JP6725420B2 - 集積回路を形成する方法およびそれに関連する集積回路 - Google Patents
集積回路を形成する方法およびそれに関連する集積回路 Download PDFInfo
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- JP6725420B2 JP6725420B2 JP2016546457A JP2016546457A JP6725420B2 JP 6725420 B2 JP6725420 B2 JP 6725420B2 JP 2016546457 A JP2016546457 A JP 2016546457A JP 2016546457 A JP2016546457 A JP 2016546457A JP 6725420 B2 JP6725420 B2 JP 6725420B2
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Classifications
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Description
問題1
集中型プロセスプラットフォーム内において種々様々な光子素子(高速LEDおよび検知器を含む)ならびに可視光透過導波路を実現するのは困難なことである。シリコンは一般的に、Si−CMOSトランジスタおよび集積化されたフォトニクスに対応することができるため、オプトエレクトロニック素子を構築するための最適な将来のプラットフォームとして見なされている。しかしながら残念なことに、シリコンは移動可能な荷電粒子と光子との間に弱い相互作用を生じる間接的バンドギャップを有しているので、シリコンを用いて能動光子素子(たとえば、LED)を構築するには障害がある。
問題1の解決策(solution)
オプトエレクトロニック素子の製造にはIII〜V族の材料がとくに適しているので、図1に記載の提案方法は、電気トランジスタがCMOS処理により形成され、オプトエレクトロニック素子がIII〜V族の材料から形成されるようになっている図1に記載のステップ104に説明されているようなLEDベースのオンチップ光インターコネクトを可能とするように考案されている(すなわち、図1〜図5を参照)。
問題2
オンチップ光インターコネクトを可能にするための従来の解決策は、発光源としてオフチップレーザーを利用することに依存する傾向があるが、このようなアプローチには欠点がある。まず、レーザーはその高いしきい値電流のためにかなりの量の電力を消費してしまう。接続が散発的にしか用いられない場合でさえもレーザーによる電力消費量は一定のままである。というのは、レーザーの連続波長が外部から通信データにより変調されるようになっているため、光インターコネクトを通じた実際のデータの送信にかかわらずレーザーによる電力消費量が高くなってしまうからである。次に、外部の変調器が複数の増幅段階を備えたドライバを必要とし、駆動要件がとくに厳格な高速データ変調の場合にこのドライバが大量の駆動電力を消費してしまう。さらに、変調器の挿入損失(通常5dB超える)が光電力予算を悪化させるため、レーザーからのさらに大きな出力電力が必要となる。
問題2の解決策
提案されている方法の場合、オンチップ光インターコネクトのための他の発光源、たとえば直接変調LEDが考えられている。まず、LEDがしきい値電流なしでスイッチがオンとなる信頼可能な発光源として機能する。具体的にいえば、LEDの動作電圧がスイッチオン電圧(ToV)と名付けられる最小しきい値を超えると、電流の流れおよび光の出力が電圧の上昇とともに指数関数的に上昇する。ToV値未満の場合、LEDはスイッチがオフとなり、無視できる量の電流がLEDを流れるので、最小限の電力が消費され、浪費されることになる。次いで、外部の変調器がもはや必要なくなるため、オンチップ光インターコネクトにおいてLEDを用いることにより著しい電力消費量の節約を達成することが可能となる。
問題3
固体発光源としてInGaN/GaN・MQW・LED構造が一般的に用いられている。しかしながら、この構造を備えたLEDは室内照明に用いるように設計されているのが一般的である。オンチップ通信についていえば、通常、できるだけ広い変調帯域幅を有していることが望ましい。しかしながら、重要なことは、LEDが比較的狭い変調帯域幅を有するように構成されかつそれが1Gb/s未満であったとしても、依然としてオンチップ通信には非常に役立つという点にある。比較として、最近のテレコミュニケーション用のレーザーは40Gb/sを超える帯域幅を有している。
