JP2017525929A5 - - Google Patents

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Publication number
JP2017525929A5
JP2017525929A5 JP2017511876A JP2017511876A JP2017525929A5 JP 2017525929 A5 JP2017525929 A5 JP 2017525929A5 JP 2017511876 A JP2017511876 A JP 2017511876A JP 2017511876 A JP2017511876 A JP 2017511876A JP 2017525929 A5 JP2017525929 A5 JP 2017525929A5
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JP
Japan
Prior art keywords
path
liquid
tube
evaporation
evaporator
Prior art date
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Granted
Application number
JP2017511876A
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English (en)
Japanese (ja)
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JP6679573B2 (ja
JP2017525929A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/053131 external-priority patent/WO2016032482A1/en
Publication of JP2017525929A publication Critical patent/JP2017525929A/ja
Publication of JP2017525929A5 publication Critical patent/JP2017525929A5/ja
Application granted granted Critical
Publication of JP6679573B2 publication Critical patent/JP6679573B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017511876A 2014-08-28 2014-08-28 一体構成要素を備えたサーモサイホン Expired - Fee Related JP6679573B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/053131 WO2016032482A1 (en) 2014-08-28 2014-08-28 Thermosiphon with integrated components

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019076373A Division JP2019113310A (ja) 2019-04-12 2019-04-12 一体構成要素を備えたサーモサイホン

Publications (3)

Publication Number Publication Date
JP2017525929A JP2017525929A (ja) 2017-09-07
JP2017525929A5 true JP2017525929A5 (enExample) 2017-10-19
JP6679573B2 JP6679573B2 (ja) 2020-04-15

Family

ID=51564803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017511876A Expired - Fee Related JP6679573B2 (ja) 2014-08-28 2014-08-28 一体構成要素を備えたサーモサイホン

Country Status (5)

Country Link
US (1) US10054371B2 (enExample)
EP (1) EP3186574B1 (enExample)
JP (1) JP6679573B2 (enExample)
CN (2) CN105556232B (enExample)
WO (1) WO2016032482A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014204935A1 (de) * 2014-03-17 2015-10-01 Mahle International Gmbh Heizkühlmodul
EP3286513B1 (en) * 2015-04-21 2019-09-04 Aavid Thermalloy, LLC Thermosiphon with multiport tube and flow arrangement
CN106288893A (zh) * 2015-06-03 2017-01-04 丹佛斯微通道换热器（嘉兴）有限公司 换热器系统
EP3489604B1 (en) * 2017-11-24 2020-12-23 TitanX Holding AB Vehicle condenser
CN111132526B (zh) * 2020-01-20 2025-02-11 深圳兴奇宏科技有限公司 热虹吸散热装置的连通强化结构
US11388840B2 (en) 2020-04-14 2022-07-12 Deere & Company Condensers and electronic assemblies
CN115410941A (zh) * 2021-05-28 2022-11-29 中微半导体设备(上海)股份有限公司 控温部件、控温装置及反应腔温控方法
WO2023212236A1 (en) 2022-04-28 2023-11-02 Johnson Controls Tyco Ip Holdings, Llp Direct evaporative cooling system for data center with fan and water optimization
US12324127B2 (en) * 2022-07-19 2025-06-03 Hewlett Packard Enterprise Development Lp Folded-fin vapor chamber cold plate

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234059A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体素子の沸謄冷却装置
DE3877438T2 (de) * 1987-07-10 1993-06-03 Hitachi Ltd Halbleiter-kuehlungsapparat.
CN2096721U (zh) * 1991-02-04 1992-02-19 王永生 温差电制冷器
US6357517B1 (en) * 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
JP3608272B2 (ja) * 1995-07-05 2005-01-05 株式会社デンソー 沸騰冷却装置およびその製造方法
US5655598A (en) * 1995-09-19 1997-08-12 Garriss; John Ellsworth Apparatus and method for natural heat transfer between mediums having different temperatures
GB2312499B (en) * 1996-03-29 2000-10-25 Denso Corp Cooling apparatus using boiling and condensing refrigerant
JP2001148453A (ja) * 1999-11-19 2001-05-29 Denso Corp 沸騰冷却装置
SE0301381D0 (sv) * 2003-05-12 2003-05-12 Sapa Ab Extruded heat sink with integrated thermosyphon
US7497249B2 (en) * 2007-03-30 2009-03-03 Delphi Technologies, Inc. Thermosiphon for laptop computer
EP2031332B1 (en) * 2007-08-27 2010-09-15 ABB Research LTD Heat exchanger for power-electronics components
US7980078B2 (en) * 2008-03-31 2011-07-19 Mccutchen Co. Vapor vortex heat sink
ATE554361T1 (de) * 2009-04-28 2012-05-15 Abb Research Ltd Wärmerohr mit gewundenem rohr
EP2433480B1 (en) * 2009-05-18 2013-05-01 Huawei Technologies Co., Ltd. Heat spreading device and method therefore
EP2327947B1 (en) * 2009-11-30 2012-02-22 ABB Research Ltd Heat exchanger
AU2012232968B2 (en) * 2011-10-31 2014-11-13 Abb Technology Ag Thermosiphon cooler arrangement in modules with electric and/or electronic components
JP2013211297A (ja) * 2012-03-30 2013-10-10 Denso Corp 沸騰冷却装置
US20170307301A1 (en) * 2014-11-11 2017-10-26 Dantherm Cooling A/S Thermosiphon blocks and thermosiphon systems for heat transfer

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