JP6678094B2 - 温度計測回路、方法、及びマイクロコンピュータユニット - Google Patents

温度計測回路、方法、及びマイクロコンピュータユニット Download PDF

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JP6678094B2
JP6678094B2 JP2016235730A JP2016235730A JP6678094B2 JP 6678094 B2 JP6678094 B2 JP 6678094B2 JP 2016235730 A JP2016235730 A JP 2016235730A JP 2016235730 A JP2016235730 A JP 2016235730A JP 6678094 B2 JP6678094 B2 JP 6678094B2
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temperature
temperature sensor
value
digital
circuit
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JP2018091741A (ja
JP2018091741A5 (enExample
Inventor
熊原　千明
千明 熊原
哲弘 小山
哲弘 小山
政明 平野
政明 平野
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Renesas Electronics Corp
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Renesas Electronics Corp
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Priority to JP2016235730A priority Critical patent/JP6678094B2/ja
Priority to US15/795,112 priority patent/US10670478B2/en
Priority to CN201711096414.9A priority patent/CN108151901B/zh
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Publication of JP2018091741A5 publication Critical patent/JP2018091741A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/007—Testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2016235730A 2016-12-05 2016-12-05 温度計測回路、方法、及びマイクロコンピュータユニット Active JP6678094B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016235730A JP6678094B2 (ja) 2016-12-05 2016-12-05 温度計測回路、方法、及びマイクロコンピュータユニット
US15/795,112 US10670478B2 (en) 2016-12-05 2017-10-26 Temperature measurement circuit and method, and microcomputer unit
CN201711096414.9A CN108151901B (zh) 2016-12-05 2017-11-09 温度测量电路和方法以及微型计算机单元

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JP2016235730A JP6678094B2 (ja) 2016-12-05 2016-12-05 温度計測回路、方法、及びマイクロコンピュータユニット

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JP2018091741A JP2018091741A (ja) 2018-06-14
JP2018091741A5 JP2018091741A5 (enExample) 2019-06-06
JP6678094B2 true JP6678094B2 (ja) 2020-04-08

