molding powder, (d) preparing a first laminate in which a patterned metal layer is laminated on a first resin film, applying an adhesive on the metal layer of the first laminate, and drying (e) preparing a first laminate in which a patterned metal layer is laminated on the first resin film; A method is known in which an adhesive is applied to the metal layer of the laminate, dried, and then laminated with a second resin film thereon for adhesion.
- the present invention has been made in view of the problems described above, and an object thereof is to provide a method for manufacturing a laminate that can produce a laminate having excellent flatness in a short time. Another object of the present invention is to provide a laminate and a multilayer laminate that can be obtained by the production method.
- the inventor of the present invention has conducted intensive research on the manufacturing method of the laminate. As a result, the present inventors have found that it is possible to produce a laminate having excellent flatness in a short period of time by adopting the following configuration, and have completed the present invention.
- Step A of preparing a first laminate in which a first resin film and a patterned metal layer are laminated A step B of preparing a second resin film having recesses corresponding to the pattern of the metal layer;
- Manufacture of a laminate characterized by including a step C of bonding the first laminate and the second resin film while fitting the pattern of the metal layer and the recess of the second resin film.
- first resin film and the second resin film have a vertically symmetrical structure, it is possible to suppress warping when heat is applied. That is, if there is a difference in linear expansion between the resin film (first resin film, second resin film) and the metal layer, warping will occur when heat is applied. If the second resin film has a vertically symmetrical structure, the warping force generated between the first resin film and the metal layer and the warping force generated between the second resin film and the metal layer can be offset.
- a silane coupling agent layer is provided on the metal layer of the first laminate,
- the step C is preferably a step of bonding the first laminate and the second resin film together via the silane coupling agent layer.
- the first laminate and the second resin film are attached via the silane coupling agent layer, they can be strongly attached.
- silane coupling agents are less susceptible to deterioration in thermal environments. Therefore, it can withstand long-term use in a hot environment.
- a silane coupling agent layer is provided on the second resin film,
- the step C is preferably a step of bonding the first laminate and the second resin film together via the silane coupling agent layer.
- the first laminate and the second resin film are attached via the silane coupling agent layer, they can be strongly attached.
- silane coupling agents are less susceptible to deterioration in thermal environments. Therefore, it can withstand long-term use in a hot environment.
- the first resin film and the second resin film are polyimide films, a laminate having excellent heat resistance can be obtained.
- the present invention provides the following. (6) A first resin film, a patterned metal layer, a silane coupling agent layer, and a second resin film having recesses corresponding to the pattern of the metal layer are laminated in this order, A laminate, wherein a gap exists between a first side surface of the concave portion of the second resin film and a second side surface of the metal layer facing the first side surface.
- a multilayer laminate comprising two or more laminates according to (6) above.
- the laminate of (6) above has flat and parallel surfaces on both sides, so even if two or more of them are laminated (even if they are laminated in multiple layers), parallelism can be maintained. Moreover, since there are two or more metal layers, when used as a wiring layer, each metal layer can be assigned, for example, a ground layer and a power supply layer to separate functions. As a result, it is possible to form a wiring layer that is resistant to noise and does not generate noise easily.
- a multilayer laminate characterized in that the laminate according to (6) above, a patterned second metal layer, and a third resin film are laminated in this order.
- the laminate of the above (6) has flat and parallel surfaces on both sides, even if the second metal layer and the third resin film further patterned on the laminate of the above (6) are laminated, Parallelism can be maintained (even if multiple layers are laminated).
- the number of resin film layers can be reduced by one as compared with the multilayer laminate of (7) above.
- each metal layer when used as a wiring layer, each metal layer can be assigned, for example, a ground layer and a power supply layer to separate functions. As a result, it is possible to form a wiring layer that is resistant to noise and does not generate noise easily.
- the metal layer is used as a heat source and the multi-layer laminate is used as a planar heating element, it is possible to make the heat distribution uniform with two or more metal layers.
- each metal layer when used as a wiring layer, each metal layer can be assigned, for example, a ground layer and a power supply layer to separate functions. As a result, it is possible to form a wiring layer that is resistant to noise and does not generate noise easily. Also, since the two metal layers are electrically connected, a three-dimensional circuit can be formed.
- the present invention it is possible to provide a method for manufacturing a laminate that can produce a laminate having excellent flatness in a short time. Moreover, it is possible to provide a laminate and a multilayer laminate that can be obtained by the production method.
- FIG. 4 is a plan view for explaining how to determine the warpage of a laminate after heating at 300° C.
- FIG. 8 is a cross-sectional view taken along the line AA of FIG. 7; BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional schematic diagram which shows the multilayer laminated body which concerns on 1st Embodiment. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the multilayer laminated body which concerns on 2nd Embodiment. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the multilayer laminated body which concerns on 2nd Embodiment. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the multilayer laminated body which concerns on 2nd Embodiment.
