JP2017534826A5 - - Google Patents

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Publication number
JP2017534826A5
JP2017534826A5 JP2017511993A JP2017511993A JP2017534826A5 JP 2017534826 A5 JP2017534826 A5 JP 2017534826A5 JP 2017511993 A JP2017511993 A JP 2017511993A JP 2017511993 A JP2017511993 A JP 2017511993A JP 2017534826 A5 JP2017534826 A5 JP 2017534826A5
Authority
JP
Japan
Prior art keywords
condenser
manifold
evaporator
header
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017511993A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017534826A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/049358 external-priority patent/WO2016044052A2/en
Publication of JP2017534826A publication Critical patent/JP2017534826A/ja
Publication of JP2017534826A5 publication Critical patent/JP2017534826A5/ja
Pending legal-status Critical Current

Links

JP2017511993A 2014-09-15 2015-09-10 屈曲管部を備えたサーモサイホン Pending JP2017534826A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462050463P 2014-09-15 2014-09-15
US62/050,463 2014-09-15
PCT/US2015/049358 WO2016044052A2 (en) 2014-09-15 2015-09-10 Thermosiphon with bent tube section

Publications (2)

Publication Number Publication Date
JP2017534826A JP2017534826A (ja) 2017-11-24
JP2017534826A5 true JP2017534826A5 (enExample) 2018-10-18

Family

ID=54200066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017511993A Pending JP2017534826A (ja) 2014-09-15 2015-09-10 屈曲管部を備えたサーモサイホン

Country Status (5)

Country Link
US (1) US10655920B2 (enExample)
EP (1) EP3194875B1 (enExample)
JP (1) JP2017534826A (enExample)
CN (1) CN106461347B (enExample)
WO (1) WO2016044052A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10353445B2 (en) 2016-04-11 2019-07-16 Qualcomm Incorporated Multi-phase heat dissipating device for an electronic device
US10746474B2 (en) 2016-04-11 2020-08-18 Qualcomm Incorporated Multi-phase heat dissipating device comprising piezo structures
US9999157B2 (en) 2016-08-12 2018-06-12 Qualcomm Incorporated Multi-phase heat dissipating device embedded in an electronic device
TWI685638B (zh) 2018-09-14 2020-02-21 財團法人工業技術研究院 立體脈衝式熱管、立體脈衝式熱管組和散熱模組
US10890386B2 (en) * 2019-02-01 2021-01-12 Mahle International Gmbh Evaporator unit including distributor tube and method thereof
US11181323B2 (en) 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements
CN110345573B (zh) * 2019-07-02 2020-12-29 沈珂 一种除湿换热装置
US11454462B2 (en) * 2019-08-05 2022-09-27 Aavid Thermalloy, Llc Heat dissipating fin with thermosiphon
US11035620B1 (en) * 2020-11-19 2021-06-15 Richard W. Trent Loop heat pipe transfer system with manifold
WO2023212236A1 (en) 2022-04-28 2023-11-02 Johnson Controls Tyco Ip Holdings, Llp Direct evaporative cooling system for data center with fan and water optimization

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AU2012232967B2 (en) 2011-10-31 2015-01-15 Abb Technology Ag Cabinet with modules having a thermosiphon cooler arrangement
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CN102997728A (zh) 2013-01-05 2013-03-27 北京德能恒信科技有限公司 一种多级分体式热管

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