JP6710248B2 - 量子ドット発光ダイオードおよびこれを含む量子ドット発光装置 - Google Patents
量子ドット発光ダイオードおよびこれを含む量子ドット発光装置 Download PDFInfo
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- JP6710248B2 JP6710248B2 JP2018170180A JP2018170180A JP6710248B2 JP 6710248 B2 JP6710248 B2 JP 6710248B2 JP 2018170180 A JP2018170180 A JP 2018170180A JP 2018170180 A JP2018170180 A JP 2018170180A JP 6710248 B2 JP6710248 B2 JP 6710248B2
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- light emitting
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- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
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- 238000007254 oxidation reaction Methods 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
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- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
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- 150000003852 triazoles Chemical class 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- OUMZKMRZMVDEOF-UHFFFAOYSA-N tris(trimethylsilyl)phosphane Chemical compound C[Si](C)(C)P([Si](C)(C)C)[Si](C)(C)C OUMZKMRZMVDEOF-UHFFFAOYSA-N 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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- 239000004246 zinc acetate Substances 0.000 description 1
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- LPEBYPDZMWMCLZ-CVBJKYQLSA-L zinc;(z)-octadec-9-enoate Chemical compound [Zn+2].CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O LPEBYPDZMWMCLZ-CVBJKYQLSA-L 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
- C09K11/883—Chalcogenides with zinc or cadmium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/115—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
- G01N33/58—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing involving labelled substances
- G01N33/588—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing involving labelled substances with semiconductor nanocrystal label, e.g. quantum dots
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/0229—Optical fibres with cladding with or without a coating characterised by nanostructures, i.e. structures of size less than 100 nm, e.g. quantum dots
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02601—Nanoparticles
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Description