- the method for manufacturing a laminate according to this embodiment includes: A step A of preparing a first laminate in which the first resin film and the patterned metal layer are laminated; A step B of preparing a second resin film having recesses corresponding to the pattern of the metal layer; A step C of bonding the first laminate and the second resin film while fitting the pattern of the metal layer and the recess of the second resin film.
- 1 to 6 are schematic cross-sectional views for explaining the method for manufacturing a laminate according to this embodiment.
- a first laminate 20 in which a first resin film 21 and a patterned metal layer 24 are laminated is prepared (step A).
- the method of preparing the first laminate 20 is not particularly limited, it can be prepared by the following procedure, for example.
- the two-layer laminate is obtained, for example, by bonding the metal layer 22 to the first resin film 21 .
- a metal foil is preferably used as the metal layer 22 .
- Examples of the bonding method include bonding using a silane coupling agent, which will be described later. When bonding is performed using a silane coupling agent, both can be strongly bonded together. In addition, it is preferable to use a silane coupling agent for lamination because thermal deterioration is less.
- the silane coupling agent may be applied to the first resin film 21, the metal layer 22, or both.
- Another bonding method includes crimping. When crimping, it is preferable to plasma-process the surface of the first resin film 21 in advance. If the surface of the first resin film 21 is plasma-treated and then press-bonded, the two can be strongly bonded together.
- the surface of the first resin film 21 is plasma-treated and then pressure-bonded, since thermal deterioration is less.
- the crimping is preferably heat crimping. From the viewpoint of preventing heat deterioration, it is preferable not to use a resin-based adhesive for bonding the first resin film 21 and the metal layer 22 together.
- the unpatterned metal layer 22 is etched by a conventionally known method to form a patterned metal layer 24 (see FIG. 2).
- the first laminate 20 is obtained.
- the pattern of the metal layer 24 is not particularly limited.
- the surface of the laminate may be patterned so as to generate heat as evenly as possible.
- the first resin film 21 is not particularly limited, but polyimide resins such as polyimide, polyamideimide, polyetherimide, and fluorinated polyimide (eg, aromatic polyimide resin, alicyclic polyimide resin); polyethylene, polypropylene, polyethylene terephthalate , polybutylene terephthalate, polyethylene-2,6-naphthalate (for example, wholly aromatic polyester, semi-aromatic polyester); copolymerized (meth)acrylate represented by polymethyl methacrylate; polycarbonate; polyamide; polysulfone cellulose acetate; cellulose nitrate; aromatic polyamide; polyvinyl chloride; polyphenol; polyarylate; Among others, the first resin film 21 is preferably a polyimide film.
- polyimide resins such as polyimide, polyamideimide, polyetherimide, and fluorinated polyimide (eg, aromatic polyimide resin, alicyclic polyimide resin); polyethylene, polypropylene, polyethylene
- the first resin film 21 is a polyimide film
- a laminate with excellent heat resistance can be obtained.
- imidization is preferably completed at the stage of process A (before performing process C). In other words, it is preferable that the first resin film 21 is not a film containing a precursor solution that has not been completely imidized.
- the thickness of the first resin film 21 is not particularly limited, it is preferably 100 ⁇ m or less, more preferably 40 ⁇ m or less, and even more preferably 30 ⁇ m or less, from the viewpoint of making the resulting laminate thin.
- the lower limit of the thickness is not particularly limited, it is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, and still more preferably 15 ⁇ m or more.
- the metal layer 24 is not particularly limited, but preferably one that is easy to pattern, for example, Cu, Ni, Al, Ti, Fe, Ag, Au, or alloys thereof.
- Stainless steel (SUS) is preferable for the metal layer 24 (metal layer 22).
- the thickness of the metal layer 24 is not particularly limited, but may be 3 ⁇ m or more, 10 ⁇ m or more, 20 ⁇ m or more, or the like.
- the first laminate and the second resin film are prepared separately and then laminated together, curing shrinkage of the resin films (the first resin film and the second resin film) does not occur during the production of the laminate. Therefore, even when the thickness of the metal layer 24 is as thick as 10 ⁇ m or more, it is possible to produce a laminate having flat and parallel surfaces on both sides.
- the upper limit of the thickness of the metal layer 24 (metal layer 22) is not particularly limited, it can be, for example, 100 ⁇ m or less.
- the thickness of the metal layer 24 (metal layer 22) may be less than 3 ⁇ m depending on the application of the laminate.
- a silane coupling agent layer 26 may be provided on the metal layer 24 of the first laminate 20, as shown in FIG.
- the silane coupling agent layer 26 is physically or chemically interposed between the metal layer 24 and the second resin film 32 when the first laminate 20 and the second resin film 32 are later bonded together, It has the effect of bringing the metal layer 24 and the second resin film 32 into close contact with each other.
- the silane coupling agent used in this embodiment is not particularly limited, it preferably contains a coupling agent having an amino group.
