JP6650076B1 - アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 - Google Patents

アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 Download PDF

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Publication number
JP6650076B1
JP6650076B1 JP2019548351A JP2019548351A JP6650076B1 JP 6650076 B1 JP6650076 B1 JP 6650076B1 JP 2019548351 A JP2019548351 A JP 2019548351A JP 2019548351 A JP2019548351 A JP 2019548351A JP 6650076 B1 JP6650076 B1 JP 6650076B1
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Japan
Prior art keywords
alkali
group
photosensitive resin
resin composition
mass
Prior art date
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JP2019548351A
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English (en)
Japanese (ja)
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JPWO2019187904A1 (ja
Inventor
沙和子 嶋田
沙和子 嶋田
岡田　和也
和也 岡田
知哉 工藤
知哉 工藤
千穂 植田
千穂 植田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Ink Manufacturing Co Ltd
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Taiyo Ink Manufacturing Co Ltd
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Publication of JPWO2019187904A1 publication Critical patent/JPWO2019187904A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
JP2019548351A 2018-03-30 2019-02-26 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 Active JP6650076B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018069174 2018-03-30
JP2018069174 2018-03-30
PCT/JP2019/007358 WO2019187904A1 (ja) 2018-03-30 2019-02-26 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Publications (2)

Publication Number Publication Date
JP6650076B1 true JP6650076B1 (ja) 2020-02-19
JPWO2019187904A1 JPWO2019187904A1 (ja) 2020-04-30

Family

ID=68061249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019548351A Active JP6650076B1 (ja) 2018-03-30 2019-02-26 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Country Status (5)

Country Link
JP (1) JP6650076B1 (zh)
KR (1) KR20200137946A (zh)
CN (1) CN110753881B (zh)
TW (1) TWI770369B (zh)
WO (1) WO2019187904A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673003A (ja) * 1992-08-28 1994-03-15 Toshiba Corp ビスマレイミド化合物及び感光性樹脂組成物
JP2011042711A (ja) * 2009-08-19 2011-03-03 Taiyo Holdings Co Ltd 光硬化性樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003131375A (ja) * 2001-10-25 2003-05-09 Hitachi Ltd パターン状絶縁膜形成方法
JP5045064B2 (ja) * 2006-11-02 2012-10-10 Ｊｎｃ株式会社 アルカリ可溶性重合体及びそれを用いたポジ型感光性樹脂組成物
JP5263603B2 (ja) * 2009-01-09 2013-08-14 日立化成株式会社 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法及びそれを用いた永久レジスト。
US20130309489A1 (en) * 2011-02-01 2013-11-21 Dic Corporation Thermosetting resin composition, cured product of the same, and interlaminar adhesive film used for printed wiring board
CN106922088A (zh) * 2011-10-11 2017-07-04 日立化成株式会社 具有导体电路的结构体及其制造方法以及热固化性树脂组合物
CN104334604A (zh) * 2012-05-17 2015-02-04 太阳油墨制造株式会社 碱显影型的热固化性树脂组合物、印刷电路板
JP6317253B2 (ja) * 2012-05-17 2018-04-25 太陽インキ製造株式会社 液状現像型のマレイミド組成物、プリント配線板
JP6363861B2 (ja) * 2014-03-31 2018-07-25 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化被膜を有するプリント配線板
JP2015196764A (ja) * 2014-04-01 2015-11-09 太陽インキ製造株式会社 硬化性樹脂組成物、永久被膜形成用組成物、ドライフィルムおよびプリント配線板
KR102641274B1 (ko) * 2016-01-13 2024-02-29 다이요 홀딩스 가부시키가이샤 드라이 필름 및 프린트 배선판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673003A (ja) * 1992-08-28 1994-03-15 Toshiba Corp ビスマレイミド化合物及び感光性樹脂組成物
JP2011042711A (ja) * 2009-08-19 2011-03-03 Taiyo Holdings Co Ltd 光硬化性樹脂組成物

Also Published As

Publication number Publication date
JPWO2019187904A1 (ja) 2020-04-30
CN110753881B (zh) 2024-06-21
TWI770369B (zh) 2022-07-11
CN110753881A (zh) 2020-02-04
WO2019187904A1 (ja) 2019-10-03
TW201942171A (zh) 2019-11-01
KR20200137946A (ko) 2020-12-09

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