ここで、nは6以上16以下の整数であり、
mは4以上9以下の整数であり、
pは4以上9以下の整数であり、
Xはカルボキシレート基、ホスフェート基またはチオレート基である。
nは6〜16の範囲の整数であり、nは4〜9の範囲の整数であり、pは4〜9の範囲の整数であり、Xはカルボキシレート基、リン酸基またはチオレート基である。
1)ZnSe/ZnSのコア・シェル量子ドットの合成
三つ口フラスコに、0.073gの酢酸亜鉛、0.237gのオレイン酸、0.032gのSe、溶媒であるオクタデセン(ODE)を26ml入れた。120℃の真空状態で2時間加熱し、水分や酸素、および不純物を除去した。N2の雰囲気に切り替えた後、300℃で1時間加熱し、コアであるZnSeを形成した。常温に冷却し、Xタイプのリガンドであるオレアートが表面に結合したZnSシェルを形成するため、0.4Mのオレイン酸亜鉛を7ml、1Mのトリブチルホスフィンスルフィド(TBPS)を1ml、コアが形成されたフラスコに添加した。それを280℃で1時間加熱し、ZnSシェルを形成した。過量のアセトンを添加して反応をワークアップした後、遠心分離機で沈殿過程を数回繰り返し、最終的に、Xタイプのリガンドであるオレアートが表面に結合したZnSe/ZnSの量子ドットを合成した。
上記で沈殿された量子ドット(ZnSe/ZnS)をヘキサン、またはトルエンに分散させた。分散された量子ドットを10mg/mlの濃度で、基板上にスピンコーティング(rpm2000、60秒)し、70℃で30分間乾燥させた。量子ドットがコーティングされた面に向かってTAEAを1〜2ml滴下した後、スピンコーティング(rpm500、30秒)した。60〜80℃で2時間乾燥させ、リガンドの濃度差による拡散、およびZn−amine基の相互作用によって量子ドットの一部表面(基板と接していない領域)へリガンド交換が起こるよう、誘導した。その後、ヘキサン、またはトルエンのような有機溶媒に再分散させ、反応のワークアップ過程を1回行った。
基板上に量子ドットが二層に配列・積層できるよう、ZnSe/ZnSのコア・シェル量子ドットのコーティング濃度を約2倍にし、TAEAの含量を約2倍にしたことを除き、合成例1の手順を繰り返した。
合成例1に比較して、TAEA処理過程を省略し、Xタイプのリガンドであるオレアートのみが表面に結合した量子ドットを合成した。
合成例1で合成した量子ドットの物性を測定した。量子ドットの粒子サイズを測るため、合成例1によってヘキサンに分散された量子ドットをTEMグリッドに1〜2滴滴下した後、乾燥させ、TEM(Helios Nanolab 600i、FEI社)で分析した。図6は、合成例1で合成された量子ドットを撮影したTEM写真である。量子ドットの平均粒子サイズは、7.5nmであった。また、合成例1によってヘキサンに分散された量子ドットを硫酸、または塩酸に溶かした後、誘導結合プラズマ質量分析(Inductively coupled plasma−mass spectroscopy;ICP−MS)を行った(ELAN DRCII、Perkin−Elmer)。その結果、合成された量子ドットにおけるZn含量は52.8重量%、Se含量は21.2重量%、S含量は26.0%であって、意図したコア・シェル構造を有する量子ドットが合成されたことを確認した。さらに、合成例1で合成されたヘキサンに分散された量子ドットをKBrにコーティングしたり、または粉末状の量子ドットを用いてFT−IR(FTS7000e、VARIAN)を行った。FT−IRの分析結果、比較例で合成された量子ドットに存在しなかったTAEAリガンドが結合したことを確認した(図7を参照)。
合成例1によって単層で形成された量子ドットが適用された発光ダイオードを作製した。ITO(陽極、50nm)を1時間UV−ozone処理した後、次のような順番で発光層および陰極を積層した。正孔注入層(HIL、PEDOT:PSS、スピンコート(2000rpm)の後、120℃で30分乾燥;25nm)、正孔輸送層(HTL、TFB、スピンコート(2000rpm)の後、120℃で30分乾燥;24nm)、発光物質層(EML、合成例1の量子ドット、スピンコート(2000rpm)の後、70℃で60分乾燥;18nm)、電子輸送層(ETL、TPBi、蒸着(3×10−6Torr、0.1Å/s);52nm)、陰極(Al、3×10−6Torr、4〜5Å/s);80nm)。
合成例2によって二層で積層された量子ドットを発光物質層に用いたことを除き、実施例2の手順を繰り返して、量子ドット発光ダイオードを作製した。
比較合成例1によってXタイプのリガンドのみが表面に結合した量子ドットを、発光物質層に用いたことを除き、実施例2の手順を繰り返して、量子ドット発光ダイオードを作製した。
1)発光特性の評価
実施例1および比較例でそれぞれ作製された発光ダイオードの駆動電圧、駆動電流、電流密度、電流効率、電力効率、外部量子効率(external quantum efficiency;EQE)および輝度を測定した。その結果を表1に示す。
