JP6647253B2 - フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 - Google Patents
フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 Download PDFInfo
- Publication number
- JP6647253B2 JP6647253B2 JP2017150626A JP2017150626A JP6647253B2 JP 6647253 B2 JP6647253 B2 JP 6647253B2 JP 2017150626 A JP2017150626 A JP 2017150626A JP 2017150626 A JP2017150626 A JP 2017150626A JP 6647253 B2 JP6647253 B2 JP 6647253B2
- Authority
- JP
- Japan
- Prior art keywords
- mass
- copper foil
- copper
- flexible printed
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 74
- 239000011889 copper foil Substances 0.000 title claims description 61
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 238000000137 annealing Methods 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 238000002441 X-ray diffraction Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 3
- 238000005097 cold rolling Methods 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 14
- 238000001953 recrystallisation Methods 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 12
- 239000013078 crystal Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000005452 bending Methods 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 8
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017150626A JP6647253B2 (ja) | 2017-08-03 | 2017-08-03 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
| TW107121236A TWI731247B (zh) | 2017-08-03 | 2018-06-21 | 可撓性印刷基板用銅箔、使用其之覆銅積層體、可撓性印刷基板及電子機器 |
| KR1020180085873A KR102115086B1 (ko) | 2017-08-03 | 2018-07-24 | 플렉시블 프린트 기판용 동박, 그것을 사용한 구리 피복 적층체, 플렉시블 프린트 기판, 및 전자 기기 |
| CN201810877213.0A CN109385556A (zh) | 2017-08-03 | 2018-08-03 | 柔韧印刷基板用铜箔、使用了该铜箔的覆铜层叠体、柔韧印刷基板和电子设备 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017150626A JP6647253B2 (ja) | 2017-08-03 | 2017-08-03 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019026917A JP2019026917A (ja) | 2019-02-21 |
| JP6647253B2 true JP6647253B2 (ja) | 2020-02-14 |
Family
ID=65366653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017150626A Active JP6647253B2 (ja) | 2017-08-03 | 2017-08-03 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6647253B2 (zh) |
| KR (1) | KR102115086B1 (zh) |
| CN (1) | CN109385556A (zh) |
| TW (1) | TWI731247B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7186141B2 (ja) * | 2019-07-10 | 2022-12-08 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅箔 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01319641A (ja) * | 1988-06-21 | 1989-12-25 | Hitachi Cable Ltd | 軟質圧延銅箔およびフレキシブルプリント基板 |
| JP3009383U (ja) | 1994-08-17 | 1995-04-04 | 有限会社バディー | 水耕栽培における定植資材 |
| JP3856582B2 (ja) * | 1998-11-17 | 2006-12-13 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
| JP3830680B2 (ja) | 1998-12-28 | 2006-10-04 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
| JP3856581B2 (ja) * | 1999-01-18 | 2006-12-13 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
| JP3709109B2 (ja) * | 1999-11-16 | 2005-10-19 | 日鉱金属加工株式会社 | 張出し加工性に優れたプリント回路基板用圧延銅箔およびその製造方法 |
| JP3962291B2 (ja) * | 2001-07-17 | 2007-08-22 | 日鉱金属株式会社 | 銅張積層板用圧延銅箔およびその製造方法 |
| JP2003064430A (ja) * | 2001-08-20 | 2003-03-05 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
| JP2003055722A (ja) * | 2001-08-10 | 2003-02-26 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
| JP3824593B2 (ja) * | 2003-02-27 | 2006-09-20 | 日鉱金属株式会社 | 高い伸びを有する圧延銅箔 |
| JP5356714B2 (ja) * | 2008-03-31 | 2013-12-04 | Ｊｘ日鉱日石金属株式会社 | エッチング性に優れたフレキシブルプリント基板用銅合金箔及びそれを用いたフレキシブルプリント基板 |
| JP2011094200A (ja) * | 2009-10-30 | 2011-05-12 | Jx Nippon Mining & Metals Corp | 銅又は銅合金箔、及びそれを用いた両面銅張積層板の製造方法 |
| JP5094834B2 (ja) * | 2009-12-28 | 2012-12-12 | Ｊｘ日鉱日石金属株式会社 | 銅箔の製造方法、銅箔及び銅張積層板 |
| JP2011148192A (ja) * | 2010-01-21 | 2011-08-04 | Jx Nippon Mining & Metals Corp | 銅張積層板の製造方法、それに用いる銅箔、及び銅張積層板のラミネート装置。 |
| JP6294257B2 (ja) * | 2015-03-30 | 2018-03-14 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅合金箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
| JP6663712B2 (ja) * | 2015-12-25 | 2020-03-13 | Ｊｘ金属株式会社 | 圧延銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
-
2017
- 2017-08-03 JP JP2017150626A patent/JP6647253B2/ja active Active
-
2018
- 2018-06-21 TW TW107121236A patent/TWI731247B/zh active
- 2018-07-24 KR KR1020180085873A patent/KR102115086B1/ko active IP Right Grant
- 2018-08-03 CN CN201810877213.0A patent/CN109385556A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR102115086B1 (ko) | 2020-05-25 |
| TWI731247B (zh) | 2021-06-21 |
| CN109385556A (zh) | 2019-02-26 |
| JP2019026917A (ja) | 2019-02-21 |
| TW201910524A (zh) | 2019-03-16 |
| KR20190015108A (ko) | 2019-02-13 |
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