JP6684191B2 - 基板洗浄装置およびそれを備える基板処理装置 - Google Patents

基板洗浄装置およびそれを備える基板処理装置 Download PDF

Info

Publication number
JP6684191B2
JP6684191B2 JP2016172672A JP2016172672A JP6684191B2 JP 6684191 B2 JP6684191 B2 JP 6684191B2 JP 2016172672 A JP2016172672 A JP 2016172672A JP 2016172672 A JP2016172672 A JP 2016172672A JP 6684191 B2 JP6684191 B2 JP 6684191B2
Authority
JP
Japan
Prior art keywords
substrate
cleaning
unit
end surface
forming member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016172672A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018041754A (ja
JP2018041754A5 (OSRAM
Inventor
弘美 村地
弘美 村地
隆一 吉田
隆一 吉田
耕二 西山
耕二 西山
徹 門間
徹 門間
力 寒河江
力 寒河江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2016172672A priority Critical patent/JP6684191B2/ja
Priority to TW106128549A priority patent/TWI674153B/zh
Priority to US15/691,929 priority patent/US10331049B2/en
Priority to CN201710779419.5A priority patent/CN107799442B/zh
Priority to KR1020170111729A priority patent/KR101972226B1/ko
Publication of JP2018041754A publication Critical patent/JP2018041754A/ja
Publication of JP2018041754A5 publication Critical patent/JP2018041754A5/ja
Application granted granted Critical
Publication of JP6684191B2 publication Critical patent/JP6684191B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
JP2016172672A 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置 Active JP6684191B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016172672A JP6684191B2 (ja) 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置
TW106128549A TWI674153B (zh) 2016-09-05 2017-08-23 基板洗淨裝置及具備其之基板處理裝置
US15/691,929 US10331049B2 (en) 2016-09-05 2017-08-31 Substrate cleaning device and substrate processing apparatus including the same
CN201710779419.5A CN107799442B (zh) 2016-09-05 2017-09-01 基板清洗装置及具备该基板清洗装置的基板处理装置
KR1020170111729A KR101972226B1 (ko) 2016-09-05 2017-09-01 기판 세정 장치 및 그것을 구비하는 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016172672A JP6684191B2 (ja) 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置

Publications (3)

Publication Number Publication Date
JP2018041754A JP2018041754A (ja) 2018-03-15
JP2018041754A5 JP2018041754A5 (OSRAM) 2019-09-12
JP6684191B2 true JP6684191B2 (ja) 2020-04-22

Family

ID=61282178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016172672A Active JP6684191B2 (ja) 2016-09-05 2016-09-05 基板洗浄装置およびそれを備える基板処理装置

Country Status (5)