- Preferred specific examples of the silane coupling agent include N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-( aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, 2- (3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltri
- silane coupling agent in addition to the above, n-propyltrimethoxysilane, butyltrichlorosilane, 2-cyanoethyltriethoxysilane, cyclohexyltrichlorosilane, decyltrichlorosilane, diacetoxydimethylsilane, diethoxydimethylsilane, dimethoxy Dimethylsilane, dimethoxydiphenylsilane, dimethoxymethylphenylsilane, dodecyllichlorosilane, dodecyltrimethoxysilane, ethyltrichlorosilane, hexyltrimethoxysilane, octadecyltriethoxysilane, octadecyltrimethoxysilane, n-octyltrichlorosilane, n-octyltrisilane Ethoxysilane
- silane coupling agents having one silicon atom in one molecule are particularly preferred, for example, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N- 2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- Triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxy propylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, aminophenyltri
- a coupling layer other than the silane coupling agent layer 26 may be provided on the metal layer 24 of the first laminate 20 .
- Coupling agents for forming the coupling layer include, in addition to the above, 1-mercapto-2-propanol, methyl 3-mercaptopropionate, 3-mercapto-2-butanol, butyl 3-mercaptopropionate, 3-(dimethoxymethylsilyl)-1-propanethiol, 4-(6-mercaptohexaroyl)benzyl alcohol, 11-amino-1-undeceneol, 11-mercaptoundecylphosphonic acid, 11-mercaptoundecyltrifluoro Acetic acid, 2,2'-(ethylenedioxy)diethanethiol, 11-mercaptoundecitri(ethylene glycol), (1-mercaptoundic-11-yl)tetra(ethylene glycol), 1-(methylcarboxy)undec -11-yl)hexa(ethylene glycol), hydroxy
- the silane coupling agent layer 26 may be formed not only on the metal layer 24 but also on the first resin film 21 . That is, when the silane coupling agent solution is applied to the metal layer 24, it may also be applied on the first resin film 21, and when the silane coupling agent solution is vapor-deposited on the metal layer 24, the first resin film 21 may also be deposited. Also, the silane coupling agent layer may be formed on the side surface of the patterned metal layer 24 .
- the silane coupling agent layer formed on the side surface of the metal layer 24 is the first side surface of the concave portion 34 of the second resin film 32 .
- 36 (see FIG. 6) and preferably not glued.
- the silane coupling agent layer may be formed on the surface of the concave portion 34 of the second resin film 32 .
- the silane coupling agent layer may be formed both on the metal layer 24 and on the concave portions 34 of the second resin film 32 .
- the film thickness of the silane coupling agent layer 26 is not particularly limited, it is sufficient that the entire surface of the metal layer 24 can be covered.
- Step B Further, in the method for manufacturing the laminate according to the present embodiment, apart from the step A, as shown in FIG. A film 32 is prepared (step B).
- the method of preparing the second resin film 32 having the recesses 34 is not particularly limited, it can be prepared, for example, by the following procedure.
- a non-patterned second resin film 31 is prepared.
- the material of the second resin film 31 is not particularly limited, the same material as that of the first resin film 21 can be used.
- the second resin film 31 is preferably a polyimide film.
- the second resin film 31 is a polyimide film, a laminate having excellent heat resistance can be obtained.
- the material of the first resin film 21 and the material of the second resin film 31 may be the same or different.
- the thickness of the second resin film 31 is not particularly limited, it is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, and even more preferably 30 ⁇ m or less from the viewpoint of making the obtained laminate thin.
- the lower limit of the thickness is not particularly limited, it is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, and still more preferably 20 ⁇ m or more.
- the thickness of the second resin film 31 is the sum of the thickness of the first resin film 21 and the thickness of the metal layer 24. is preferred.
- the unpatterned second resin film 31 is etched by a conventionally known method to form recesses 34 corresponding to the pattern (protruding pattern) of the metal layer 24 .
- etching is performed by a conventionally known method using an alkaline chemical.
- the depth of the recess 34 is preferably about the same as the thickness of the metal layer 24 .
- the size (width) of the concave portion 34 is preferably set slightly larger than the width of the pattern (protruding pattern) of the metal layer 24 . This is to ensure that the pattern (projection pattern) of the metal layer 24 and the recess 34 of the second resin film 32 are fitted together later.
- the silane coupling agent layer 26 is provided on the metal layer 24 of the first laminate 20, in the step C, the first laminate 20 and the second resin film 32 are silane-coupled. They are bonded together with the agent layer 26 interposed therebetween. Since the first laminate 20 and the second resin film 32 are bonded together via the silane coupling agent layer 26, they can be bonded together firmly.
- silane coupling agents are less susceptible to deterioration in thermal environments. Therefore, it can withstand long-term use in a hot environment.
- the silane coupling agent layer 26 may not be provided.
- the first laminate 20 and the second resin film 32 can be bonded together by pressure bonding.
- crimping it is preferable to plasma-process the surface of the second resin film 32 in advance. If the surface of the second resin film 32 is plasma-treated and then press-bonded, the two can be strongly bonded together. Further, it is preferable that the surface of the second resin film 32 is subjected to plasma treatment and then pressure-bonded, since thermal deterioration is less.