実施例2および実施例3と、比較例でそれぞれ作製された発光ダイオードを構成する層の形状をTEMで評価した。図10Aおよび図10Bは、それぞれ本発明の例示的な実施例によって合成された、相異する特性を有するリガンドが表面に結合した量子ドットを単層(図10A)、そして二層(図10B)でコーティングした発光物質層の断面構造を概略的に示す電子顕微鏡の写真である。電荷特性の相異する2つのリガンドが量子ドット表面のうち、特定領域に結合するとき、量子ドットを単層、または二層でコーティングして発光物質層の厚さを容易に調節・制御できることを確認した。
Claims (10)
- 第1電極および第2電極と、
発光物質層と、
電子移動層と、
正孔移動層と
を含む発光ダイオードであって、
前記発光物質層は、前記電子移動層と前記正孔移動層との間に配置され、前記発光物質層は複数の量子ドットを備え、
前記複数の量子ドットの各々は、
半導体ナノ結晶または金属酸化物のコアと、
前記コアを完全に覆うシェルであって、第1の表面領域及び第2の表面領域を含む外面を有するシェルと、
前記外面に結合し、カルボキシレート基から選択される作用基を含むXタイプのリガンドと、
前記外面に結合し、アミノ基から選択される作用基を含むLタイプのリガンドと
を含み、
前記外面は球形であり、前記第1の表面領域は第1の半球であり、前記第2の表面領域は前記第1の半球と重畳しない第2の半球であり、
前記第1の表面領域は、前記正孔移動層に隣接して位置し、且つ前記電子移動層に対して反対側に位置し、
前記第2の表面領域は、前記電子移動層に隣接して位置し、且つ前記正孔移動層に対して反対側に位置し、
前記第1の表面領域は、前記LタイプのリガンドよりもXタイプのリガンドを多く含み、前記第2の表面領域は、前記XタイプのリガンドよりもLタイプのリガンドを多く含む、
発光ダイオード。 - 前記Xタイプのリガンドは、C5−C30飽和または不飽和炭化水素鎖をさらに含む、請求項1に記載の発光ダイオード。
- 前記Xタイプのリガンドは、
の構造のうちの1つを有し、
ここで、nは6以上16以下の整数であり、
mは4以上9以下の整数であり、
pは4以上9以下の整数であり、
Xはカルボキシレート基である、
請求項1に記載の発光ダイオード。 - 前記Xタイプのリガンドは、オクタン酸、デカン酸、ドデカン酸、ミリスチン酸、パルミチン酸、ヘキサデカン酸、ステアリン酸、オレイン酸、およびこれらの組み合わせからなる群から選択される、請求項3に記載の発光ダイオード。
- 前記Lタイプのリガンドは、C1〜C10の直鎖または分枝アルキルアミン、C4〜C8の脂環族アミン、C5〜C20の芳香族アミン、およびこれらの組み合わせからなる群から選択される、請求項1に記載の発光ダイオード。
- 前記Lタイプのリガンドは、トリス(2−アミノエチル)アミン、トリス(2−アミノメチル)アミン、N−ブチル−N−エチルエタン−1,2−ジアミン、エチレンジアミン、ペンタエチレンヘキサミン、シクロヘキサン−1,2−ジアミン、シクロヘキセン−1,2−ジアミンまたは2,3−ジアミノピリジンである、請求項1に記載の発光ダイオード。
- 前記Xタイプのリガンドは、負電荷を有する作用基を介し、前記外面の第1の領域に結合する、請求項1に記載の発光ダイオード。
- 前記Lタイプのリガンドは、非共有電子対を介し、前記外面の第2の領域に結合する、請求項1に記載の発光ダイオード。
- 請求項1に記載の発光ダイオードを含む発光装置。
- 基板と、
前記基板の上部に位置する請求項1に記載の発光ダイオードと、
前記基板と前記発光ダイオードとの間に位置し、前記発光ダイオードに接続される駆動素子と
を含む、請求項9に記載の発光装置。
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CN109468134B (zh) * | 2018-10-18 | 2020-12-01 | 浙江大学 | 量子点、制作方法、单光子源和qled |
US20220013744A1 (en) * | 2018-10-30 | 2022-01-13 | Sharp Kabushiki Kaisha | Light-emitting element, method for manufacturing light-emitting element |
KR102655061B1 (ko) * | 2019-03-25 | 2024-04-09 | 삼성디스플레이 주식회사 | 양자점층 제조 방법, 양자점층을 포함하는 발광 소자 제조 방법, 및 양자점층을 포함하는 표시 장치 |
CN112018270B (zh) * | 2019-05-31 | 2021-09-10 | Tcl科技集团股份有限公司 | 量子点薄膜的制备方法和量子点发光二极管的制备方法 |
WO2020257510A1 (en) | 2019-06-20 | 2020-12-24 | Nanosys, Inc. | Bright silver based quaternary nanostructures |
US11355713B2 (en) * | 2019-06-24 | 2022-06-07 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Hole transport material, manufacturing method thereof, and electroluminescent device thereof |
