JP6678576B2 - 環状オレフィン系樹脂組成物フィルム - Google Patents
環状オレフィン系樹脂組成物フィルム Download PDFInfo
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- JP6678576B2 JP6678576B2 JP2016513160A JP2016513160A JP6678576B2 JP 6678576 B2 JP6678576 B2 JP 6678576B2 JP 2016513160 A JP2016513160 A JP 2016513160A JP 2016513160 A JP2016513160 A JP 2016513160A JP 6678576 B2 JP6678576 B2 JP 6678576B2
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- Prior art keywords
- cyclic olefin
- styrene
- resin composition
- film
- composition film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims description 57
- 125000004122 cyclic group Chemical group 0.000 title claims description 38
- 229920005672 polyolefin resin Polymers 0.000 title claims description 37
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 158
- -1 cyclic olefin Chemical class 0.000 claims description 90
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 79
- 229920001971 elastomer Polymers 0.000 claims description 61
- 239000000806 elastomer Substances 0.000 claims description 60
- 229920005989 resin Polymers 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 45
- 239000010419 fine particle Substances 0.000 claims description 43
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 43
- 239000002245 particle Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 16
- 229920006132 styrene block copolymer Polymers 0.000 claims description 13
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 11
- 239000005977 Ethylene Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229920001400 block copolymer Polymers 0.000 claims description 9
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 7
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 claims description 7
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 5
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 4
- 150000001925 cycloalkenes Chemical class 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 30
- 238000000034 method Methods 0.000 description 20
- 238000012360 testing method Methods 0.000 description 14
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000012071 phase Substances 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- WLTSXAIICPDFKI-FNORWQNLSA-N (E)-3-dodecene Chemical compound CCCCCCCC\C=C\CC WLTSXAIICPDFKI-FNORWQNLSA-N 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000004711 α-olefin Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- WLTSXAIICPDFKI-UHFFFAOYSA-N 3-dodecene Chemical compound CCCCCCCCC=CCC WLTSXAIICPDFKI-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 229910052762 osmium Inorganic materials 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LCSLWNXVIDKVGD-KQQUZDAGSA-N (3e,7e)-deca-3,7-diene Chemical compound CC\C=C\CC\C=C\CC LCSLWNXVIDKVGD-KQQUZDAGSA-N 0.000 description 1
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 1
- OLGHJTHQWQKJQQ-UHFFFAOYSA-N 3-ethylhex-1-ene Chemical compound CCCC(CC)C=C OLGHJTHQWQKJQQ-UHFFFAOYSA-N 0.000 description 1
