JP2017534826A - 屈曲管部を備えたサーモサイホン - Google Patents

屈曲管部を備えたサーモサイホン Download PDF

Info

Publication number
JP2017534826A
JP2017534826A JP2017511993A JP2017511993A JP2017534826A JP 2017534826 A JP2017534826 A JP 2017534826A JP 2017511993 A JP2017511993 A JP 2017511993A JP 2017511993 A JP2017511993 A JP 2017511993A JP 2017534826 A JP2017534826 A JP 2017534826A
Authority
JP
Japan
Prior art keywords
condenser
evaporator
manifold
section
header
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017511993A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017534826A5 (enExample
Inventor
エスパーセン，モーテン，ソエガード
アングリサニ，マリア，ルイザ
ジェンセン，デニス，エヌ．
カン，スクビンダル，エス．
Original Assignee
アアヴィッド・サーマロイ・エルエルシー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アアヴィッド・サーマロイ・エルエルシー filed Critical アアヴィッド・サーマロイ・エルエルシー
Publication of JP2017534826A publication Critical patent/JP2017534826A/ja
Publication of JP2017534826A5 publication Critical patent/JP2017534826A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2017511993A 2014-09-15 2015-09-10 屈曲管部を備えたサーモサイホン Pending JP2017534826A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462050463P 2014-09-15 2014-09-15
US62/050,463 2014-09-15
PCT/US2015/049358 WO2016044052A2 (en) 2014-09-15 2015-09-10 Thermosiphon with bent tube section

Publications (2)

Publication Number Publication Date
JP2017534826A true JP2017534826A (ja) 2017-11-24
JP2017534826A5 JP2017534826A5 (enExample) 2018-10-18

Family

ID=54200066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017511993A Pending JP2017534826A (ja) 2014-09-15 2015-09-10 屈曲管部を備えたサーモサイホン

Country Status (5)

Country Link
US (1) US10655920B2 (enExample)
EP (1) EP3194875B1 (enExample)
JP (1) JP2017534826A (enExample)
CN (1) CN106461347B (enExample)
WO (1) WO2016044052A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10353445B2 (en) 2016-04-11 2019-07-16 Qualcomm Incorporated Multi-phase heat dissipating device for an electronic device
US10746474B2 (en) 2016-04-11 2020-08-18 Qualcomm Incorporated Multi-phase heat dissipating device comprising piezo structures
US9999157B2 (en) 2016-08-12 2018-06-12 Qualcomm Incorporated Multi-phase heat dissipating device embedded in an electronic device
TWI685638B (zh) 2018-09-14 2020-02-21 財團法人工業技術研究院 立體脈衝式熱管、立體脈衝式熱管組和散熱模組
US10890386B2 (en) * 2019-02-01 2021-01-12 Mahle International Gmbh Evaporator unit including distributor tube and method thereof
US11181323B2 (en) 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements
CN110345573B (zh) * 2019-07-02 2020-12-29 沈珂 一种除湿换热装置
US11454462B2 (en) * 2019-08-05 2022-09-27 Aavid Thermalloy, Llc Heat dissipating fin with thermosiphon
US11035620B1 (en) * 2020-11-19 2021-06-15 Richard W. Trent Loop heat pipe transfer system with manifold
WO2023212236A1 (en) 2022-04-28 2023-11-02 Johnson Controls Tyco Ip Holdings, Llp Direct evaporative cooling system for data center with fan and water optimization

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55155189A (en) * 1979-05-18 1980-12-03 Babcock Hitachi Kk Heat exchanger with inclined header
JPH03283454A (ja) * 1990-03-30 1991-12-13 Toshiba Corp 半導体冷却装置
JPH09133482A (ja) * 1995-11-09 1997-05-20 Showa Alum Corp 放熱器
JPH09264677A (ja) * 1996-03-29 1997-10-07 Denso Corp 沸騰冷却器、その沸騰冷却器を備えた熱交換装置、およびその熱交換装置を備えた沸騰冷却装置
JPH11294981A (ja) * 1998-04-10 1999-10-29 Diamond Electric Mfg Co Ltd ヒートパイプの加工方法
JP2007192474A (ja) * 2006-01-19 2007-08-02 Calsonic Kansei Corp 熱交換器
WO2010072221A2 (en) * 2008-12-23 2010-07-01 Noise Limit Aps Cooling device with bended flat tube and related manufacturing method
JP2013098568A (ja) * 2011-10-31 2013-05-20 Abb Technology Ag 熱サイフォン冷却器の配置を有するモジュールを備えたキャビネット

