CN105556232B - 具有一体式部件的热虹吸装置 - Google Patents

具有一体式部件的热虹吸装置 Download PDF

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Publication number
CN105556232B
CN105556232B CN201480041426.XA CN201480041426A CN105556232B CN 105556232 B CN105556232 B CN 105556232B CN 201480041426 A CN201480041426 A CN 201480041426A CN 105556232 B CN105556232 B CN 105556232B
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CN
China
Prior art keywords
section
liquid
evaporator
condenser
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480041426.XA
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English (en)
Chinese (zh)
Other versions
CN105556232A (zh
Inventor
莫滕·瑟高·埃斯珀森
马可·莫鲁齐
丹尼斯·N·延森
苏克温德·S·康
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy LLC
Original Assignee
Aavid Thermalloy LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy LLC filed Critical Aavid Thermalloy LLC
Priority to CN201810542606.6A priority Critical patent/CN108801012B/zh
Publication of CN105556232A publication Critical patent/CN105556232A/zh
Application granted granted Critical
Publication of CN105556232B publication Critical patent/CN105556232B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201480041426.XA 2014-08-28 2014-08-28 具有一体式部件的热虹吸装置 Active CN105556232B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810542606.6A CN108801012B (zh) 2014-08-28 2014-08-28 具有一体式部件的热虹吸装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/053131 WO2016032482A1 (en) 2014-08-28 2014-08-28 Thermosiphon with integrated components

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201810542606.6A Division CN108801012B (zh) 2014-08-28 2014-08-28 具有一体式部件的热虹吸装置

Publications (2)

Publication Number Publication Date
CN105556232A CN105556232A (zh) 2016-05-04
CN105556232B true CN105556232B (zh) 2018-06-26

Family

ID=51564803

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201480041426.XA Active CN105556232B (zh) 2014-08-28 2014-08-28 具有一体式部件的热虹吸装置
CN201810542606.6A Active CN108801012B (zh) 2014-08-28 2014-08-28 具有一体式部件的热虹吸装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810542606.6A Active CN108801012B (zh) 2014-08-28 2014-08-28 具有一体式部件的热虹吸装置

Country Status (5)

Country Link
US (1) US10054371B2 (enExample)
EP (1) EP3186574B1 (enExample)
JP (1) JP6679573B2 (enExample)
CN (2) CN105556232B (enExample)
WO (1) WO2016032482A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014204935A1 (de) * 2014-03-17 2015-10-01 Mahle International Gmbh Heizkühlmodul
EP3286513B1 (en) * 2015-04-21 2019-09-04 Aavid Thermalloy, LLC Thermosiphon with multiport tube and flow arrangement
CN106288893A (zh) * 2015-06-03 2017-01-04 丹佛斯微通道换热器（嘉兴）有限公司 换热器系统
EP3489604B1 (en) * 2017-11-24 2020-12-23 TitanX Holding AB Vehicle condenser
CN111132526B (zh) * 2020-01-20 2025-02-11 深圳兴奇宏科技有限公司 热虹吸散热装置的连通强化结构
US11388840B2 (en) 2020-04-14 2022-07-12 Deere & Company Condensers and electronic assemblies
CN115410941A (zh) * 2021-05-28 2022-11-29 中微半导体设备(上海)股份有限公司 控温部件、控温装置及反应腔温控方法
WO2023212236A1 (en) 2022-04-28 2023-11-02 Johnson Controls Tyco Ip Holdings, Llp Direct evaporative cooling system for data center with fan and water optimization
US12324127B2 (en) * 2022-07-19 2025-06-03 Hewlett Packard Enterprise Development Lp Folded-fin vapor chamber cold plate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2096721U (zh) * 1991-02-04 1992-02-19 王永生 温差电制冷器
US5713413A (en) * 1994-12-28 1998-02-03 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
CN1551724A (zh) * 2003-05-12 2004-12-01 SAPA�ɷݹ�˾ 热虹吸管及其制造方法
EP2031332A1 (en) * 2007-08-27 2009-03-04 ABB Research LTD Heat exchanger for power-electronics components
EP2246653A1 (en) * 2009-04-28 2010-11-03 ABB Research Ltd. Twisted tube thermosyphon
CN102440086A (zh) * 2009-05-18 2012-05-02 华为技术有限公司 散热装置及其方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234059A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd 半導体素子の沸謄冷却装置
DE3877438T2 (de) * 1987-07-10 1993-06-03 Hitachi Ltd Halbleiter-kuehlungsapparat.
US6357517B1 (en) * 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
JP3608272B2 (ja) * 1995-07-05 2005-01-05 株式会社デンソー 沸騰冷却装置およびその製造方法
US5655598A (en) * 1995-09-19 1997-08-12 Garriss; John Ellsworth Apparatus and method for natural heat transfer between mediums having different temperatures
GB2312499B (en) * 1996-03-29 2000-10-25 Denso Corp Cooling apparatus using boiling and condensing refrigerant
JP2001148453A (ja) * 1999-11-19 2001-05-29 Denso Corp 沸騰冷却装置
US7497249B2 (en) * 2007-03-30 2009-03-03 Delphi Technologies, Inc. Thermosiphon for laptop computer
US7980078B2 (en) * 2008-03-31 2011-07-19 Mccutchen Co. Vapor vortex heat sink
EP2327947B1 (en) * 2009-11-30 2012-02-22 ABB Research Ltd Heat exchanger
AU2012232968B2 (en) * 2011-10-31 2014-11-13 Abb Technology Ag Thermosiphon cooler arrangement in modules with electric and/or electronic components
JP2013211297A (ja) * 2012-03-30 2013-10-10 Denso Corp 沸騰冷却装置
US20170307301A1 (en) * 2014-11-11 2017-10-26 Dantherm Cooling A/S Thermosiphon blocks and thermosiphon systems for heat transfer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2096721U (zh) * 1991-02-04 1992-02-19 王永生 温差电制冷器
US5713413A (en) * 1994-12-28 1998-02-03 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
CN1551724A (zh) * 2003-05-12 2004-12-01 SAPA�ɷݹ�˾ 热虹吸管及其制造方法
EP2031332A1 (en) * 2007-08-27 2009-03-04 ABB Research LTD Heat exchanger for power-electronics components
EP2246653A1 (en) * 2009-04-28 2010-11-03 ABB Research Ltd. Twisted tube thermosyphon
CN102440086A (zh) * 2009-05-18 2012-05-02 华为技术有限公司 散热装置及其方法

Also Published As

Publication number Publication date
US10054371B2 (en) 2018-08-21
CN108801012A (zh) 2018-11-13
US20170167798A1 (en) 2017-06-15
JP6679573B2 (ja) 2020-04-15
EP3186574B1 (en) 2019-08-21
JP2017525929A (ja) 2017-09-07
WO2016032482A8 (en) 2016-04-28
EP3186574A1 (en) 2017-07-05
CN108801012B (zh) 2020-10-23
CN105556232A (zh) 2016-05-04
WO2016032482A1 (en) 2016-03-03

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