JP6707396B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP6707396B2 JP6707396B2 JP2016095253A JP2016095253A JP6707396B2 JP 6707396 B2 JP6707396 B2 JP 6707396B2 JP 2016095253 A JP2016095253 A JP 2016095253A JP 2016095253 A JP2016095253 A JP 2016095253A JP 6707396 B2 JP6707396 B2 JP 6707396B2
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- JP
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- Prior art keywords
- cutting
- unit
- blade
- light
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Description
3 加工室
6 制御装置(制御手段)
10 チャックテーブル
11 保持面
14 切り込み送り機構
30 切削ユニット
31 切削ブレード
38 切削水(切削液)
39 排気ユニット
60 ブレード検出手段(刃先位置検出手段)
62 検出機構
63 ブレード侵入部
64 発光部
65 受光部
80 閾値登録部
81 判断部
W ウエーハ(被加工物)
Claims (1)
- 被加工物を保持面で保持するチャックテーブルと、該チャックテーブルに保持された被加工物に切削液を供給しながら切削ブレードで切削する切削ユニットと、該保持面と直交する切り込み送り方向の該切削ブレードの先端位置を検出する刃先位置検出ユニットと、該チャックテーブルと該切削ユニットと該刃先位置検出ユニットとを囲繞する加工室と、該加工室内の雰囲気を排気する排気ユニットと、各構成要素を制御する制御手段と、を備える切削装置であって、
該刃先位置検出ユニットは、
該切削ブレードが侵入するブレード侵入部を挟んで対面する発光部と該発光部からの光を受光する受光部とを有し、
該制御手段は、
該切削ブレードが該ブレード侵入部から離れた退避状態で、該発光部からの光を受光した該受光部の受光量の適正範囲を規定する閾値を登録する閾値登録部と、
該退避状態での該受光量が該適正範囲内にある場合に、該切削ブレードを該ブレード侵入部に侵入させて該切削ブレードの先端位置を検出する検出動作を実施させ、該退避状態での該受光量が該適正範囲外の場合に、該切削液のミストを含む該雰囲気が排気され該受光量が該適正範囲内になるまで該検出動作の開始を待機する判断部と、
を有することを特徴とする切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016095253A JP6707396B2 (ja) | 2016-05-11 | 2016-05-11 | 切削装置 |
TW106110731A TWI705490B (zh) | 2016-05-11 | 2017-03-30 | 切割裝置 |
KR1020170052775A KR102251265B1 (ko) | 2016-05-11 | 2017-04-25 | 절삭 장치 |
CN201710291163.3A CN107379290B (zh) | 2016-05-11 | 2017-04-28 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016095253A JP6707396B2 (ja) | 2016-05-11 | 2016-05-11 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017202546A JP2017202546A (ja) | 2017-11-16 |
JP6707396B2 true JP6707396B2 (ja) | 2020-06-10 |
Family
ID=60321371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016095253A Active JP6707396B2 (ja) | 2016-05-11 | 2016-05-11 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6707396B2 (ja) |
KR (1) | KR102251265B1 (ja) |
CN (1) | CN107379290B (ja) |
TW (1) | TWI705490B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7064167B2 (ja) * | 2018-01-18 | 2022-05-10 | オムロン株式会社 | 光学計測装置及び光学計測方法 |
JP6968501B2 (ja) * | 2018-01-26 | 2021-11-17 | 株式会社ディスコ | 切削装置のセットアップ方法 |
JP2019186292A (ja) * | 2018-04-03 | 2019-10-24 | 株式会社ディスコ | 加工装置及び加工装置の使用方法 |
JP7126849B2 (ja) * | 2018-04-13 | 2022-08-29 | 株式会社ディスコ | 加工装置 |
JP7340911B2 (ja) * | 2018-08-17 | 2023-09-08 | 株式会社ディスコ | パッケージ基板の加工方法 |
JP7325203B2 (ja) * | 2019-03-25 | 2023-08-14 | 株式会社ディスコ | 加工装置 |
JP7325904B2 (ja) | 2019-07-26 | 2023-08-15 | 株式会社ディスコ | 切削ユニットの位置検出方法、及び切削装置 |