- the crimping is preferably heat crimping. From the viewpoint of preventing heat deterioration, it is preferable not to use a resin-based adhesive for bonding the first laminate 20 and the second resin film 32 together.
- the laminate 10 is obtained through the above steps.
- the silane coupling agent layer is provided on the metal layer of the first laminate.
- the present invention is not limited to this example, and instead of providing the silane coupling agent layer on the metal layer of the first laminate, the silane coupling agent layer may be provided on the second resin film. Even with this configuration, in step C, the first laminate and the second resin film can be bonded together via the silane coupling agent layer.
- the laminate 10 obtained by the method for manufacturing the laminate described above has the following configuration. That is, the laminate 10 includes a first resin film 21, a patterned metal layer 24, a silane coupling agent layer 26, and a second resin film 32 having recesses 34 corresponding to the pattern of the metal layer 24. Laminated in this order, a gap 42 exists between the first side surface 36 of the concave portion 34 of the second resin film 32 and the second side surface 25 of the metal layer 24 facing the first side surface 36 . Since the laminate 10 is manufactured by the method for manufacturing the laminate, it can be manufactured in a short period of time. In addition, since the first laminate and the second resin film are prepared separately and then laminated together, the laminate 10 having both flat and parallel surfaces can be obtained.
- the laminate 10 preferably has a warp of 5% or less, more preferably 3% or less, and even more preferably 1% or less after being heated at 300°C, as measured by the following measuring method.
- FIG. 7 is a plan view for explaining how to determine the warp of the laminated body after heating at 300° C.
- FIG. 8 is a sectional view taken along the line AA.
- the test piece 100 is placed on the surface plate 110 in a concave shape, and the average value of the distances from the plane of the four corners (h1rt, h2rt, h3rt, h4rt: unit: mm) is taken as the "original warp amount (mm )”.
- the test piece is placed on a flat surface in a concave shape, and the average value of the distances from the four corners from the flat surface (h1, h2, h3, h4: unit mm) It is referred to as "amount of warp (mm)".
- the difference obtained by subtracting the "original amount of warp” from the “amount of warp” is defined as the "amount of warp before and after heat treatment at 300°C”.
- Warpage (%) of laminate after heating at 300° C.” is a value expressed as a percentage (%) of the amount of curl with respect to the distance (70.7 mm) from each vertex to the center of the test piece.
- the measured value be the average value of 10 points (10 test pieces). However, even if there are not enough laminates for sampling at 10 points, three or more are measured. Specifically, it is calculated by the following equation.
- FIG. 9 is a schematic cross-sectional view showing the multilayer laminate according to the first embodiment.
- a multilayer laminate 50 according to the first embodiment has a configuration in which two laminates 10 described above are laminated.
- the first resin film 21 of one laminate 10 upper laminate 10 in FIG. 9
- the second resin film 32 of the other laminate 10 lower laminate 10 in FIG. 9 are laminated so as to face each other.
- the multilayer laminate 50 is obtained by bonding two laminates 10 together.
- a method for bonding one layered body 10 and the other layered body 10 together there is a method of bonding them together via a silane coupling agent layer.
- a method of bonding the other laminate 10 A method of forming a silane coupling agent layer on the first layer and then bonding it to one of the laminates 10 may be mentioned.
- bonding is performed using a silane coupling agent, both can be strongly bonded together.
- a silane coupling agent for lamination because thermal deterioration is less.
- Another bonding method includes crimping.
- the resin film (the first resin film 21 and/or the second resin film 32) that serves as the bonding surface in advance. If pressure bonding is performed after plasma treatment, both can be strongly bonded together. Further, it is preferable to carry out the pressure bonding after the plasma treatment in terms of less heat deterioration.
- the crimping is preferably heat crimping. From the viewpoint of preventing heat deterioration, it is preferable not to use a resin-based adhesive for bonding the first resin film 21 and the metal layer 22 together.
- Such a multilayer laminate is not limited to this example, and may be laminated such that the first resin film of one laminate and the first resin film of the other laminate face each other, or the first resin film of one laminate may be The second resin film and the second resin film of the other laminate may be laminated so as to face each other.
- the multilayer laminate 50 described above a case in which two laminates 10 are laminated has been described, but the multilayer laminate according to the present invention is not limited to this example, and three or more laminates 10 are laminated. good too.
- the method for laminating the third layer may employ the same method as described above.
- both surfaces of the laminate 10 have flat and parallel surfaces, so even if two or more are laminated (even if they are laminated in multiple layers), parallelism can be maintained. Moreover, since there are two or more metal layers, when used as a wiring layer, each metal layer can be assigned, for example, a ground layer and a power supply layer to separate functions. As a result, it is possible to form a wiring layer that is resistant to noise and does not generate noise easily.
- [Second embodiment] 10 to 13 are schematic cross-sectional views for explaining the method for manufacturing a multilayer laminate according to the second embodiment.
- the multilayer laminate 70 according to the second embodiment has a configuration in which the laminate 10, the patterned second metal layer 64, and the third resin film 72 are laminated in this order. is.