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- SUJVAMIXNUAJEY-UHFFFAOYSA-N 4,4-dimethylhex-1-ene Chemical compound CCC(C)(C)CC=C SUJVAMIXNUAJEY-UHFFFAOYSA-N 0.000 description 1
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 description 1
- OPMUAJRVOWSBTP-UHFFFAOYSA-N 4-ethyl-1-hexene Chemical compound CCC(CC)CC=C OPMUAJRVOWSBTP-UHFFFAOYSA-N 0.000 description 1
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 1
- YRIYXMAKROEVBQ-UHFFFAOYSA-N 5,5-dimethylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C)(C)CC1C=C2 YRIYXMAKROEVBQ-UHFFFAOYSA-N 0.000 description 1
- JGLIHSMBVDZMSA-UHFFFAOYSA-N 5-(cyclohexen-1-yl)bicyclo[2.2.1]hept-2-ene Chemical compound C1=CC2CC1CC2C1=CCCCC1 JGLIHSMBVDZMSA-UHFFFAOYSA-N 0.000 description 1
- YSWATWCBYRBYBO-UHFFFAOYSA-N 5-butylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCC)CC1C=C2 YSWATWCBYRBYBO-UHFFFAOYSA-N 0.000 description 1
- DGBJYYFKBCUCNY-UHFFFAOYSA-N 5-cyclopentylbicyclo[2.2.1]hept-2-ene Chemical compound C1CCCC1C1C(C=C2)CC2C1 DGBJYYFKBCUCNY-UHFFFAOYSA-N 0.000 description 1
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
- WMWDGZLDLRCDRG-UHFFFAOYSA-N 5-hexylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCCCC)CC1C=C2 WMWDGZLDLRCDRG-UHFFFAOYSA-N 0.000 description 1
- PCBPVYHMZBWMAZ-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C)CC1C=C2 PCBPVYHMZBWMAZ-UHFFFAOYSA-N 0.000 description 1
- WTQBISBWKRKLIJ-UHFFFAOYSA-N 5-methylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C)CC1C=C2 WTQBISBWKRKLIJ-UHFFFAOYSA-N 0.000 description 1
- MDLZXSCRAIESJZ-UHFFFAOYSA-N 5-octadecylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCCCCCCCCCCCCCCCC)CC1C=C2 MDLZXSCRAIESJZ-UHFFFAOYSA-N 0.000 description 1
- GOLQZWYZZWIBCA-UHFFFAOYSA-N 5-octylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCCCCCC)CC1C=C2 GOLQZWYZZWIBCA-UHFFFAOYSA-N 0.000 description 1
- CJQNJRMLJAAXOS-UHFFFAOYSA-N 5-prop-1-enylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=CC)CC1C=C2 CJQNJRMLJAAXOS-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920001967 Metal rubber Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XBJOBWPPZLJOLG-UHFFFAOYSA-N [O-2].[Mg+2].[O-2].[In+3].[O-2].[Zn+2] Chemical compound [O-2].[Mg+2].[O-2].[In+3].[O-2].[Zn+2] XBJOBWPPZLJOLG-UHFFFAOYSA-N 0.000 description 1
- AZWHFTKIBIQKCA-UHFFFAOYSA-N [Sn+2]=O.[O-2].[In+3] Chemical compound [Sn+2]=O.[O-2].[In+3] AZWHFTKIBIQKCA-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
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- 238000004458 analytical method Methods 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- GVRWIAHBVAYKIZ-UHFFFAOYSA-N dec-3-ene Chemical compound CCCCCCC=CCC GVRWIAHBVAYKIZ-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
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- 229910003472 fullerene Inorganic materials 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Description
