JP6679573B2 - 一体構成要素を備えたサーモサイホン - Google Patents

一体構成要素を備えたサーモサイホン Download PDF

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Publication number
JP6679573B2
JP6679573B2 JP2017511876A JP2017511876A JP6679573B2 JP 6679573 B2 JP6679573 B2 JP 6679573B2 JP 2017511876 A JP2017511876 A JP 2017511876A JP 2017511876 A JP2017511876 A JP 2017511876A JP 6679573 B2 JP6679573 B2 JP 6679573B2
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Japan
Prior art keywords
path
condenser
evaporator
liquid
section
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2017511876A
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English (en)
Japanese (ja)
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JP2017525929A5 (enExample
JP2017525929A (ja
Inventor
エスパーセン，モーテン，ソエガード
モルッツィ，マルコ
ジェンセン，デニス，エヌ．
カン，スクビンダー，エス．
Original Assignee
アアヴィッド・サーマロイ・エルエルシー
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Publication of JP2017525929A5 publication Critical patent/JP2017525929A5/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H10W40/73—
    • H10W40/226—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2017511876A 2014-08-28 2014-08-28 一体構成要素を備えたサーモサイホン Expired - Fee Related JP6679573B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/053131 WO2016032482A1 (en) 2014-08-28 2014-08-28 Thermosiphon with integrated components

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019076373A Division JP2019113310A (ja) 2019-04-12 2019-04-12 一体構成要素を備えたサーモサイホン

Publications (3)

Publication Number Publication Date
JP2017525929A JP2017525929A (ja) 2017-09-07
JP2017525929A5 JP2017525929A5 (enExample) 2017-10-19
JP6679573B2 true JP6679573B2 (ja) 2020-04-15

Family

ID=51564803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017511876A Expired - Fee Related JP6679573B2 (ja) 2014-08-28 2014-08-28 一体構成要素を備えたサーモサイホン

Country Status (5)

Country Link
US (1) US10054371B2 (enExample)
EP (1) EP3186574B1 (enExample)
JP (1) JP6679573B2 (enExample)
CN (2) CN108801012B (enExample)
WO (1) WO2016032482A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014204935A1 (de) * 2014-03-17 2015-10-01 Mahle International Gmbh Heizkühlmodul
CN107548447A (zh) * 2015-04-21 2018-01-05 阿威德热合金有限公司 具有多端口管和流动布置的热虹吸装置
CN106288893A (zh) * 2015-06-03 2017-01-04 丹佛斯微通道换热器（嘉兴）有限公司 换热器系统
EP3489604B1 (en) * 2017-11-24 2020-12-23 TitanX Holding AB Vehicle condenser
CN111132526B (zh) * 2020-01-20 2025-02-11 深圳兴奇宏科技有限公司 热虹吸散热装置的连通强化结构
US11388840B2 (en) 2020-04-14 2022-07-12 Deere & Company Condensers and electronic assemblies
CN115410941A (zh) * 2021-05-28 2022-11-29 中微半导体设备(上海)股份有限公司 控温部件、控温装置及反应腔温控方法
US12474070B2 (en) 2022-04-28 2025-11-18 Tyco Fire & Security Gmbh Direct evaporative cooling system for data center with fan and water optimization
US12512389B1 (en) * 2022-05-02 2025-12-30 Advanced Thermal Solutions, Inc. Thermal management multi-loop transport apparatus, and related methods
US12324127B2 (en) * 2022-07-19 2025-06-03 Hewlett Packard Enterprise Development Lp Folded-fin vapor chamber cold plate

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234059A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体素子の沸謄冷却装置
EP0298372B1 (en) * 1987-07-10 1993-01-13 Hitachi, Ltd. Semiconductor cooling apparatus
CN2096721U (zh) * 1991-02-04 1992-02-19 王永生 温差电制冷器
US6357517B1 (en) * 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
JP3608272B2 (ja) * 1995-07-05 2005-01-05 株式会社デンソー 沸騰冷却装置およびその製造方法
US5655598A (en) * 1995-09-19 1997-08-12 Garriss; John Ellsworth Apparatus and method for natural heat transfer between mediums having different temperatures
GB2312499B (en) * 1996-03-29 2000-10-25 Denso Corp Cooling apparatus using boiling and condensing refrigerant
JP2001148453A (ja) * 1999-11-19 2001-05-29 Denso Corp 沸騰冷却装置
SE0301381D0 (sv) * 2003-05-12 2003-05-12 Sapa Ab Extruded heat sink with integrated thermosyphon
US7497249B2 (en) * 2007-03-30 2009-03-03 Delphi Technologies, Inc. Thermosiphon for laptop computer
ATE481611T1 (de) * 2007-08-27 2010-10-15 Abb Research Ltd Wärmetauscher für komponenten der leistungselektronik
US7980078B2 (en) * 2008-03-31 2011-07-19 Mccutchen Co. Vapor vortex heat sink
EP2246653B1 (en) * 2009-04-28 2012-04-18 ABB Research Ltd. Twisted tube thermosyphon
WO2010150064A1 (en) * 2009-05-18 2010-12-29 Huawei Technologies Co. Ltd. Heat spreading device and method therefore
ATE546705T1 (de) * 2009-11-30 2012-03-15 Abb Research Ltd Wärmetauscher
AU2012232968B2 (en) * 2011-10-31 2014-11-13 Abb Technology Ag Thermosiphon cooler arrangement in modules with electric and/or electronic components
JP2013211297A (ja) * 2012-03-30 2013-10-10 Denso Corp 沸騰冷却装置
CN107003072A (zh) * 2014-11-11 2017-08-01 丹麦丹腾制冷股份公司 用于热传递的热虹吸块和热虹吸系统

Also Published As

Publication number Publication date
CN105556232A (zh) 2016-05-04
CN108801012B (zh) 2020-10-23
US20170167798A1 (en) 2017-06-15
CN108801012A (zh) 2018-11-13
CN105556232B (zh) 2018-06-26
WO2016032482A8 (en) 2016-04-28
EP3186574A1 (en) 2017-07-05
US10054371B2 (en) 2018-08-21
JP2017525929A (ja) 2017-09-07
EP3186574B1 (en) 2019-08-21
WO2016032482A1 (en) 2016-03-03

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