- the multilayer laminate 70 can be manufactured by the following method.
- the laminate 10 is prepared.
- a non-patterned second metal layer 62 is attached to the first resin film 21 of the laminate 10 .
- the same material as the metal layer 22 can be used.
- bonding method of the second metal layer 62 bonding using a silane coupling agent or pressure bonding (more preferably pressure bonding after plasma treatment) can be used, as described above.
- the unpatterned second metal layer 62 is etched by a conventionally known method to form a patterned second metal layer 64 .
- a third resin film 72 is prepared.
- the third resin film 72 can be prepared by a method similar to that for the second resin film 32 .
- the patterns of the second metal layer 64 and the concave portions 74 of the third resin film 72 are fitted to each other, and the two are bonded together.
- Examples of the bonding method include bonding using a silane coupling agent and pressure bonding (more preferably pressure bonding after plasma treatment), as described above.
- a gap similar to the gap 42 exists between the side surface of the recess 74 of the third resin film 72 and the side surface of the second metal layer 64 facing the side surface.
- the material of the third resin film 72 is not particularly limited, the same material as that of the first resin film 21 can be used.
- the third resin film 72 is preferably a polyimide film. If the third resin film 72 is a polyimide film, a laminate with excellent heat resistance can be obtained.
- the material of the third resin film 72, the material of the first resin film 21, and the material of the second resin film 32 may be the same or different.
- the multilayer laminate 70 is obtained through the above steps.
- the multilayer laminate 70 described above the case where the second metal layer 64 patterned on the first resin film 21 of the laminate 10 and the third resin film 72 are laminated in this order has been described.
- the multilayer laminate according to the present invention is not limited to this example. good.
- the multilayer laminate 70 described above the case where there are two metal layers, the metal layer 24 and the second metal layer 64, has been described.
- the multilayer laminate according to the present invention is not limited to this example, and may have three or more metal layers.
- an additional metal layer patterned on either side of the multilayer laminate 70 using the method described with reference to FIGS. 10 to 12, and , an additional resin film may be laminated.
- the laminate 10 is further provided with the patterned second metal layer and the third resin film. Parallelism can be maintained even when stacked (multilayered).
- the number of resin film layers can be reduced by one as compared with the multilayer laminate according to the first embodiment.
- each metal layer when used as a wiring layer, each metal layer can be assigned, for example, a ground layer and a power supply layer to separate functions. As a result, it is possible to form a wiring layer that is resistant to noise and does not generate noise easily.
- the metal layer is used as a heat source and the multi-layer laminate is used as a planar heating element, it is possible to make the heat distribution uniform with two or more metal layers.
- FIG. 17 are schematic cross-sectional views for explaining the method for manufacturing a multilayer laminate according to the third embodiment.
- a multilayer laminate 80 according to the third embodiment includes two laminates 10 laminated, and a first resin film 21 is provided with a through hole 82, and the through hole 82 is a configuration in which a metal-filled layer 84 filled with metal is formed, and the metal-filled layer 84 of one laminate 10 and the metal-filled layer 84 of the other laminate 10 are electrically connected. .
- the multilayer laminate 80 can be manufactured by the following method.
- the laminate 10 is prepared.
- a through hole 82 is formed in the first resin film 21 of the laminate 10 until it reaches the metal layer 24 .
- the through hole 82 can be formed by a conventionally known method.
- the through-holes 82 can be formed by laser processing, for example.
- the laminates 10 having two metal filling layers 84 are pasted together.
- the metal-filled layer 84 of one laminate 10 and the metal-filled layer 84 of the other laminate 10 are aligned so as to be electrically connected, and then bonded together.
- a multilayer laminate 80 is obtained through the above steps.
- the multilayer laminate 80 described above the case where the metal filling layer 84 is formed in the first resin film 21 of the laminate 10 has been described.
- the multilayer laminate according to the invention is not limited to this example.
- a metal-filled layer may be formed in the second resin film 32 of the laminate 10, and two laminates 10 each having a metal-filled layer formed in the second resin film 32 may be bonded together.
- a metal-filled layer is formed in the first resin film 21 of one of the laminates 10, and a metal-filled layer is formed in the second resin film 32 of the other laminate 10. may be attached so that they are electrically connected.
- the multilayer laminates according to the first embodiment and the multilayer laminate according to the second embodiment are laminated together.
- the bonding method is not particularly limited, but as already explained, bonding with a silane coupling agent or pressure bonding is preferable.
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Abstract
Description
また、第1積層体の金属層上に第2樹脂フィルム形成用のワニスを塗布、乾燥させて積層体を形成する製造方法を採用する場合には、硬化時(乾燥時)に収縮が起こり、ワニスを塗布した側の層(第2樹脂フィルム)の表面に凹凸が生じていた。つまり、第2樹脂フィルムの下側に金属層が存在する部分と存在しない部分とが存在するため、均等に収縮が起こらず、第2樹脂フィルムの表面に凹凸が生じ、平面性に劣るといった問題がある。
(1)第1樹脂フィルムとパターン化された金属層とが積層された第1積層体を準備する工程Aと、
前記金属層のパターンに対応した凹部を有する第2樹脂フィルムを準備する工程Bと、
前記金属層のパターンと前記第2樹脂フィルムの前記凹部とを嵌合させつつ、前記第1積層体と前記第2樹脂フィルムとを貼り合わせる工程Cとを含むことを特徴とする積層体の製造方法。
また、従来、第1積層体上に第2樹脂フィルム層形成用のワニスを塗布、乾燥させて積層体を形成する場合には、硬化時に収縮が起こり、塗布した側の層(第2樹脂フィルム)の表面に凹凸が生じ、平面性に劣っていた。しかしながら、本発明では、第1積層体と、第2樹脂フィルムとを別々に準備した後、貼り合わせるため、このような収縮は起こらない。従って、両面とも平坦で平行な面を有する積層体を作製することが可能となる。
また、第1樹脂フィルムと第2樹脂フィルムとを上下対称構造とすれば、熱が加わった際の反りを抑制することができる。すなわち、樹脂フィルム(第1樹脂フィルム、第2樹脂フィルム)と金属層との間に線膨張差があると、熱が加わった際に反りが発生することとなるが、第1樹脂フィルムと第2樹脂フィルムとを上下対称構造とすれば、第1樹脂フィルムと金属層との間に生じる反り力と、第2樹脂フィルムと金属層との間に生じる反り力とを相殺させることができる。
前記第1積層体の前記金属層上には、シランカップリング剤層が設けられており、
前記工程Cは、前記第1積層体と前記第2樹脂フィルムとを前記シランカップリング剤層を介して貼り合わせる工程であることが好ましい。
前記第2樹脂フィルム上には、シランカップリング剤層が設けられており、
前記工程Cは、前記第1積層体と前記第2樹脂フィルムとを前記シランカップリング剤層を介して貼り合わせる工程であることが好ましい。
前記第1樹脂フィルム、及び、前記第2樹脂フィルムは、ポリイミドフィルムであることが好ましい。
前記金属層の厚さは、10μm以上100μm以下であることが好ましい。
しかしながら、前記構成によれば、第1積層体と第2樹脂フィルムとを別々に準備した後、貼り合わせるため、上記従来法のような収縮は起こらない。従って、金属層の厚さが10μm以上と厚い場合であっても、両面とも平坦で平行な面を有する積層体を作製することが可能となる。
(6)第1樹脂フィルムと、パターン化された金属層と、シランカップリング剤層と、前記金属層のパターンに対応した凹部を有する第2樹脂フィルムとがこの順で積層されており、
前記第2樹脂フィルムの前記凹部の第1側面と前記第1側面に対向する前記金属層の第2側面との間に、空隙が存在することを特徴とする積層体。
なお、従来の積層体の製造方法では、第1積層体の金属層上に第2樹脂フィルム形成用のワニスを塗布、乾燥しているため、本実施形態に係る積層体10のように、空隙42が形成されることはない。
上記(6)の積層体は、前記積層体の製造方法により製造されるため、短時間で作製することができる。また、両面とも平坦で平行な面を有する積層体とすることができる。
(7)前記(6)に記載の積層体が2つ以上積層されていることを特徴とする多層積層体。
前記第1樹脂フィルム、又は、前記第2樹脂フィルムには貫通孔が設けられており、
前記貫通孔には、金属が充填された金属充填層が形成されており、
一方の積層体の前記金属充填層と他方の積層体の前記金属充填剤層とが電気的に接続されていることを特徴とする多層積層体。
また、金属層が2層以上存在するため、配線層として使用する場合、各金属層を、例えば、アース層、電源層といったように割り当てて、機能を分離することができる。その結果、ノイズに強く、ノイズを出しにくい配線層とすることができる。また、2つの金属層が電気的に接続されているため、3次元の回路を形成することができる。
本実施形態に係る積層体の製造方法は、
第1樹脂フィルムとパターン化された金属層とが積層された第1積層体を準備する工程Aと、
前記金属層のパターンに対応した凹部を有する第2樹脂フィルムを準備する工程Bと、
前記金属層のパターンと前記第2樹脂フィルムの前記凹部とを嵌合させつつ、前記第1積層体と前記第2樹脂フィルムとを貼り合わせる工程Cとを含む。
本実施形態に係る積層体の製造方法においては、まず、図2に示すように、第1樹脂フィルム21とパターン化された金属層24とが積層された第1積層体20を準備する(工程A)。