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US (1) US10670478B2 (enExample)
JP (1) JP6678094B2 (enExample)
CN (1) CN108151901B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6598592B2 (ja) * 2015-08-28 2019-10-30 ルネサスエレクトロニクス株式会社 半導体集積回路および電子制御ユニット
JP7055084B2 (ja) * 2018-09-20 2022-04-15 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の制御方法
US10664027B2 (en) 2018-10-09 2020-05-26 Intel Corporation Methods, systems and apparatus for dynamic temperature aware functional safety
JP7134160B2 (ja) * 2019-12-18 2022-09-09 本田技研工業株式会社 ガス制御装置及びガス制御方法
GB201919297D0 (en) * 2019-12-24 2020-02-05 Aronson Bill Temperature sensing physical unclonable function (puf) authenication system
KR102804069B1 (ko) 2019-12-27 2025-05-09 삼성전자주식회사 빌트-인 셀프 테스트 회로 및 이를 포함하는 온도 측정 회로
CN111787428B (zh) * 2020-06-24 2022-03-08 Oppo广东移动通信有限公司 用户终端设备
WO2023022022A1 (ja) * 2021-08-16 2023-02-23 ローム株式会社 半導体装置、車載装置
US20230366754A1 (en) * 2022-05-11 2023-11-16 Cirrus Logic International Semiconductor Ltd. Single-point temperature calibration of resistance-based temperature measurements
EP4296639B1 (en) * 2022-06-20 2025-01-29 Carrier Corporation Temperature sensor testing
CN115183899B (zh) * 2022-08-24 2025-08-08 威海威高瑞影医疗科技有限公司 一种体温检测方法、装置、介质及体温检测仪
CN117824870A (zh) * 2022-09-27 2024-04-05 华为技术有限公司 检测电路及其控制方法、车载终端设备
CN118706292B (zh) * 2024-08-30 2025-01-21 中国计量大学 基于柔性温度传感器的动力系统温度原位校准装置及方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111381B2 (ja) 1987-08-11 1995-11-29 アンリツ株式会社 ディジタル温度計
JP2652961B2 (ja) * 1989-03-28 1997-09-10 日本電気株式会社 電子部品の保護機構
JP2975259B2 (ja) * 1994-05-27 1999-11-10 核燃料サイクル開発機構 原子炉燃料の破損検出法
JPH11118619A (ja) * 1997-10-08 1999-04-30 Koito Ind Ltd サーミスタ故障検出方法
US6695475B2 (en) * 2001-05-31 2004-02-24 Stmicroelectronics, Inc. Temperature sensing circuit and method
US6853259B2 (en) * 2001-08-15 2005-02-08 Gallitzin Allegheny Llc Ring oscillator dynamic adjustments for auto calibration
US7044633B2 (en) * 2003-01-09 2006-05-16 International Business Machines Corporation Method to calibrate a chip with multiple temperature sensitive ring oscillators by calibrating only TSRO
US7168853B2 (en) * 2003-01-10 2007-01-30 International Business Machines Corporation Digital measuring system and method for integrated circuit chip operating parameters
KR100518565B1 (ko) * 2003-04-04 2005-10-04 삼성전자주식회사 반도체 온도 검출기, 이를 구비하여 셀프 리프레쉬 전류를감소시키는 반도체 메모리 장치, 및 그 셀프 리프레쉬 방법
JP4082326B2 (ja) * 2003-10-02 2008-04-30 住友電気工業株式会社 被加熱物品の表面温度測定方法、これを用いた加熱方法、及び光ファイバプリフォームの製造方法
KR100668739B1 (ko) * 2004-04-13 2007-01-26 주식회사 하이닉스반도체 오실레이터 회로
US7180380B2 (en) * 2005-04-20 2007-02-20 Advanced Micro Devices, Inc. Zoned thermal monitoring
CN101216356A (zh) * 2007-01-04 2008-07-09 海尔集团公司 一种温度传感器的故障检测方法及装置
CN102025368A (zh) * 2009-09-19 2011-04-20 无锡爱睿芯电子有限公司 温度感应振荡器和其生产方法、以及温度频率校正系统
JP2012108087A (ja) * 2010-10-28 2012-06-07 Seiko Instruments Inc 温度検知装置
GB201102070D0 (en) * 2011-02-07 2011-03-23 Nordic Semiconductor Asa Semiconductor temperature sensors
JP5738141B2 (ja) * 2011-09-20 2015-06-17 ルネサスエレクトロニクス株式会社 半導体装置及び温度センサシステム
CN202442811U (zh) * 2011-12-21 2012-09-19 无锡华润矽科微电子有限公司 电子温度测量电路结构
KR101885857B1 (ko) * 2012-01-04 2018-08-06 삼성전자주식회사 온도 관리 회로, 이를 포함하는 시스템 온 칩 및 온도 관리 방법
JP2013178118A (ja) * 2012-02-28 2013-09-09 Honda Motor Co Ltd 温度検出器
JP2014098614A (ja) * 2012-11-14 2014-05-29 Renesas Electronics Corp 温度センサおよび半導体装置
US9658118B2 (en) * 2012-11-16 2017-05-23 Linear Technology Corporation Precision temperature measurement devices, sensors, and methods
JP6186646B2 (ja) * 2013-03-29 2017-08-30 株式会社ケーヒン 電圧検出装置
CN105486422A (zh) * 2014-09-16 2016-04-13 哈尔滨恒誉名翔科技有限公司 基于msp430f149高精度测温装置及其测量方法
CN204115913U (zh) * 2014-09-19 2015-01-21 国家电网公司 一种智能型铂电阻温度测量校验仪
CN104596662B (zh) * 2014-12-08 2017-06-13 深圳市芯海科技有限公司 优化线性度的片上数字温度传感器
CN105628243B (zh) * 2015-12-30 2018-04-20 清华大学深圳研究生院 一种电阻型温度传感芯片
EP3340467B1 (en) * 2016-12-22 2022-10-05 NXP USA, Inc. Digitally controlled oscillator with temperature compensation
KR102749169B1 (ko) * 2017-01-10 2025-01-06 삼성전자주식회사 온도 보상 발진 제어기 및 그것을 포함하는 온도 보상 수정 발진기

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Publication number Publication date
US10670478B2 (en) 2020-06-02
JP2018091741A (ja) 2018-06-14
CN108151901B (zh) 2021-10-29
CN108151901A (zh) 2018-06-12
US20180156675A1 (en) 2018-06-07

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