JP6679573B2 - 一体構成要素を備えたサーモサイホン - Google Patents

一体構成要素を備えたサーモサイホン Download PDF

Info

Publication number
JP6679573B2
JP6679573B2 JP2017511876A JP2017511876A JP6679573B2 JP 6679573 B2 JP6679573 B2 JP 6679573B2 JP 2017511876 A JP2017511876 A JP 2017511876A JP 2017511876 A JP2017511876 A JP 2017511876A JP 6679573 B2 JP6679573 B2 JP 6679573B2
Authority
JP
Japan
Prior art keywords
path
condenser
evaporator
liquid
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2017511876A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017525929A5 (enExample
JP2017525929A (ja
Inventor
エスパーセン，モーテン，ソエガード
モルッツィ，マルコ
ジェンセン，デニス，エヌ．
カン，スクビンダー，エス．
Original Assignee
アアヴィッド・サーマロイ・エルエルシー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アアヴィッド・サーマロイ・エルエルシー filed Critical アアヴィッド・サーマロイ・エルエルシー
Publication of JP2017525929A publication Critical patent/JP2017525929A/ja
Publication of JP2017525929A5 publication Critical patent/JP2017525929A5/ja
Application granted granted Critical
Publication of JP6679573B2 publication Critical patent/JP6679573B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2017511876A 2014-08-28 2014-08-28 一体構成要素を備えたサーモサイホン Expired - Fee Related JP6679573B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/053131 WO2016032482A1 (en) 2014-08-28 2014-08-28 Thermosiphon with integrated components

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019076373A Division JP2019113310A (ja) 2019-04-12 2019-04-12 一体構成要素を備えたサーモサイホン

Publications (3)

Publication Number Publication Date
JP2017525929A JP2017525929A (ja) 2017-09-07
JP2017525929A5 JP2017525929A5 (enExample) 2017-10-19
JP6679573B2 true JP6679573B2 (ja) 2020-04-15

Family

ID=51564803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017511876A Expired - Fee Related JP6679573B2 (ja) 2014-08-28 2014-08-28 一体構成要素を備えたサーモサイホン

Country Status (5)

Country Link
US (1) US10054371B2 (enExample)
EP (1) EP3186574B1 (enExample)
JP (1) JP6679573B2 (enExample)
CN (2) CN105556232B (enExample)
WO (1) WO2016032482A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014204935A1 (de) * 2014-03-17 2015-10-01 Mahle International Gmbh Heizkühlmodul
EP3286513B1 (en) * 2015-04-21 2019-09-04 Aavid Thermalloy, LLC Thermosiphon with multiport tube and flow arrangement
CN106288893A (zh) * 2015-06-03 2017-01-04 丹佛斯微通道换热器（嘉兴）有限公司 换热器系统
EP3489604B1 (en) * 2017-11-24 2020-12-23 TitanX Holding AB Vehicle condenser
CN111132526B (zh) * 2020-01-20 2025-02-11 深圳兴奇宏科技有限公司 热虹吸散热装置的连通强化结构
US11388840B2 (en) 2020-04-14 2022-07-12 Deere & Company Condensers and electronic assemblies
CN115410941A (zh) * 2021-05-28 2022-11-29 中微半导体设备(上海)股份有限公司 控温部件、控温装置及反应腔温控方法
WO2023212236A1 (en) 2022-04-28 2023-11-02 Johnson Controls Tyco Ip Holdings, Llp Direct evaporative cooling system for data center with fan and water optimization
US12324127B2 (en) * 2022-07-19 2025-06-03 Hewlett Packard Enterprise Development Lp Folded-fin vapor chamber cold plate