前記カップリング層を形成するためのカップリング剤としては、前記のほかに、1-メルカプト-2-プロパノール、3-メルカプトプロピオン酸メチル、3-メルカプト-2-ブタノール、3-メルカプトプロピオン酸ブチル、3-(ジメトキシメチルシリル)-1-プロパンチオール、4-(6-メルカプトヘキサロイル)ベンジルアルコール、11-アミノ-1-ウンデセンチオール、11-メルカプトウンデシルホスホン酸、11-メルカプトウンデシルトリフルオロ酢酸、2,2’-(エチレンジオキシ)ジエタンチオール、11-メルカプトウンデシトリ(エチレングリコール)、(1-メルカプトウンデイック-11-イル)テトラ(エチレングリコール)、1-(メチルカルボキシ)ウンデック-11-イル)ヘキサ(エチレングリコール)、ヒドロキシウンデシルジスルフィド、カルボキシウンデシルジスルフィド、ヒドロキシヘキサドデシルジスルフィド、カルボキシヘキサデシルジスルフィド、テトラキス(2-エチルヘキシルオキシ)チタン、チタンジオクチロキシビス(オクチレングリコレート)、ジルコニウムトリブトキシモノアセチルアセトネート、ジルコニウムモノブトキシアセチルアセトネートビス(エチルアセトアセテート)、ジルコニウムトリブトキシモノステアレート、アセトアルコキシアルミニウムジイソプロピレート、3-グリシジルオキシプロピルトリメトキシシラン、2,3-ブタンジチオール、1-ブタンチオール、2-ブタンチオール、シクロヘキサンチオール、シクロペンタンチオール、1-デカンチオール、1-ドデカンチオール、3-メルカプトプロピオン酸-2-エチルヘキシル、3-メルカプトプロピオン酸エチル、1-ヘプタンチオール、1-ヘキサデカンチオール、ヘキシルメルカプタン、イソアミルメルカプタン、イソブチルメルカプタン、3-メルカプトプロピオン酸、3-メルカプトプロピオン酸-3-メトキシブチル、2-メチル-1-ブタンチオール、1-オクタデカンチオール、1-オクタンチオール、1-ペンタデカンチオール、1-ペンタンチオール、1-プロパンチオール、1-テトラデカンチオール、1-ウンデカンチオール、1-(12-メルカプトドデシル)イミダゾール、1-(11-メルカプトウンデシル)イミダゾール、1-(10-メルカプトデシル)イミダゾール、1-(16-メルカプトヘキサデシル)イミダゾール、1-(17-メルカプトヘプタデシル)イミダゾール、1-(15-メルカプト)ドデカン酸、1-(11-メルカプト)ウンデカン酸、1-(10-メルカプト)デカン酸などを使用することもできる。
なお、シランカップリング剤層の形成は、第2樹脂フィルム32の凹部34の表面に行ってもよい。シランカップリング剤層は、金属層24上、及び、第2樹脂フィルム32の凹部34上の両方に形成してもよい。
また、本実施形態に係る積層体の製造方法においては、前記工程Aとは別に、図5に示すように、金属層24のパターン(凸状のパターン)に対応した凹部34を有する第2樹脂フィルム32を準備する(工程B)。
得られる積層体10の上下の樹脂フィルムの厚さを同じとする場合、第2樹脂フィルム31の厚さは、第1樹脂フィルム21の厚さに金属層24の厚さを加えた厚さとすることが好ましい。
前記工程A及び前記工程Bの後、図6に示すように、金属層24のパターンと第2樹脂フィルム32の凹部34とを嵌合させつつ、第1積層体20と第2樹脂フィルム32とを貼り合わせる(工程C)。
積層体10は、前記積層体の製造方法により製造されるため、短時間で作製することができる。また、第1積層体と第2樹脂フィルムとを別々に準備した後、貼り合わせて製造されるため、両面とも平坦で平行な面を有する積層体10を得ることができる。
300℃で加熱した後の積層体の反り(%)とは、300℃で加熱する前後の積層体の面方向に対する厚さ方向への変形度合を意味する。具体的には、以下の手順により得られる値をいう。図7は、300℃で加熱した後の積層体の反りの求め方を説明するための平面図であり、図8は、そのA-A断面図である。まず、図7、図8に示すように、100mm×100mmの試験片100(積層体)を準備する。室温で、定盤110上に試験片100を凹状となるように静置し、四隅の平面からの距離(h1rt、h2rt、h3rt、h4rt:単位mm)の平均値を「元の反り量(mm)」とする。次に、300℃で1時間加熱処理した後に、平面上に試験片を凹状となるように静置し、四隅の平面からの距離(h1、h2、h3、h4:単位mm)の平均値を「反り量(mm)」とする。そして、「反り量」から「元の反り量」を引いた差を「300℃熱処理前後での反り量」とする。「300℃で加熱した後の積層体の反り(%)」は、試験片の各頂点から中心までの距離(70.7mm)に対するカール量の百分率(%)で表される値である。測定値は10点(10個の試験片)の平均値とする。
但し、10点のサンプリングをするに十分な積層体がない場合も、3枚以上で測定する。具体的には、次式によって算出される。
元の反り量(mm)=(h1rt+h2rt+h3rt+h4rt)/4
反り量(mm)=(h1+h2+h3+h4)/4
300℃熱処理前後での反り量(mm)=(反り量)-(元の反り量)
300℃で加熱した後の積層体の反り(%)=100×(300℃熱処理前後でのそり量)/70.7
