JP6704553B1 - 蓄熱装置 - Google Patents
蓄熱装置 Download PDFInfo
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- JP6704553B1 JP6704553B1 JP2020508414A JP2020508414A JP6704553B1 JP 6704553 B1 JP6704553 B1 JP 6704553B1 JP 2020508414 A JP2020508414 A JP 2020508414A JP 2020508414 A JP2020508414 A JP 2020508414A JP 6704553 B1 JP6704553 B1 JP 6704553B1
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- Prior art keywords
- heat
- heat storage
- group
- temperature
- general formula
- Prior art date
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- 239000011232 storage material Substances 0.000 claims abstract description 72
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- 239000012530 fluid Substances 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 239000012809 cooling fluid Substances 0.000 claims abstract description 14
- 239000003960 organic solvent Substances 0.000 claims abstract description 14
- 239000011557 critical solution Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 27
- 125000000524 functional group Chemical group 0.000 claims description 22
- 239000002253 acid Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
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Abstract
Description
図1は、実施の形態1に係る蓄熱システム2を示す回路図である。蓄熱システム2は、蓄熱装置1を利用して放熱端末23において冷房又は暖房を実施するものである。蓄熱システム2は、熱源3と、加熱冷却ポンプ52と、循環ポンプ22と、蓄熱装置1と、加熱冷却用流体と、熱利用流体とを備えている。加熱冷却配管13の下部の継手15と熱源3とは、加熱冷却ポンプ52を介して入口配管50により接続され、熱源3と加熱冷却配管13の上部の継手15とは、出口配管51により接続されている。これにより、熱源回路31が構成されており、加熱冷却用流体は熱源回路31を循環している。
実施例において、表1に示す配合の原料水溶液を、窒素雰囲気下、室温から50℃まで1時間かけて昇温させ、感温性高分子61を得た。これを乾燥後、蒸留水で平衡膨潤させ、感温性高分子ゲルを得た後、アルミ製の密閉容器に封入し、示差走査熱量計で吸熱ピーク温度と蓄熱密度を測定した。なお、表1中の略号は、それぞれ以下の事項を示す。即ち、A:N−3−イソプロポキシプロピルアクリルアミド、B:N−1−メトキシメチルプロピルアクリルアミド、C:N−アクリロイルピペリジン、MBA:N,N’−メチレンビスアクリルアミド、KPS:過硫酸カリウム、TEMED:N,N,N’,N’−テトラメチルエチレンジアミンである。
Claims (3)
- 水、有機溶媒、及び水又は有機溶媒の化合物からなる群から選択される溶媒と、感温性高分子とからなる感温性高分子ゲルを有する蓄熱材が封入された容器と、
前記容器に収容され、加熱冷却用流体と熱交換して前記蓄熱材を加熱又は冷却して前記蓄熱材に温熱又は冷熱を蓄えると共に、熱利用流体と熱交換して前記蓄熱材から吸熱して前記蓄熱材から放熱させる熱交換器と、を備え、
前記蓄熱材は、
下限臨界溶液温度を境界として親水性と疎水性とが可逆的に変化するものであり、親水性と疎水性との変化の過程において前記感温性高分子ゲルに含まれる前記溶媒が液体状態を維持するものであり、
前記感温性高分子は、架橋構造を有すると共に、ヒドロキシ基、スルホン酸基、オキシスルホン酸基、リン酸基及びオキシリン酸基からなる群から選択される一種以上の官能基を分子末端に有し、
前記感温性高分子を構成する繰り返し単位と、前記官能基と、前記架橋構造の単位とのモル比が、99:0.5:0.5〜70:20:10である
蓄熱装置。 - 前記熱交換器は、
前記加熱冷却用流体が流れる加熱冷却配管と、
前記熱利用流体が流れる熱利用配管と、を有する
請求項1記載の蓄熱装置。 - 前記感温性高分子ゲルは、
下記一般式(1)
下記一般式(2)
下記一般式(3)
前記一般式(1)又は前記一般式(2)で表される構成単位の共有結合手と前記一般式(3)で表される構成単位の共有結合手とが結合した架橋構造を有し、
前記一般式(1)又は前記一般式(2)で表される構成単位と、前記官能基であるXと、前記一般式(3)で表される構成単位とのモル比が、99:0.5:0.5〜70:23:7である
請求項1又は2記載の蓄熱装置。
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