KR20200137946A - 알칼리 현상형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 - Google Patents
알칼리 현상형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 Download PDFInfo
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- KR20200137946A KR20200137946A KR1020197038591A KR20197038591A KR20200137946A KR 20200137946 A KR20200137946 A KR 20200137946A KR 1020197038591 A KR1020197038591 A KR 1020197038591A KR 20197038591 A KR20197038591 A KR 20197038591A KR 20200137946 A KR20200137946 A KR 20200137946A
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- photosensitive resin
- alkali developing
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- 239000011342 resin composition Substances 0.000 title claims abstract description 65
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- 239000011347 resin Substances 0.000 claims abstract description 97
- -1 maleimide compound Chemical class 0.000 claims abstract description 90
- 239000003513 alkali Substances 0.000 claims abstract description 58
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 49
- 239000000945 filler Substances 0.000 claims abstract description 39
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- 235000010290 biphenyl Nutrition 0.000 claims abstract description 12
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- 239000000049 pigment Substances 0.000 description 21
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- 239000000243 solution Substances 0.000 description 15
- 239000003054 catalyst Substances 0.000 description 14
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- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 12
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- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
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- 150000008065 acid anhydrides Chemical class 0.000 description 5
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 5
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
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- 125000003118 aryl group Chemical group 0.000 description 5
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- 125000005442 diisocyanate group Chemical group 0.000 description 5
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- 238000013007 heat curing Methods 0.000 description 5
- NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 description 5
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
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- MYONAGGJKCJOBT-UHFFFAOYSA-N benzimidazol-2-one Chemical compound C1=CC=CC2=NC(=O)N=C21 MYONAGGJKCJOBT-UHFFFAOYSA-N 0.000 description 4
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
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- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
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- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018069174 | 2018-03-30 | ||
| JPJP-P-2018-069174 | 2018-03-30 | ||
| PCT/JP2019/007358 WO2019187904A1 (ja) | 2018-03-30 | 2019-02-26 | アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 |
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| KR20200137946A true KR20200137946A (ko) | 2020-12-09 |
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| KR1020197038591A KR20200137946A (ko) | 2018-03-30 | 2019-02-26 | 알칼리 현상형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 |
Country Status (5)
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| JP (1) | JP6650076B1 (zh) |
| KR (1) | KR20200137946A (zh) |
| CN (1) | CN110753881A (zh) |
| TW (1) | TWI770369B (zh) |
| WO (1) | WO2019187904A1 (zh) |
Citations (1)
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| JP2011042711A (ja) | 2009-08-19 | 2011-03-03 | Taiyo Holdings Co Ltd | 光硬化性樹脂組成物 |
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| JPH0673003A (ja) * | 1992-08-28 | 1994-03-15 | Toshiba Corp | ビスマレイミド化合物及び感光性樹脂組成物 |
| JP2003131375A (ja) * | 2001-10-25 | 2003-05-09 | Hitachi Ltd | パターン状絶縁膜形成方法 |
| JP5045064B2 (ja) * | 2006-11-02 | 2012-10-10 | Ｊｎｃ株式会社 | アルカリ可溶性重合体及びそれを用いたポジ型感光性樹脂組成物 |
| JP5263603B2 (ja) * | 2009-01-09 | 2013-08-14 | 日立化成株式会社 | 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法及びそれを用いた永久レジスト。 |
| WO2012105558A1 (ja) * | 2011-02-01 | 2012-08-09 | Dic株式会社 | 熱硬化型樹脂組成物、その硬化物およびプリント配線板用層間接着フィルム |
| US9661763B2 (en) * | 2011-10-11 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition |
| KR102050619B1 (ko) * | 2012-05-17 | 2019-11-29 | 다이요 잉키 세이조 가부시키가이샤 | 액상 현상형의 말레이미드 조성물, 프린트 배선판 |
| WO2013172433A1 (ja) * | 2012-05-17 | 2013-11-21 | 太陽インキ製造株式会社 | アルカリ現像型の熱硬化性樹脂組成物、プリント配線板 |
| JP6363861B2 (ja) * | 2014-03-31 | 2018-07-25 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化被膜を有するプリント配線板 |
| JP2015196764A (ja) * | 2014-04-01 | 2015-11-09 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、永久被膜形成用組成物、ドライフィルムおよびプリント配線板 |
| KR102641274B1 (ko) * | 2016-01-13 | 2024-02-29 | 다이요 홀딩스 가부시키가이샤 | 드라이 필름 및 프린트 배선판 |
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- 2019-02-26 KR KR1020197038591A patent/KR20200137946A/ko not_active Application Discontinuation
- 2019-02-26 JP JP2019548351A patent/JP6650076B1/ja active Active
- 2019-02-26 CN CN201980002500.XA patent/CN110753881A/zh active Pending
- 2019-03-19 TW TW108109308A patent/TWI770369B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011042711A (ja) | 2009-08-19 | 2011-03-03 | Taiyo Holdings Co Ltd | 光硬化性樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2019187904A1 (ja) | 2020-04-30 |
| TW201942171A (zh) | 2019-11-01 |
| WO2019187904A1 (ja) | 2019-10-03 |
| CN110753881A (zh) | 2020-02-04 |
| JP6650076B1 (ja) | 2020-02-19 |
| TWI770369B (zh) | 2022-07-11 |
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