WO2020261446A1 (ja) * | 2019-06-26 | 2020-12-30 | シャープ株式会社 | 電界発光素子及び表示装置 |
KR20210016219A (ko) * | 2019-08-02 | 2021-02-15 | 삼성디스플레이 주식회사 | 발광 소자, 이를 포함하는 표시 장치 및 표시 장치 제조 방법 |
CN112397617B (zh) * | 2019-08-19 | 2022-02-18 | Tcl科技集团股份有限公司 | 掺杂氧化钨纳米材料及其制备方法和无机空穴传输材料 |
CN110492012B (zh) * | 2019-08-26 | 2022-04-12 | 京东方科技集团股份有限公司 | 一种量子点发光器件及其制备方法、显示面板、显示装置 |
KR102650052B1 (ko) * | 2019-08-29 | 2024-03-25 | 한국전자통신연구원 | 발광 소자 및 이의 제조방법 |
KR20210028411A (ko) * | 2019-09-04 | 2021-03-12 | 엘지디스플레이 주식회사 | 발광다이오드 및 발광장치 |
KR20210036435A (ko) | 2019-09-25 | 2021-04-05 | 삼성디스플레이 주식회사 | 양자점 조성물, 발광 소자 및 이를 포함하는 표시 장치 |
KR20210142791A (ko) | 2020-05-18 | 2021-11-26 | 삼성디스플레이 주식회사 | 표면 개질용 리간드, 이를 포함하는 발광 소자, 및 표시 장치의 제조 방법 |
US20230232646A1 (en) * | 2020-05-26 | 2023-07-20 | Sharp Kabushiki Kaisha | Light-emitting element and method of manufacturing light-emitting element |
KR20210149974A (ko) * | 2020-06-02 | 2021-12-10 | 삼성디스플레이 주식회사 | 양자점을 포함하는 발광 소자의 제조 방법 |
CN114058373A (zh) * | 2020-07-31 | 2022-02-18 | 京东方科技集团股份有限公司 | 量子点结构、量子点发光器件和制作方法 |
WO2022036652A1 (zh) * | 2020-08-20 | 2022-02-24 | 京东方科技集团股份有限公司 | 发光二极管器件、显示面板、显示装置和制作方法 |
KR20220043997A (ko) | 2020-09-28 | 2022-04-06 | 삼성디스플레이 주식회사 | 양자점 조성물 및 이를 이용한 발광 소자의 제조 방법 |
JP7474345B2 (ja) | 2020-09-28 | 2024-04-24 | シャープ株式会社 | 光電変換素子、表示装置、および光電変換素子の製造方法 |
CN112310330B (zh) * | 2020-10-30 | 2024-06-04 | 北京京东方技术开发有限公司 | 一种量子点材料、量子点发光器件、显示装置及制作方法 |
EP4006994A1 (en) * | 2020-11-26 | 2022-06-01 | Stmicroelectronics (Grenoble 2) Sas | Optoelectronic device |
US11407940B2 (en) * | 2020-12-22 | 2022-08-09 | Nanosys, Inc. | Films comprising bright silver based quaternary nanostructures |
US11926776B2 (en) * | 2020-12-22 | 2024-03-12 | Shoei Chemical Inc. | Films comprising bright silver based quaternary nanostructures |
KR20220096105A (ko) * | 2020-12-30 | 2022-07-07 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
US11360250B1 (en) | 2021-04-01 | 2022-06-14 | Nanosys, Inc. | Stable AIGS films |
WO2023112201A1 (ja) * | 2021-12-15 | 2023-06-22 | シャープディスプレイテクノロジー株式会社 | 表示装置の製造方法、発光素子および表示装置 |
WO2024079905A1 (ja) * | 2022-10-14 | 2024-04-18 | シャープディスプレイテクノロジー株式会社 | 量子ドット溶液、量子ドット層の形成方法、発光素子、表示装置、および量子ドット溶液の製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2152629A4 (en) * | 2007-04-30 | 2010-09-22 | Agency Science Tech & Res | FORMATION OF NETWORKED GLUTATHION ON A NANOSTRUCTURE |