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234059A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体素子の沸謄冷却装置
DE3877438T2 (de) * 1987-07-10 1993-06-03 Hitachi Ltd Halbleiter-kuehlungsapparat.
CN2096721U (zh) * 1991-02-04 1992-02-19 王永生 温差电制冷器
US6357517B1 (en) * 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
JP3608272B2 (ja) * 1995-07-05 2005-01-05 株式会社デンソー 沸騰冷却装置およびその製造方法
US5655598A (en) * 1995-09-19 1997-08-12 Garriss; John Ellsworth Apparatus and method for natural heat transfer between mediums having different temperatures
GB2312499B (en) * 1996-03-29 2000-10-25 Denso Corp Cooling apparatus using boiling and condensing refrigerant
JP2001148453A (ja) * 1999-11-19 2001-05-29 Denso Corp 沸騰冷却装置
SE0301381D0 (sv) * 2003-05-12 2003-05-12 Sapa Ab Extruded heat sink with integrated thermosyphon
US7497249B2 (en) * 2007-03-30 2009-03-03 Delphi Technologies, Inc. Thermosiphon for laptop computer
EP2031332B1 (en) * 2007-08-27 2010-09-15 ABB Research LTD Heat exchanger for power-electronics components
US7980078B2 (en) * 2008-03-31 2011-07-19 Mccutchen Co. Vapor vortex heat sink
ATE554361T1 (de) * 2009-04-28 2012-05-15 Abb Research Ltd Wärmerohr mit gewundenem rohr
EP2433480B1 (en) * 2009-05-18 2013-05-01 Huawei Technologies Co., Ltd. Heat spreading device and method therefore
EP2327947B1 (en) * 2009-11-30 2012-02-22 ABB Research Ltd Heat exchanger
AU2012232968B2 (en) * 2011-10-31 2014-11-13 Abb Technology Ag Thermosiphon cooler arrangement in modules with electric and/or electronic components
JP2013211297A (ja) * 2012-03-30 2013-10-10 Denso Corp 沸騰冷却装置
US20170307301A1 (en) * 2014-11-11 2017-10-26 Dantherm Cooling A/S Thermosiphon blocks and thermosiphon systems for heat transfer

Also Published As

Publication number Publication date
US10054371B2 (en) 2018-08-21
CN108801012A (zh) 2018-11-13
US20170167798A1 (en) 2017-06-15
EP3186574B1 (en) 2019-08-21
JP2017525929A (ja) 2017-09-07
WO2016032482A8 (en) 2016-04-28
EP3186574A1 (en) 2017-07-05
CN105556232B (zh) 2018-06-26
CN108801012B (zh) 2020-10-23
CN105556232A (zh) 2016-05-04
WO2016032482A1 (en) 2016-03-03

Similar Documents

Publication Publication Date Title
JP6679573B2 (ja) 一体構成要素を備えたサーモサイホン
US10989483B2 (en) Thermosiphon with multiport tube and flow arrangement
EP3194875B1 (en) Arrangement comprising a thermosiphon device with bent tube section
US9618244B2 (en) Power electronics cooling
US8792238B2 (en) Heat-dissipating module having loop-type vapor chamber
US9007771B2 (en) Multi-row thermosyphon heat exchanger
US10612856B2 (en) Heat exchanger and air conditioning system
US9906001B2 (en) Passive cooling system for switchgear with star-shaped condenser
EP3772629B1 (en) Heat dissipating fin with thermosiphon
CN103363827A (zh) 沸腾冷却装置
US20170307265A1 (en) Refrigeration appliance with a heat exchanging element
JP2019113310A (ja) 一体構成要素を備えたサーモサイホン
WO2017169969A1 (ja) 冷却装置
JP2008025884A (ja) 沸騰冷却式熱交換装置
KR20100003499A (ko) 평판형 양면 증발면을 가지는 루프 히트 파이프 장치의증발기, 이를 구비한 루프 히트 파이프 장치 및 이를이용한 열전달방법
JP4001607B2 (ja) スターリング冷却庫
JP2000065454A (ja) 沸騰冷却装置
JP2000031362A (ja) 沸騰冷却装置
JP2007051789A (ja) 放熱システムおよびこれを備えたスターリング冷却庫
JPH08327258A (ja) 熱交換器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170802

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170802

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180608

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180615

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180906

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181015

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20181220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200318

R150 Certificate of patent or registration of utility model

Ref document number: 6679573

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees