JP6659857B2 - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置 Download PDF

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Publication number
JP6659857B2
JP6659857B2 JP2018538461A JP2018538461A JP6659857B2 JP 6659857 B2 JP6659857 B2 JP 6659857B2 JP 2018538461 A JP2018538461 A JP 2018538461A JP 2018538461 A JP2018538461 A JP 2018538461A JP 6659857 B2 JP6659857 B2 JP 6659857B2
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JP
Japan
Prior art keywords
pressing
displacement
load
motor
wire bonding
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JP2018538461A
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English (en)
Japanese (ja)
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JPWO2018047896A1 (ja
Inventor
塩澤　茂
茂 塩澤
憲太郎 小宮
憲太郎 小宮
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Shinkawa Ltd
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Shinkawa Ltd
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Publication date
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Publication of JPWO2018047896A1 publication Critical patent/JPWO2018047896A1/ja
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Publication of JP6659857B2 publication Critical patent/JP6659857B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78743—Suction holding means
    • H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP2018538461A 2016-09-07 2017-09-07 ワイヤボンディング装置 Active JP6659857B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016174325 2016-09-07
JP2016174325 2016-09-07
PCT/JP2017/032224 WO2018047896A1 (ja) 2016-09-07 2017-09-07 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPWO2018047896A1 JPWO2018047896A1 (ja) 2019-06-24
JP6659857B2 true JP6659857B2 (ja) 2020-03-04

Family

ID=61562194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018538461A Active JP6659857B2 (ja) 2016-09-07 2017-09-07 ワイヤボンディング装置

Country Status (5)

Country Link
JP (1) JP6659857B2 (zh)
KR (1) KR102206867B1 (zh)
CN (1) CN109923652B (zh)
TW (1) TWI663494B (zh)
WO (1) WO2018047896A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220007247A (ko) * 2020-07-10 2022-01-18 삼성전자주식회사 와이어 본딩 장치
US12087725B2 (en) * 2020-09-04 2024-09-10 Shinkawa Ltd. Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatus
WO2022176182A1 (ja) * 2021-02-22 2022-08-25 株式会社新川 ワイヤボンディング装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5176310A (en) * 1988-11-28 1993-01-05 Hitachi, Ltd. Method and apparatus for wire bond
JPH1027818A (ja) * 1996-07-10 1998-01-27 Toshiba Mechatronics Kk ボンディング装置におけるボンディング荷重検出装置
US6112972A (en) * 1996-12-19 2000-09-05 Texas Instruments Incorporated Wire bonding with capillary realignment
JP3370551B2 (ja) * 1997-04-02 2003-01-27 株式会社新川 ワイヤボンディング装置及びそのボンディング荷重補正方法
JPH11265907A (ja) * 1998-03-17 1999-09-28 Kyushu Electronics System:Kk アルミワイヤボンディング装置及び方法
JP2957557B1 (ja) * 1998-05-27 1999-10-04 株式会社カイジョー ボンディング装置のボンディングツール支持機構およびボンディングツールの上下動制御方法
JP2000114308A (ja) * 1998-10-09 2000-04-21 Kaijo Corp ワイヤボンディング装置
JP2000114305A (ja) * 1998-10-09 2000-04-21 Kaijo Corp ワイヤボンディング装置
KR100896828B1 (ko) * 2001-10-26 2009-05-12 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 와이어 본더를 보정하는 방법
JP3817207B2 (ja) * 2002-08-21 2006-09-06 Ｔｄｋ株式会社 実装処理装置及び該実装処理装置の制御装置
US7549569B2 (en) * 2006-06-29 2009-06-23 Asm Technology Singapore Pte Ltd. Wire clamp gap control mechanism and method
JP4314313B1 (ja) * 2008-06-30 2009-08-12 株式会社新川 ボンディング装置
JP4275724B1 (ja) * 2008-07-16 2009-06-10 株式会社新川 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置
JP5972153B2 (ja) * 2012-11-21 2016-08-17 新日本無線株式会社 ワイヤボンディング装置
TWI587416B (zh) * 2013-01-25 2017-06-11 先進科技新加坡有限公司 導線鍵合機和校準導線鍵合機的方法

Also Published As

Publication number Publication date
WO2018047896A1 (ja) 2018-03-15
TWI663494B (zh) 2019-06-21
CN109923652B (zh) 2023-04-18
KR20190046943A (ko) 2019-05-07
JPWO2018047896A1 (ja) 2019-06-24
TW201812493A (zh) 2018-04-01
CN109923652A (zh) 2019-06-21
KR102206867B1 (ko) 2021-01-25

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