問題3の解決策
帯域幅の制限は、注入される電子またはホールの自然発生的な放射性再結合の存続期間により基本的には決まり、この存続期間はおそらくナノ秒の範囲内である。しかしながら、活性層の電子およびホールの濃度を増大させることによってまたは2分子再結合を改善することよって、LEDを高周波側にシフトさせることに最近成功した(文献に記載)。したがって、図1に記載の提案されている方法に基づいて、集積化されたオンチップ通信のためのミクロサイズのInGaN・MQWLEDが実現可能でありかつ実用性が高い。たとえば、シミュレーションによる評価により、10μmLEDによる10μmの周波数応答が5GHz超えを達成することが見出されている。また、サイズが縮小されたLEDの場合の3dBの帯域幅の増大は、LEDが小さいと放射性再結合速度が上昇することにより説明可能であり、このことは、直径が5μmのマイクロディスク青色LEDに対して行われた実験の測定結果と十分一致している(文献ベース)。
問題4
どのようにして(シリコンベースの)トランジスタおよびオプトエレクトロニック素子を既存の既知の解決策を用いて容易にかつ安価に集積化させるかという問題がある。
問題4の解決策
LEDベースの光インターコネクトの光検出および光放射を可能とするために、図1に記載の提案されている方法を用いて、InGaN/GaN光検出器およびInGaN/GaN・LEDを単一エピタキシャル成長プロセスにより製造することが可能である。光放射層と光吸収層との間の光結合を効率的なものとすることにより(たとえば、図11aに記載のInGaN層1104bおよびInGaN・MQW層1104f参照)、下層の光放射層(たとえば、図11aに記載のInGaN・MQW層1104f)において損失が低くかつ効率が高い検出が担保される。光吸収層は光検出器の層を言い換えたものである。性能シミュレーションによって、導波路(たとえば、SiNxからなる)と集積化されるInGaN/GaN光検出器が直角入射検知器(normal−incident detector)と比較してより高い応答度を有していることが見出されている。というのは、吸収層(たとえば、図11aに記載のInGaN層104b)内の光伝搬距離がはるかに長いからである。この高い応答度は、信号の受信に必要となる光の電力が減るためにシステムの電力予算の削減が可能となることを示す。能動素子と受動素子との間の低損失導波路(すなわち、400nm〜500nmの光波長の下で動作して損失が1dB/cm未満)および低結合損失(すなわち、1dB未満)が光インターコネクトの低電力動作(本発明者らにより提案されている方法を用いて可能となる)を担保するのに重要である。
問題5
電気インターコネクトにより消費される電力が電気インターコネクトの容量、供給電圧およびクロック周波数に関係があることが分かっている。この容量がインターコネクトの長さおよび設定されたクロック周波数(インタコネクトの帯域幅に影響を与える)の増大とともに上昇するので、光インターコネクトの電力消費量は距離および帯域幅の増大とともに上昇する。もっといえば、インターコネクト遅延時間を改善するために、長いワイヤーが通常短いワイヤーに分割され、リピータがその間に設けられ、それにより、総ワイヤー結合容量、ひいてはインターコネクトの電力消費量が増大させられる。電気インターコネクトは、設計が極めて挑戦的なものであったとしても、依然として約28〜32fJ/bit/mmを消費し、最悪の場合、20mm×20mmという典型的な寸法を有するチップ上で一方のチップ端から他方のチップ端まで1データビットの送信に送信エネルギが600fJになってしまう。
問題5の解決策