KR101557498B1 (ko) * | 2008-11-05 | 2015-10-07 | 삼성전자주식회사 | 양자점 발광소자 및 그 제조방법 |
KR101652789B1 (ko) * | 2009-02-23 | 2016-09-01 | 삼성전자주식회사 | 다중 양자점층을 가지는 양자점 발광소자 |
US9011818B2 (en) * | 2009-11-30 | 2015-04-21 | Massachusetts Institute Of Technology | Materials and methods for biological imaging |
EP2672269A1 (en) * | 2012-06-07 | 2013-12-11 | Solarwell | Enhanced affinity ligands |
KR102228142B1 (ko) * | 2013-04-05 | 2021-03-22 | 삼성디스플레이 주식회사 | 양자점, 양자점의 제조 방법 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
KR101478448B1 (ko) | 2013-07-01 | 2015-01-02 | 서울대학교산학협력단 | 반도체 나노입자를 포함하는 광흡수층의 제작방법 및 이 광흡수층을 포함하는 반도체 소자의 제작방법 |
US9666766B2 (en) * | 2013-08-21 | 2017-05-30 | Pacific Light Technologies Corp. | Quantum dots having a nanocrystalline core, a nanocrystalline shell surrounding the core, and an insulator coating for the shell |
EP3140247A4 (en) * | 2014-05-09 | 2018-01-17 | Massachusetts Institute of Technology | Energy level modification of nanocrystals through ligand exchange |
US10106734B2 (en) * | 2014-07-30 | 2018-10-23 | Osram Opto Semiconductor Gmbh | Alloyed rod structure in a nanocrystalline quantum dot |
WO2016126928A1 (en) * | 2015-02-04 | 2016-08-11 | University Of North Carolina At Charlotte | Quantum dot light emitting devices |
US9732274B2 (en) * | 2015-07-02 | 2017-08-15 | Pacific Light Technologies Corp. | Nanocrystalline quantum dot heterostructure |
WO2017020046A1 (en) * | 2015-07-30 | 2017-02-02 | Pacific Light Technologies Corp. | Low cadmium nanocrystalline quantum dot heterostructure |
CN105185918A (zh) * | 2015-08-27 | 2015-12-23 | Tcl集团股份有限公司 | 量子点发光层、其制备方法及qled |
KR102519945B1 (ko) * | 2015-08-31 | 2023-04-10 | 엘지디스플레이 주식회사 | 양자점, 양자점 필름, 양자점을 포함하는 엘이디 패키지 및 표시장치 |
WO2017038487A1 (ja) * | 2015-08-31 | 2017-03-09 | 富士フイルム株式会社 | 半導体ナノ粒子、分散液、フィルムおよび半導体ナノ粒子の製造方法 |
KR101839486B1 (ko) | 2016-04-11 | 2018-03-16 | 현대오트론 주식회사 | 차량 제어기용 반도체, 차량 제어기 및 차량 제어기용 반도체 설계 방법 |
CN106083573B (zh) * | 2016-07-01 | 2021-03-23 | 京东方科技集团股份有限公司 | 有机配体及制备方法、量子点、量子点层及发光二级管 |
CN111373015B (zh) * | 2017-06-07 | 2024-06-04 | 昭荣化学工业株式会社 | 用于改进量子点在树脂膜中的可靠性的硫醇化亲水性配体 |
US11041071B2 (en) * | 2017-08-16 | 2021-06-22 | Nanosys, Inc. | Peg-based ligands with enhanced dispersibility and improved performance |
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