JP6692376B2 - 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法 - Google Patents

電子部品の実装装置と実装方法、およびパッケージ部品の製造方法 Download PDF

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JP6692376B2
JP6692376B2 JP2017565564A JP2017565564A JP6692376B2 JP 6692376 B2 JP6692376 B2 JP 6692376B2 JP 2017565564 A JP2017565564 A JP 2017565564A JP 2017565564 A JP2017565564 A JP 2017565564A JP 6692376 B2 JP6692376 B2 JP 6692376B2
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Prior art keywords
mounting
stage
support substrate
semiconductor chip
electronic component
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Japanese (ja)
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JPWO2017135257A1 (ja
Inventor
正規 橋本
正規 橋本
琢也 井田
琢也 井田
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2020027546A priority Critical patent/JP6928134B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2017565564A 2016-02-01 2017-01-31 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法 Active JP6692376B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020027546A JP6928134B2 (ja) 2016-02-01 2020-02-20 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016017025 2016-02-01
JP2016017025 2016-02-01
PCT/JP2017/003439 WO2017135257A1 (ja) 2016-02-01 2017-01-31 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Related Child Applications (1)

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JP2020027546A Division JP6928134B2 (ja) 2016-02-01 2020-02-20 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Publications (2)

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JPWO2017135257A1 JPWO2017135257A1 (ja) 2018-11-29
JP6692376B2 true JP6692376B2 (ja) 2020-05-13

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JP2017565564A Active JP6692376B2 (ja) 2016-02-01 2017-01-31 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
JP2020027546A Active JP6928134B2 (ja) 2016-02-01 2020-02-20 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
JP2021075389A Active JP7108739B2 (ja) 2016-02-01 2021-04-27 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

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JP2021075389A Active JP7108739B2 (ja) 2016-02-01 2021-04-27 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Country Status (4)

Country Link
JP (3) JP6692376B2 (ko)
KR (2) KR102080214B1 (ko)
TW (2) TWI708295B (ko)
WO (1) WO2017135257A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7178782B2 (ja) * 2018-01-10 2022-11-28 芝浦メカトロニクス株式会社 電子部品の実装装置および実装方法
JP7112274B2 (ja) * 2018-07-25 2022-08-03 芝浦メカトロニクス株式会社 実装装置、及び実装装置に用いられる校正基板
JP7202176B2 (ja) * 2018-12-21 2023-01-11 キヤノン株式会社 搬送装置、基板処理装置、および物品製造方法
JP7350696B2 (ja) * 2019-08-29 2023-09-26 芝浦メカトロニクス株式会社 電子部品の実装装置
CN112447555B (zh) * 2019-08-29 2024-05-14 芝浦机械电子装置株式会社 电子零件的安装装置
US11723154B1 (en) * 2020-02-17 2023-08-08 Nicholas J. Chiolino Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package
JP7436251B2 (ja) * 2020-03-16 2024-02-21 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR20230108336A (ko) * 2021-02-10 2023-07-18 야마하하쓰도키 가부시키가이샤 가공 장치
KR102292225B1 (ko) * 2021-03-31 2021-08-23 주식회사 톱텍 다이 본딩헤드 구조
CN114039569B (zh) * 2021-11-09 2022-09-30 安徽聚强晶体有限公司 一种用于谐振器的封装结构及封装方法

Family Cites Families (14)

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JP2917117B2 (ja) * 1995-12-29 1999-07-12 名古屋電機工業株式会社 プリント基板における作業位置座標算出方法およびその装置
US6348728B1 (en) * 2000-01-28 2002-02-19 Fujitsu Limited Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
JP4381568B2 (ja) * 2000-06-19 2009-12-09 ヤマハ発動機株式会社 部品実装システムにおける基板認識方法及び同装置
KR101014293B1 (ko) 2005-12-22 2011-02-16 시바우라 메카트로닉스 가부시키가이샤 전자 부품의 실장 장치 및 실장 방법
JP4665863B2 (ja) 2006-08-08 2011-04-06 パナソニック株式会社 電子部品実装方法
JP2008166410A (ja) * 2006-12-27 2008-07-17 Toray Eng Co Ltd 位置決め較正方法及びそれを適用した実装装置
CH698334B1 (de) * 2007-10-09 2011-07-29 Esec Ag Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
JP5030843B2 (ja) 2008-04-14 2012-09-19 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
WO2012050178A1 (ja) * 2010-10-14 2012-04-19 シャープ株式会社 液晶表示装置
JP2013058520A (ja) 2011-09-07 2013-03-28 Dainippon Screen Mfg Co Ltd 描画装置、データ補正装置、再配線層の形成方法、および、データ補正方法
JP6227224B2 (ja) 2012-03-30 2017-11-08 ヤマハ発動機株式会社 電子部品装着ラインの管理装置及び電子部品装着装置
JP2013222740A (ja) * 2012-04-13 2013-10-28 Panasonic Corp 外観検査装置および外観検査方法
JP6340580B2 (ja) * 2014-01-08 2018-06-13 パナソニックＩｐマネジメント株式会社 部品実装装置
JP2015185546A (ja) 2014-03-20 2015-10-22 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法

Also Published As

Publication number Publication date
KR102080214B1 (ko) 2020-02-24
JP6928134B2 (ja) 2021-09-01
KR20180081772A (ko) 2018-07-17
JP7108739B2 (ja) 2022-07-28
TW201740476A (zh) 2017-11-16
JP2021114630A (ja) 2021-08-05
JPWO2017135257A1 (ja) 2018-11-29
KR102196105B1 (ko) 2020-12-30
TW201921536A (zh) 2019-06-01
TWI673803B (zh) 2019-10-01
WO2017135257A1 (ja) 2017-08-10
TWI708295B (zh) 2020-10-21
KR20190099355A (ko) 2019-08-26
JP2020102637A (ja) 2020-07-02

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