図1に記載の提案されている方法を用いて、オンチップ通信の電力効率を改善するためにLEDイネイブルド光インターコネクト(LED−enabled optical interconnects)が(電気ベースの)CMOSトランジスタと集積化される。詳細にいえば、提案されている方法により、LEDイネイブルド光インターコネクトをCMOSトランジスタと密に集積化させることが可能となる。図2および図3に記載のように、CMOSトランジスタがSi−CMOS基板202上に形成され、オプトエレクトロニクス素子および導波路がIII〜V族の基板302上に形成されている。また上述のように、図12bには、(提案されている方法により可能となる)LEDベースの光インターコネクトを利用するように構成された変形SMARTマイクロアーキテクチャ1250が示されている。詳細にいえば、光子データ通信(photonics data communication)により実現される距離非依存性低電力送信特性(distance−independent low−power transmission characteristics)を有利に利用するために、バイパスリンクが、LED、導波路およびカプラー(coupler)を有する光インターコネクトで置換される。
Claims (24)
- 集積回路を形成する方法であって、
半導体基板上に配置される少なくとも第一のウエハー材料から少なくとも第一及び第二のオプトエレクトロニック素子を形成する工程(i)と、
誘電材料である第二のウエハー材料で充填されるべき第一の凹部を形成するように前記第一のウエハー材料をエッチングする工程(ii)と、
前記第一及び第二のオプトエレクトロニック素子を結合する導波路を形成して光インターコネクトを画定することによって、光子ウエハーを形成するよう前記第二のウエハー材料を処理する工程(iii)と、
少なくとも1つのトランジスタを有する少なくとも1つの部分的に処理されたCMOS素子層を前記光子ウエハー上に接合させる工程であって、前記光子ウエハーの前記光インターコネクトが前記部分的に処理されたCMOS素子層の下方に配置される工程(iv)と、を含み、
前記第一のウエハー材料がシリコンとは異なるものである、方法。 - シリコンとは異なる前記第一のウエハー材料がIII〜V族の半導体材料または有機材料を含む、請求項1に記載の方法。
- 前記III〜V族の半導体材料がGaN、InGaP、GaAs、AlGaAsまたはInGaAsを含む、請求項2に記載の方法。
- 前記第二のウエハー材料が窒化ケイ素を含む、請求項1乃至3のうちのいずれか一項に記載の方法。
- (v)前記集積回路を形成するために、前記少なくとも1つのトランジスタと前記第一又は第二のオプトエレクトロニック素子との間に電気的接続を形成することをさらに含む、請求項1乃至4のうちのいずれか一項に記載の方法。
- 前記電気的接続を形成することが、前記光インターコネクトへのアクセスを可能とする第二の凹部を形成するように前記部分的に処理されたCMOS素子層を処理し、その後、前記第二の凹部を第一の電気絶縁材料で充填することと、前記少なくとも1つのトランジスタを前記第一又は第二のオプトエレクトロニック素子に電気的に接続するように前記第一の電気絶縁材料を処理することとをさらに含む、請求項5に記載の方法。
- 前記第一の電気絶縁材料が二酸化ケイ素を含む、請求項6に記載の方法。
- 前記第一及び第二のオプトエレクトロニック素子が光検出器および発光素子からなる群から選択される、請求項1乃至7のうちのいずれか一項に記載の方法。
- 前記発光素子が発光ダイオード(LED)または有機LEDを含む、請求項8に記載の方法。
- 少なくとも前記少なくとも1つのトランジスタを有する前記部分的に処理されたCMOS素子層を取得するようにさらなる半導体基板にCMOS処理を実行することと、前記さらなる半導体基板から前記部分的に処理されたCMOS素子層を取り除くこととをさらに含む、請求項1乃至9のうちのいずれか一項に記載の方法。
- 前記さらなる半導体基板がシリコン・オン・インシュレータ基板を含む、請求項10に記載の方法。
- 前記工程(ii)の後に且つ前記第二のウエハー材料で前記第一の凹部を埋める前に、前記第一のウエハー材料を覆うように第二の電気絶縁材料を堆積させることと、化学機械研磨を用いて、堆積された前記第二の電気絶縁材料を平坦化することとをさらに含む、請求項1乃至11のうちのいずれか一項に記載の方法。
- 前記工程(ii)と前記工程(iii)との間において、前記第一の凹部が前記第二のウエハー材料で充填された後、前記第二のウエハー材料を化学機械研磨を用いて平坦化することを含む、請求項1乃至12のうちのいずれか一項に記載の方法。
- 前記工程(iii)において、前記導波路を形成するように前記第二のウエハー材料を処理することがリソグラフィおよび/またはエッチングを用いることを含む、請求項1乃至13のうちのいずれか一項に記載の方法。