図9は、第1実施形態に係る多層積層体を示す断面模式図である。図9に示すように、第1実施形態に係る多層積層体50は、上記にて説明した積層体10が2つ積層された構成である。多層積層体50では、一方の積層体10(図9では上側の積層体10)の第1樹脂フィルム21と他方の積層体10(図9では下側の積層体10)の第2樹脂フィルム32とが対向するように積層されている。
他の貼り合わせ方法としては、圧着が挙げられる。圧着する場合、事前に貼り合わせ面となる樹脂フィルム(第1樹脂フィルム21、及び/又は第2樹脂フィルム32)をプラズマ処理しておくことが好ましい。プラズマ処理してから圧着を行うと、両者を強固に貼り合わせることができる。また、プラズマ処理してから圧着を行うと、熱劣化が少ない点で好ましい。圧着は、加熱圧着が好ましい。なお、第1樹脂フィルム21と金属層22との貼り合わせには、熱劣化の防止の観点から、樹脂系接着剤は用いないことが好ましい。
図10~図13は、第2実施形態に係る多層積層体の製造方法を説明するための断面模式図である。図13に示すように、第2実施形態に係る多層積層体70は、積層体10と、パターン化された第2金属層64と、第3樹脂フィルム72とがこの順で積層されている構成である。
第3樹脂フィルム72の材質としては、特に限定されないが、第1樹脂フィルム21と同様のものを用いることができる。なかでも、第3樹脂フィルム72は、ポリイミドフィルムであることが好ましい。第3樹脂フィルム72がポリイミドフィルムであると、耐熱性に優れる積層体が得られる。第3樹脂フィルム72の材質、第1樹脂フィルム21の材質、第2樹脂フィルム32の材質とは、互いに同一であってもよく異なっていてもよい。
図14~図17は、第3実施形態に係る多層積層体の製造方法を説明するための断面模式図である。図17に示すように、第3実施形態に係る多層積層体80は、積層体10が2つ積層されており、第1樹脂フィルム21には貫通孔82が設けられており、貫通孔82には、金属が充填された金属充填層84が形成されており、一方の積層体10の金属充填層84と他方の積層体10の金属充填層84とが電気的に接続されている構成である。
20 第1積層体
21 第1樹脂フィルム
22 パターン化されていない金属層
24 パターン化された金属層
25 第2側面
26 シランカップリング剤層
31 パターン化されていない第2の樹脂フィルム
32 パターン化された第2の樹脂フィルム
34 凹部
36 第1側面
42 空隙
50、70、80 多層積層体
62 パターン化されていない第2金属層
64 パターン化された第2金属層
72 第3樹脂フィルム
74 凹部
82 貫通孔
84 金属充填層
Claims (9)
- 第1樹脂フィルムとパターン化された金属層とが積層された第1積層体を準備する工程Aと、
前記金属層のパターンに対応した凹部を有する第2樹脂フィルムを準備する工程Bと、
前記金属層のパターンと前記第2樹脂フィルムの前記凹部とを嵌合させつつ、前記第1積層体と前記第2樹脂フィルムとを貼り合わせる工程Cとを含むことを特徴とする積層体の製造方法。 - 前記第1積層体の前記金属層上には、シランカップリング剤層が設けられており、
前記工程Cは、前記第1積層体と前記第2樹脂フィルムとを前記シランカップリング剤層を介して貼り合わせる工程であることを特徴とする請求項1に記載の積層体の製造方法。 - 前記第2樹脂フィルム上には、シランカップリング剤層が設けられており、
前記工程Cは、前記第1積層体と前記第2樹脂フィルムとを前記シランカップリング剤層を介して貼り合わせる工程であることを特徴とする請求項1に記載の積層体の製造方法。 - 前記第1樹脂フィルム、及び、前記第2樹脂フィルムは、ポリイミドフィルムであることを特徴とする請求項1~3のいずれか1に記載の積層体の製造方法。
- 前記金属層の厚さは、10μm以上100μm以下であることを特徴とする請求項1~3のいずれか1に記載の積層体の製造方法。
- 第1樹脂フィルムと、パターン化された金属層と、シランカップリング剤層と、前記金属層のパターンに対応した凹部を有する第2樹脂フィルムとがこの順で積層されており、
前記第2樹脂フィルムの前記凹部の第1側面と前記第1側面に対向する前記金属層の第2側面との間に、空隙が存在することを特徴とする積層体。 - 請求項6に記載の積層体が2つ以上積層されていることを特徴とする多層積層体。
- 請求項6に記載の積層体と、パターン化された第2金属層と、第3樹脂フィルムとがこの順で積層されていることを特徴とする多層積層体。
- 請求項6に記載の積層体が2つ積層されており、
前記第1樹脂フィルム、又は、前記第2樹脂フィルムには貫通孔が設けられており、
前記貫通孔には、金属が充填された金属充填層が形成されており、
一方の積層体の前記金属充填層と他方の積層体の前記金属充填剤層とが電気的に接続されていることを特徴とする多層積層体。
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