1.環状オレフィン系樹脂組成物フィルム
2.環状オレフィン系樹脂組成物フィルムの製造方法
3.電子機器への適用例
4.実施例
本実施の形態に係る環状オレフィン系樹脂組成物フィルムは、環状オレフィン系樹脂と、スチレン系エラストマーと、平均粒径が40nm以下である無機酸化物微粒子とを含有し、線熱膨張係数が、40ppm/℃以上60ppm/℃以下である。
α=ΔL/L0×(T2−T1)
(式中、α:線膨張率、ΔL:(T2での試験片の長さ)−(T1での試験片の長さ)、L0:T1での試験片の長さである。)
環状オレフィン系樹脂は、主鎖が炭素−炭素結合からなり、主鎖の少なくとも一部に環状炭化水素構造を有する高分子化合物である。この環状炭化水素構造は、ノルボルネンやテトラシクロドデセンに代表されるような、環状炭化水素構造中に少なくとも一つのオレフィン性二重結合を有する化合物(環状オレフィン)を単量体として用いることで導入される。
スチレン系エラストマーは、スチレンとブタジエンもしくはイソプレン等の共役ジエンの共重合体、及び/又は、その水素添加物である。スチレン系エラストマーは、スチレンをハードセグメント、共役ジエンをソフトセグメントとしたブロック共重合体である。ソフトセグメントの構造が、スチレン系エラストマーの貯蔵弾性率を変化させ、ハードセグメントであるスチレンの含有率が、屈折率を変化させ、フィルム全体のヘイズを変化させる。スチレン系エラストマーは、加硫工程が不用であり、好適に用いられる。また、水素添加をしたものの方が、熱安定性が高く、さらに好適である。
無機酸化物微粒子としては、Al2O3、SiO2、ZrO2、TiO2から選択される1種以上であることが好ましい。これらの無機酸化物微粒子は、線熱膨張係数が小さいため、添加により環状オレフィン系樹脂組成物フィルムの線熱膨張係数を低下させることができる。
環状オレフィン系樹脂組成物には、環状オレフィン系樹脂、スチレン系エラストマー、及び無機酸化物微粒子の他に、その特性を損なわない範囲で、必要に応じて各種配合剤が添加されていてもよい。各種配合剤としては、熱可塑性樹脂材料で通常用いられているものであれば格別な制限はなく、例えば、酸化防止剤、紫外線吸収剤、光安定剤、可塑剤、滑剤、帯電防止剤、難燃剤、染料や顔料などの着色剤、近赤外線吸収剤、蛍光増白剤などの配合剤、充填剤等が挙げられる。
本実施の形態に係る環状オレフィン系樹脂組成物フィルムの製造方法は、環状オレフィン系樹脂と、スチレン系エラストマーと、無機酸化物微粒子とを加熱溶融し、加熱溶融された環状オレフィン系樹脂組成物を押出法により、フィルム状に押し出し、線熱膨張係数が、40ppm/℃以上60ppm/℃以下である環状オレフィン系樹脂組成物フィルムを得る。環状オレフィン系樹脂組成物フィルムは、無延伸のものでも、一軸延伸のものでも、二軸延伸のものでもよい。
本実施の形態に係る環状オレフィン系樹脂組成物フィルムは、各種光学用途、例えば位相差フィルム、偏光板保護フィルム、光拡散板等、特にプリズムシート、液晶セル基板への用途に用いることができる。以下では、環状オレフィン系樹脂組成物フィルムを位相差フィルムとして用いた適用例について説明する。
以下、本発明の実施例について詳細に説明する。本実施例では、環状オレフィン系樹脂に、スチレン系エラストマー及び無機微粒子を添加し、環状オレフィン系樹脂組成物フィルムを作成した。そして、線熱膨張係数、引張弾性率、引裂き強度、及び初期ヘイズについて評価した。なお、本発明はこれらの実施例に限定されるものではない。
熱機械分析装置(TMA:Thermomechanical Analysis、NETZSCH Japan製 TMA4100SA)を使用し、JISK7197に準拠して線熱膨張係数を算出した。厚み0.2〜0.3mmのフィルムから4×10mmの試験片を作製し、試験片の温度0℃〜200℃における平均の線熱膨張率(ppm/℃)を昇温速度2℃/minにて算出した。線熱膨張係数は、MD方向及びTD方向の平均値とした。
JIS K−7113に準じて2号形試験片とし、常温(23℃)にて、引張速度50mm/分で測定した。引張弾性率は、MD方向及びTD方向の平均値を十の位で四捨五入した値とした。
厚み80μmのフィルムをJISK7128に従い測定した。試験片として3号形試験片を用い、引張試験機(AG−X、島津製作所(株)製)を用いて試験速度200mm/分で測定した。
厚み80μmのフィルムについて、ヘイズメーター(HM150、(株)村上色彩技術研究所製)を使用して初期ヘイズを測定した。初期ヘイズが1.0%未満のものを「A」と評価し、初期ヘイズが1.0%以上5.0%未満のものを「B」と評価し、初期ヘイズが5.0%以上のものを「C」と評価した。
環状オレフィン系樹脂としては、TOPAS6013−S04(ポリプラスチック(株)製、エチレンとノルボルネンの付加共重合体)を使用した。
タフテックH1041:旭化成ケミカルズ(株)製、スチレン/エチレン/ブチレン/スチレンブロック共重合体、スチレン含有率20mol%
タフテックH1052X:旭化成ケミカルズ(株)製、スチレン/エチレン/ブチレン/スチレンブロック共重合体、スチレン含有率12mol%
タフテックH1062:旭化成ケミカルズ(株)製、スチレン/エチレン/ブチレン/スチレンブロック共重合体、スチレン含有率11mol%
S.O.E.L606:旭化成ケミカルズ(株)製、水素添加スチレン/ブタジエンブロック共重合体、スチレン含有率36mol%
S.O.E.L609:旭化成ケミカルズ(株)製、水素添加スチレン/ブタジエンブロック共重合体、スチレン含有率40mol%
Al2O3(酸化アルミニウム(γ型)):線熱膨張係数7.2ppm/℃、平均粒径5nm、IoLiTec社製
SiO2(二酸化ケイ素):線熱膨張係数0.7ppm/℃、平均粒径15nm、IoLiTec社製
ZrO2(酸化ジルコニウム):線熱膨張係数10.5ppm/℃、平均粒径40nm、IoLiTec社製
TiO2(酸化チタン):線熱膨張係数7.1ppm/℃、平均粒径20nm、石原産業社製
環状オレフィン系樹脂を80vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径5nmのAl2O3を10vol%配合し、これを先端にTダイを取り付けた二軸押出機(仕様:直径25mm、長さ:26D、Tダイ幅:160mm)を用いて210℃〜300℃の温度範囲の所定温度で混練した後、環状オレフィン系樹脂組成物を、250g/minの速さで押し出し、厚さが80μmのフィルムをロールに巻きとった。