Country Link
US (1) US10331049B2 (OSRAM)
JP (1) JP6684191B2 (OSRAM)
KR (1) KR101972226B1 (OSRAM)
CN (1) CN107799442B (OSRAM)
TW (1) TWI674153B (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102081706B1 (ko) * 2018-07-18 2020-02-27 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN111069115A (zh) * 2018-10-22 2020-04-28 长鑫存储技术有限公司 一种cmp后清洗方法
JP7348021B2 (ja) * 2019-10-15 2023-09-20 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2021074825A (ja) * 2019-11-11 2021-05-20 株式会社ディスコ 保持面洗浄装置
CN111341699B (zh) * 2020-03-09 2023-03-31 杭州众硅电子科技有限公司 一种清洗刷预清洗系统
JP2024106671A (ja) * 2023-01-27 2024-08-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW316995B (OSRAM) * 1995-01-19 1997-10-01 Tokyo Electron Co Ltd
US5927305A (en) * 1996-02-20 1999-07-27 Pre-Tech Co., Ltd. Cleaning apparatus
JP3756284B2 (ja) 1997-04-30 2006-03-15 大日本スクリーン製造株式会社 基板洗浄装置
DE69835988T2 (de) * 1997-08-18 2007-06-21 Tokyo Electron Ltd. Doppelseitenreinigungsmaschine für ein Substrat
JP3415435B2 (ja) * 1998-04-03 2003-06-09 東京エレクトロン株式会社 処理装置及び処理方法
JP4334758B2 (ja) * 1999-12-17 2009-09-30 東京エレクトロン株式会社 膜形成装置
US6418584B1 (en) * 2000-05-24 2002-07-16 Speedfam-Ipec Corporation Apparatus and process for cleaning a work piece
JP3888608B2 (ja) * 2001-04-25 2007-03-07 東京エレクトロン株式会社 基板両面処理装置
JP2003007664A (ja) * 2001-06-22 2003-01-10 Ses Co Ltd 枚葉式基板洗浄方法および枚葉式基板洗浄装置
JP2003243350A (ja) * 2002-02-14 2003-08-29 Tokyo Electron Ltd スクラブ洗浄装置におけるブラシクリーニング方法及び処理システム
JP2006278392A (ja) * 2005-03-28 2006-10-12 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
KR100795622B1 (ko) * 2005-03-30 2008-01-17 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
JP4726752B2 (ja) * 2005-10-25 2011-07-20 義治 山本 基板洗浄装置
KR100892809B1 (ko) * 2006-03-30 2009-04-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
US20070251035A1 (en) * 2006-05-01 2007-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Cleaning device
JP4796542B2 (ja) * 2007-05-30 2011-10-19 株式会社プレテック 洗浄装置
JP4939376B2 (ja) 2007-11-13 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5091687B2 (ja) * 2008-01-08 2012-12-05 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR101423611B1 (ko) * 2008-01-16 2014-07-30 삼성전자주식회사 기판 처리 장치, 노광 장치 및 클리닝 툴의 세정 방법
JP2010287686A (ja) * 2009-06-10 2010-12-24 Tokyo Electron Ltd 塗布、現像装置及び基板の裏面洗浄方法。
JP5437168B2 (ja) * 2009-08-07 2014-03-12 東京エレクトロン株式会社 基板の液処理装置および液処理方法
US20120285484A1 (en) * 2011-05-13 2012-11-15 Li-Chung Liu Method for cleaning a semiconductor wafer
TWI550686B (zh) * 2011-11-04 2016-09-21 東京威力科創股份有限公司 基板處理系統、基板運送方法及電腦記憶媒體
TWI524456B (zh) * 2011-11-04 2016-03-01 東京威力科創股份有限公司 基板處理系統、基板運送方法、程式及電腦記憶媒體
JP5637974B2 (ja) * 2011-11-28 2014-12-10 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
US9119464B2 (en) * 2012-01-31 2015-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Brush cleaning system
JP6061484B2 (ja) * 2012-03-27 2017-01-18 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄装置およびそれを備えた基板処理装置
JP6001896B2 (ja) * 2012-03-27 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄装置およびそれを備えた基板処理装置
JP5887227B2 (ja) * 2012-08-07 2016-03-16 株式会社荏原製作所 ドレッサーディスク洗浄用ブラシ、洗浄装置及び洗浄方法
US9211568B2 (en) 2013-03-12 2015-12-15 Taiwan Semiconductor Manufacturing Company Limited Clean function for semiconductor wafer scrubber
JP6143589B2 (ja) 2013-07-12 2017-06-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6066861B2 (ja) * 2013-08-05 2017-01-25 東京エレクトロン株式会社 基板洗浄装置、基板の裏面洗浄方法及び洗浄機構
KR20150075357A (ko) * 2013-12-25 2015-07-03 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
US9700988B2 (en) * 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus
CN106714987B (zh) * 2014-09-26 2019-04-02 盛美半导体设备（上海）有限公司 清洗半导体硅片的装置和方法
JP6503194B2 (ja) * 2015-02-16 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6751634B2 (ja) * 2016-09-21 2020-09-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI821887B (zh) * 2016-11-29 2023-11-11 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體
JP6885754B2 (ja) * 2017-03-09 2021-06-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
KR101972226B1 (ko) 2019-04-24
CN107799442B (zh) 2021-09-14
TWI674153B (zh) 2019-10-11
US20180067407A1 (en) 2018-03-08
TW201811453A (zh) 2018-04-01
US10331049B2 (en) 2019-06-25
JP2018041754A (ja) 2018-03-15
CN107799442A (zh) 2018-03-13
KR20180027357A (ko) 2018-03-14

Similar Documents

Publication Publication Date Title
JP6740065B2 (ja) 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
JP6740066B2 (ja) 基板洗浄装置、基板処理装置および基板洗浄方法
KR101798320B1 (ko) 기판 처리 장치
JP6684191B2 (ja) 基板洗浄装置およびそれを備える基板処理装置
JP4757882B2 (ja) 基板洗浄装置、基板洗浄方法、基板処理システムならびに記録媒体
JP2010093265A (ja) 処理液供給ユニットとこれを利用した基板処理装置及び方法
US20240192611A1 (en) Apparatus for treating substrate and method for treating a substrate
JP7445698B2 (ja) 基板処理装置及び方法
US20240100572A1 (en) Apparatus for treating substrate and method for treating a substrate
US11940734B2 (en) Apparatus and method for treating substrate
JP7515541B2 (ja) 基板処理装置及び基板処理方法
US20250214120A1 (en) Substrate treatment apparatus and substrate treatment method
CN116994981A (zh) 用于处理基板的设备和方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190802

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200313

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200317

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200327

R150 Certificate of patent or registration of utility model

Ref document number: 6684191

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250