JP5972153B2 - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置 Download PDFInfo
- Publication number
- JP5972153B2 JP5972153B2 JP2012254909A JP2012254909A JP5972153B2 JP 5972153 B2 JP5972153 B2 JP 5972153B2 JP 2012254909 A JP2012254909 A JP 2012254909A JP 2012254909 A JP2012254909 A JP 2012254909A JP 5972153 B2 JP5972153 B2 JP 5972153B2
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- heat block
- load
- main body
- measuring unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
Landscapes
- Wire Bonding (AREA)
Description
12…ヒートブロック、
13a〜13c…コネクタ、
15…半導体素子、 16…基板、
18…キャピラリ、 19…アーム、
20…荷重測定部、 21…歪みゲージ部。
Claims (1)
- ヒートブロック上の被ボンディング物にワイヤボンディングを施すワイヤボンディング装置において、
上記ヒートブロックを装置本体に対し着脱自在にすると共に、
このヒートブロックと略同一の形状及び大きさの本体を有し、その本体の上面に歪みゲージ部を取り付けた荷重測定部を設け、
上記装置本体のヒートブロックの取外し位置に、上記歪みゲージを有する荷重測定部を着脱自在に配置可能とし、
この荷重測定部からの出力に基づいて被ボンディング物に掛かる荷重を較正することを特徴とするワイヤボンディング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012254909A JP5972153B2 (ja) | 2012-11-21 | 2012-11-21 | ワイヤボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012254909A JP5972153B2 (ja) | 2012-11-21 | 2012-11-21 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014103286A JP2014103286A (ja) | 2014-06-05 |
JP5972153B2 true JP5972153B2 (ja) | 2016-08-17 |
Family
ID=51025528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012254909A Active JP5972153B2 (ja) | 2012-11-21 | 2012-11-21 | ワイヤボンディング装置 |
Country Status (1)
Country | Link |
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JP (1) | JP5972153B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6659857B2 (ja) * | 2016-09-07 | 2020-03-04 | 株式会社新川 | ワイヤボンディング装置 |
KR102420205B1 (ko) * | 2018-02-06 | 2022-07-13 | 가부시키가이샤 신가와 | 와이어 본딩 장치 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0128255Y1 (ko) * | 1991-12-23 | 1998-12-01 | 문정환 | 와이어 본더의 멀티 히터 블럭 |
JPH1041330A (ja) * | 1996-07-22 | 1998-02-13 | Sony Corp | ワイヤボンデイング方法 |
JP2002151542A (ja) * | 2000-11-14 | 2002-05-24 | Mitsubishi Electric Corp | 半導体パッケージの製造方法および半導体パッケージ製造装置 |
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2012
- 2012-11-21 JP JP2012254909A patent/JP5972153B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2014103286A (ja) | 2014-06-05 |
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