環状オレフィン系樹脂を70vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径5nmのAl2O3を20vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を80vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径15nmのSiO2を10vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を70vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径15nmのSiO2を20vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を70vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径40nmのZrO2を20vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を70vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径20nmのTiO2を20vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を80vol%、スチレン系エラストマーとしてタフテックH1052Xを10vol%、及び無機酸化物微粒子として平均粒径5nmのAl2O3を10vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を80vol%、スチレン系エラストマーとしてタフテックH1062を10vol%、及び無機酸化物微粒子として平均粒径5nmのAl2O3を10vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を80vol%、スチレン系エラストマーとしてS.O.E.L606を10vol%、及び無機酸化物微粒子として平均粒径5nmのAl2O3を10vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を80vol%、スチレン系エラストマーとしてS.O.E.L609を10vol%、及び無機酸化物微粒子として平均粒径5nmのAl2O3を10vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を100vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を90vol%、及びスチレン系エラストマーとしてタフテックH1041を10vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を60vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径5nmのAl2O3を30vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を60vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径15nmのSiO2を30vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
環状オレフィン系樹脂を60vol%、スチレン系エラストマーとしてタフテックH1041を10vol%、及び無機酸化物微粒子として平均粒径100nmのSiO2を20vol%配合した以外は、実施例1と同様にして、厚さが80μmのフィルムを作製した。
次に、熱膨張係数を低下させた技術的意義を確認するために、“たわみ”に関する実験を行なった。ここでは、図11に示すように、80μm厚みの環状オレフィン系樹脂組成物フィルム160と、光学基材として多用される100μm厚みのPET(ポリエチレンテレフタレート、線熱膨張係数20ppm/℃)フィルム170とを接着剤層を介して積層した試験片を使用した。そして、試験片の片側を治具180にて挟み、試験片を治具から水平方向に30mm突き出した状態で、105℃の温度雰囲気下に10分間放置した後、たわみ量を測定した。なお、試験片の自重の影響を無視できるものとして、PETフィルム170を下側に配置した。
Claims (11)
- 環状オレフィン系樹脂と、スチレン系エラストマーと、平均粒径が40nm以下である無機酸化物微粒子とを含有し、
線熱膨張係数が、40ppm/℃以上60ppm/℃以下であり、
引張弾性率が、1500MPa以上2000MPa以下である環状オレフィン系樹脂組成物フィルム。 - MD方向及びTD方向の引裂き強度の差が、10N/mm未満である請求項1記載の環状オレフィン系樹脂組成物フィルム。
- 前記スチレン系エラストマーのスチレン含有率が、20mol%以上である請求項1又は2記載の環状オレフィン系樹脂組成物フィルム。
- 前記無機酸化物微粒子の平均粒径が、15nm以下である請求項1乃至3のいずれか1項に記載の環状オレフィン系樹脂組成物フィルム。
- 前記環状オレフィン系樹脂が、エチレンとノルボルネンの付加共重合体である請求項1乃至4のいずれか1項に記載の環状オレフィン系樹脂組成物フィルム。
- 前記スチレン系エラストマーが、スチレン/エチレン/ブチレン/スチレンブロック共重合体、スチレン/エチレン/プロピレン/スチレンブロック共重合体、水素添加スチレン/ブタジエンブロック共重合体からなる群より選ばれる1種以上である請求項1乃至5のいずれか1項に記載の環状オレフィン系樹脂組成物フィルム。
- 前記請求項1乃至6のいずれか1項に記載の環状オレフィン系樹脂組成物フィルムを基材として備える透明導電性素子。
- 前記請求項1乃至6のいずれか1項に記載の環状オレフィン系樹脂組成物フィルムを備える入力装置。
- 前記請求項1乃至6のいずれか1項に記載の環状オレフィン系樹脂組成物フィルムを備える表示装置。
- 前記請求項1乃至6のいずれか1項に記載の環状オレフィン系樹脂組成物フィルムを備える電子機器。
- 環状オレフィン系樹脂と、スチレン系エラストマーと、平均粒径が40nm以下である無機酸化物微粒子とを加熱溶融し、
前記加熱溶融された環状オレフィン系樹脂組成物を押出法により、フィルム状に押し出し、線熱膨張係数が、40ppm/℃以上60ppm/℃以下であり、引張弾性率が、1500MPa以上2000MPa以下である環状オレフィン系樹脂組成物フィルムを得る環状オレフィン系樹脂組成物フィルムの製造方法。
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