TW201914387A - 印刷配線板之製造方法、印刷配線板、多層印刷配線板之製造方法、及多層印刷配線板 - Google Patents

印刷配線板之製造方法、印刷配線板、多層印刷配線板之製造方法、及多層印刷配線板 Download PDF

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Publication number
TW201914387A
TW201914387A TW107116655A TW107116655A TW201914387A TW 201914387 A TW201914387 A TW 201914387A TW 107116655 A TW107116655 A TW 107116655A TW 107116655 A TW107116655 A TW 107116655A TW 201914387 A TW201914387 A TW 201914387A
Authority
TW
Taiwan
Prior art keywords
resin
wiring board
printed wiring
polymerization initiator
manufacturing
Prior art date
Application number
TW107116655A
Other languages
English (en)
Chinese (zh)
Inventor
蘆原治之
梅田裕明
Original Assignee
日商拓自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW201914387A publication Critical patent/TW201914387A/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
TW107116655A 2017-09-01 2018-05-16 印刷配線板之製造方法、印刷配線板、多層印刷配線板之製造方法、及多層印刷配線板 TW201914387A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017168562A JP6732706B2 (ja) 2017-09-01 2017-09-01 プリント配線板の製造方法、プリント配線板、多層プリント配線板の製造方法、及び、多層プリント配線板
JP2017-168562 2017-09-01

Publications (1)

Publication Number Publication Date
TW201914387A true TW201914387A (zh) 2019-04-01

Family

ID=65525448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107116655A TW201914387A (zh) 2017-09-01 2018-05-16 印刷配線板之製造方法、印刷配線板、多層印刷配線板之製造方法、及多層印刷配線板

Country Status (3)

Country Link
JP (1) JP6732706B2 (enExample)
TW (1) TW201914387A (enExample)
WO (1) WO2019044051A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761839B (zh) * 2019-11-08 2022-04-21 日商日本特殊陶業股份有限公司 多層配線基板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3111637B1 (fr) * 2020-06-18 2022-09-02 Arkema France Compositions et procédés de formation de matériaux imprimables 3d capables d’une faible perte diélectrique
WO2022163065A1 (ja) * 2021-01-26 2022-08-04 東洋紡株式会社 積層体の製造方法、積層体、及び、多層積層体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963795A (ja) * 1982-10-05 1984-04-11 住友ベークライト株式会社 アデイテイブめつき用積層板の製造方法
JPH0818241A (ja) * 1994-06-24 1996-01-19 Sony Corp 多層プリント配線板及びその製造方法
JPH08174755A (ja) * 1994-12-21 1996-07-09 Toagosei Co Ltd 銅張絶縁シートおよび多層プリント配線板の製造方法
JP2003078250A (ja) * 2001-09-04 2003-03-14 Matsushita Electric Ind Co Ltd 部品内蔵モジュールおよびその製造方法
JP2007088004A (ja) * 2005-09-20 2007-04-05 Seiko Epson Corp 多層回路基板の製造方法、多層回路基板、及び電気光学装置、並びに電子機器
JP5930704B2 (ja) * 2011-12-22 2016-06-08 太陽インキ製造株式会社 プリント配線板の製造方法、プリント配線板およびフリップチップ実装基板
JP2017076763A (ja) * 2015-10-16 2017-04-20 日本特殊陶業株式会社 配線基板及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761839B (zh) * 2019-11-08 2022-04-21 日商日本特殊陶業股份有限公司 多層配線基板

Also Published As

Publication number Publication date
WO2019044051A1 (ja) 2019-03-07
JP6732706B2 (ja) 2020-07-29
JP2019046968A (ja) 2019-03-22

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