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3658075A (en) 1970-11-30 1972-04-25 Gen Motors Corp Dishwasher having improved condensation means
SU861917A1 (ru) 1979-11-19 1981-09-07 За витель Термосифонный теплообменник
US4830100A (en) * 1985-11-25 1989-05-16 The Nippon Aluminium Mfg. Co., Ltd. Heat-pipe device and heat-sink device
JPH063354B2 (ja) 1987-06-23 1994-01-12 アクトロニクス株式会社 ル−プ型細管ヒ−トパイプ
US5185925A (en) 1992-01-29 1993-02-16 General Motors Corporation Method of manufacturing a tube for a heat exchanger
JP2768212B2 (ja) 1993-06-03 1998-06-25 三菱電機株式会社 熱伝達装置およびその製造方法
JP3487382B2 (ja) 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
JP3608272B2 (ja) 1995-07-05 2005-01-05 株式会社デンソー 沸騰冷却装置およびその製造方法
US6073683A (en) 1995-07-05 2000-06-13 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
GB2312499B (en) * 1996-03-29 2000-10-25 Denso Corp Cooling apparatus using boiling and condensing refrigerant
JP2001227886A (ja) 2000-02-17 2001-08-24 Ts Heatronics Co Ltd ヒートシンク
JP2002151636A (ja) 2000-11-10 2002-05-24 Ts Heatronics Co Ltd ヒートシンク
AU2002367182A1 (en) * 2001-12-27 2003-07-15 Showa Denko K.K. Ebullition cooling device for heat generating component
KR100505554B1 (ko) 2003-01-24 2005-08-03 아이큐리랩 홀딩스 리미티드 하이브리드형 냉각 장치
US20050205129A1 (en) 2004-03-11 2005-09-22 Kidde-Fenwal Inc. Method and apparatus for venting a pressure reservoir
US20070163754A1 (en) 2006-01-19 2007-07-19 Dionne, Marien & Associes Inc. Thermosiphon having improved efficiency
TWM317745U (en) * 2007-02-13 2007-08-21 Bothhand Entpr Inc Improved structure of heat sink
US7957132B2 (en) * 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
EP2031332B1 (en) 2007-08-27 2010-09-15 ABB Research LTD Heat exchanger for power-electronics components
DE102008000415B4 (de) 2008-02-26 2011-06-01 Günther, Eberhard, Dipl.-Ing. Anordnung zum Abführen von Wärme von elektrischen Bauteilen
JP2010133686A (ja) 2008-12-08 2010-06-17 Mitsubishi Materials Corp ヒートパイプ及び冷却器
ATE554361T1 (de) 2009-04-28 2012-05-15 Abb Research Ltd Wärmerohr mit gewundenem rohr
EP2327947B1 (en) 2009-11-30 2012-02-22 ABB Research Ltd Heat exchanger
US20120186787A1 (en) * 2011-01-25 2012-07-26 Khanh Dinh Heat pipe system having common vapor rail
US20120267088A1 (en) * 2011-04-21 2012-10-25 Cooling House Co., Ltd. Multi-channel flat-tube serpentine heat exchanger and heat exchange apparatus
US9869519B2 (en) 2012-07-12 2018-01-16 Google Inc. Thermosiphon systems for electronic devices
CN102997728A (zh) 2013-01-05 2013-03-27 北京德能恒信科技有限公司 一种多级分体式热管

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55155189A (en) * 1979-05-18 1980-12-03 Babcock Hitachi Kk Heat exchanger with inclined header
JPH03283454A (ja) * 1990-03-30 1991-12-13 Toshiba Corp 半導体冷却装置
JPH09133482A (ja) * 1995-11-09 1997-05-20 Showa Alum Corp 放熱器
JPH09264677A (ja) * 1996-03-29 1997-10-07 Denso Corp 沸騰冷却器、その沸騰冷却器を備えた熱交換装置、およびその熱交換装置を備えた沸騰冷却装置
JPH11294981A (ja) * 1998-04-10 1999-10-29 Diamond Electric Mfg Co Ltd ヒートパイプの加工方法
JP2007192474A (ja) * 2006-01-19 2007-08-02 Calsonic Kansei Corp 熱交換器
WO2010072221A2 (en) * 2008-12-23 2010-07-01 Noise Limit Aps Cooling device with bended flat tube and related manufacturing method
JP2013098568A (ja) * 2011-10-31 2013-05-20 Abb Technology Ag 熱サイフォン冷却器の配置を有するモジュールを備えたキャビネット

Also Published As

Publication number Publication date
EP3194875A2 (en) 2017-07-26
US10655920B2 (en) 2020-05-19
WO2016044052A8 (en) 2016-06-09
CN106461347A (zh) 2017-02-22
US20160076819A1 (en) 2016-03-17
WO2016044052A3 (en) 2016-08-04
EP3194875B1 (en) 2021-03-24
WO2016044052A2 (en) 2016-03-24
CN106461347B (zh) 2019-05-10

Similar Documents

Publication Publication Date Title
JP2017534826A (ja) 屈曲管部を備えたサーモサイホン
US9618244B2 (en) Power electronics cooling
US10054371B2 (en) Thermosiphon with integrated components
JP5850099B2 (ja) 流下液膜式蒸発器
WO2016036867A1 (en) Evaporator and condenser section structure for thermosiphon
JP6894520B2 (ja) 凝縮器
US10612856B2 (en) Heat exchanger and air conditioning system
US20160054074A1 (en) Cooling element
EP3374708B1 (en) Defrosting device
EP3286513B1 (en) Thermosiphon with multiport tube and flow arrangement
KR20170031556A (ko) 마이크로 채널 타입 열교환기
CN107076483B (zh) 制冷器具
WO2016177803A1 (en) A cooling device comprising a condenser cooled by a fan
US20110024083A1 (en) Heat exchanger
JP6860004B2 (ja) 冷却装置
CN111448436A (zh) 用于将主动冷却以低成本扩展到额外冷冻器内壁的独立辅助热虹吸管
JP2019113310A (ja) 一体構成要素を備えたサーモサイホン
JP4930472B2 (ja) 冷却装置
KR20110133672A (ko) 응축기

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180906

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180906

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190718

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190723

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191018

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200108

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20200729