- 前記工程(iii)と前記工程(iv)との間において、前記第一のウエハー材料および前記第二のウエハー材料を覆うように第三の電気絶縁材料を堆積させることと、堆積された前記第三の電気絶縁材料を化学機械研磨を用いて平坦化させることとをさらに含む、請求項1乃至14のうちのいずれか一項に記載の方法。
- 前記第二の凹部を形成するように前記部分的に処理されたCMOS素子層を処理することがエッチングおよび/または機械的研削を用いることを含む、請求項6に記載の方法。
- 前記第一の電気絶縁材料で前記第二の凹部を埋めることが、前記第一の電気絶縁材料を化学機械研磨を用いて平坦化させることをさらに含む、請求項6に記載の方法。
- 前記少なくとも1つのトランジスタを前記第一又は第二のオプトエレクトロニック素子に電気的に接続させるように前記第一の電気絶縁材料を処理することが、前記第一の電気絶縁材料内に複数のビアホールを形成することと、該複数のビアホールを導電性材料で充填することとを含む、請求項6に記載の方法。
- 前記第一のウエハー材料が、各層が異なる材料から形成される複数の層のウエハー材料を含む、請求項1乃至18のうちのいずれか一項に記載の方法。
- 集積回路であって、
CMOS素子層内に配置される少なくとも1つのトランジスタと、
導波路により結合されて光インターコネクトを半導体基板上に画定するように構成された少なくとも第一及び第二のオプトエレクトロニック素子を備えるとともに前記CMOS素子層に接合された光子ウエハーと、を備えており、
前記光インターコネクトが、前記CMOS素子層の下方に配置されており、
前記第一又は第二の第オプトエレクトロニック素子が前記少なくとも1つのトランジスタに電気的に接続されるように構成されており、
前記第一及び第二のオプトエレクトロニック素子がシリコンとは異なる少なくとも第一のウエハー材料から形成されており、
前記導波路が、前記第一のウエハー材料内に形成される第一の凹部内に堆積される第二のウエハー材料から形成されるように構成されており、
前記第二のウエハー材料が誘電材料である、集積回路。 - 前記シリコンとは異なる第一のウエハー材料がIII〜V族の半導体材料または有機材料を含む、請求項20に記載の集積回路。
- 前記III〜V族の半導体材料がGaN、InGaP、GaAs、AlGaAsまたはInGaAsを含む、請求項21に記載の集積回路。
- 前記集積回路が単一のプロセッサとしてまたはプロセッサの一部として形成されてなる、請求項20乃至22のうちのいずれかの一項に記載の集積回路。
- 前記第二のウエハー材料が窒化ケイ素を含む、請求項20乃至23のうちのいずれかの一項に記載の集積回路。
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CN108231803B (zh) * | 2017-12-26 | 2020-08-11 | 中国电子科技集团公司第五十五研究所 | 氮化硅光波导器件和石墨烯探测器集成芯片及其制作方法 |
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SG11201605734TA (en) | 2016-08-30 |
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EP3095133A1 (en) | 2016-11-23 |
US20180172903A1 (en) | 2018-06-21 |
TWI635330B (zh) | 2018-09-11 |
US20160327737A1 (en) | 2016-11-10 |
KR20160108459A (ko) | 2016-09-19 |
CN106463522B (zh) | 2019-12-03 |
TW201539072A (zh) | 2015-10-16 |
US9874689B2 (en) | 2018-01-23 |
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WO2015108488A1 (en) | 2015-07-23 |
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