JP7248557B2 (ja) * | 2019-10-24 | 2023-03-29 | Towa株式会社 | ブレード交換装置、切断装置、及び、切断品の製造方法 |
CN112606234A (zh) * | 2020-12-28 | 2021-04-06 | 郑州光力瑞弘电子科技有限公司 | 划片机刀片监测装置及划片机 |
CN114102883A (zh) * | 2021-09-29 | 2022-03-01 | 上海华力集成电路制造有限公司 | 晶圆切边控制装置、控制方法及可读存储介质 |
CN114012603B (zh) * | 2021-11-09 | 2022-12-06 | 江苏京创先进电子科技有限公司 | 一种砂轮刀综合状态检测方法、装置、设备及存储介质 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2967618B2 (ja) * | 1991-08-21 | 1999-10-25 | 株式会社東京精密 | ブレード位置検出装置 |
JPH10177973A (ja) * | 1996-12-17 | 1998-06-30 | Disco Abrasive Syst Ltd | ブレード変位検出装置 |
JP2000124165A (ja) * | 1998-10-19 | 2000-04-28 | Disco Abrasive Syst Ltd | 切削装置 |
JP4590058B2 (ja) * | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP4590060B2 (ja) | 2000-04-14 | 2010-12-01 | 株式会社ディスコ | 切削装置 |
JP4634820B2 (ja) * | 2005-02-24 | 2011-02-16 | 株式会社ディスコ | 切削装置 |
JP4679209B2 (ja) * | 2005-04-04 | 2011-04-27 | 株式会社ディスコ | 切削装置およびブレード状態検出方法 |
JP4704816B2 (ja) * | 2005-06-29 | 2011-06-22 | 株式会社ディスコ | 切削装置 |
JP4708966B2 (ja) * | 2005-11-11 | 2011-06-22 | 株式会社ディスコ | 切削装置 |
JP2008149388A (ja) * | 2006-12-14 | 2008-07-03 | Disco Abrasive Syst Ltd | 切削加工装置 |
JP2009083077A (ja) * | 2007-10-03 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削ブレード検出機構 |
US7495759B1 (en) * | 2007-10-23 | 2009-02-24 | Asm Assembly Automation Ltd. | Damage and wear detection for rotary cutting blades |
JP5324187B2 (ja) * | 2008-10-29 | 2013-10-23 | 株式会社森精機製作所 | ミスト状切削液の吐出確認方法 |
JP5937404B2 (ja) * | 2012-04-04 | 2016-06-22 | 日東電工株式会社 | 保護テープ剥離方法および保護テープ剥離装置 |
JP2013258204A (ja) * | 2012-06-11 | 2013-12-26 | Disco Abrasive Syst Ltd | 切削装置 |
JP6101140B2 (ja) * | 2013-04-18 | 2017-03-22 | 株式会社ディスコ | 切削装置 |
CN103273382B (zh) * | 2013-05-30 | 2015-06-10 | 中国科学院长春光学精密机械与物理研究所 | 一种光栅尺的读数装置 |
JP6349496B2 (ja) * | 2014-02-24 | 2018-07-04 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
JP6294748B2 (ja) * | 2014-04-23 | 2018-03-14 | 株式会社ディスコ | 切削装置 |
TW201613718A (en) * | 2014-10-01 | 2016-04-16 | Chao-Ying Lee | Power diagnostic system for an electric saw device |
-
2016
- 2016-05-11 JP JP2016095253A patent/JP6707396B2/ja active Active
-
2017
- 2017-03-30 TW TW106110731A patent/TWI705490B/zh active
- 2017-04-25 KR KR1020170052775A patent/KR102251265B1/ko active IP Right Grant
- 2017-04-28 CN CN201710291163.3A patent/CN107379290B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20170127359A (ko) | 2017-11-21 |
JP2017202546A (ja) | 2017-11-16 |
CN107379290A (zh) | 2017-11-24 |
CN107379290B (zh) | 2020-11-13 |
TW201740452A (zh) | 2017-11-16 |
KR102251265B1 (ko) | 2021-05-11 |
TWI705490B (zh) | 2020-09-21 |
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