JP6647091B2 - 電歪素子の製造方法 - Google Patents
電歪素子の製造方法 Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Description
まず、図3Aに示すように、エラストマーからなる誘電膜2の上面の外周縁に枠型フレーム4を配設し、枠型フレーム4によって誘電膜2を伸張状態に保持させる。
次に、第2実施形態について説明する。第1実施形態と同一の部分については、同一の符号を付して説明を省略する。
Claims (10)
- エラストマーからなる誘電膜と、前記誘電膜の外周縁より内方の少なくとも一方の面に形成され、前記誘電膜の伸縮に追従して伸縮可能な膜電極と、前記誘電膜の少なくとも一方の面の外周縁に配設され、前記誘電膜を伸張状態に保持する枠型フレームとを備える電歪素子の製造方法において、
エラストマーからなる誘電膜を伸張し、前記誘電膜の片面の外周縁に枠型フレームを配置することにより前記誘電膜を伸張状態に保持する工程と、
伸張状態の前記誘電膜の少なくとも片面に、導電性材料を含む導電ペーストをスクリーン印刷することにより、前記膜電極を形成する工程とを備え、
前記膜電極を形成する工程は、前記スクリーン印刷を、前記誘電膜のスクリーン印刷が施される面の反対側の面に、前記スクリーン印刷が施される領域を囲むように第1治具を当接し、第3治具によって、前記枠型フレームを前記誘電膜のスクリーン印刷が施される面より下方に押圧して行うことを特徴とする電歪素子の製造方法。 - 請求項1記載の電歪素子の製造方法において、
前記膜電極を形成する工程は、前記スクリーン印刷を、前記誘電膜のスクリーン印刷が施される面の反対側の面に、前記第1治具の内方に設けられ、前記膜電極に対応する所定の形状の外周縁に間隙を存して沿う形状を有する第2治具を当接して行うことを特徴とする電歪素子の製造方法。 - 請求項1又は請求項2項記載の電歪素子の製造方法において、
各治具は、上方に膨出する曲面からなる上端面を備え、前記曲面の頂部で前記誘電膜に接触することを特徴とする電歪素子の製造方法。 - 請求項1〜請求項3のいずれか1項記載の電歪素子の製造方法において、
各治具は、前記誘電膜への当接面が前記誘電膜に対して滑性を有することを特徴とする電歪素子の製造方法。 - 請求項1〜請求項4のいずれか1項記載の電歪素子の製造方法において、
前記膜電極を形成する工程は、前記誘電膜の厚さが20〜100μmの範囲となるように前記誘電膜を緊張させることを特徴とする電歪素子の製造方法。 - 請求項1〜請求項5のいずれか1項記載の電歪素子の製造方法において、
前記誘電膜を伸張状態に保持する工程は、前記枠型フレームとして第1枠型フレームを配置し、
前記製造方法は、前記膜電極を形成する工程の後に、前記誘電膜上に形成された前記膜電極の外周縁より外方であって且つ前記第1枠型フレームの内方に、前記誘電膜を伸張状態に保持する第2枠型フレームを配置する工程と、
前記誘電膜を前記第2枠型フレームの外周縁に沿って裁断する工程とを備えることを特徴とする電歪素子の製造方法。 - 請求項1〜請求項6のいずれか1項記載の電歪素子の製造方法において、
前記誘電膜は、シリコーン、ポリウレタン、ポリエチレンからなる群から選択される1種の樹脂材料を含むことを特徴とする電歪素子の製造方法。 - 請求項7記載の電歪素子の製造方法において、
前記誘電膜は、少なくとも一方の面に、前記誘電膜を構成する樹脂材料と同一の樹脂材料を主剤とする接着剤又はアクリル接着剤からなる接着層を備えることを特徴とする電歪素子の製造方法。 - 請求項1〜請求項8のいずれか1項記載の電歪素子の製造方法において、
前記導電性材料は、白金担持炭素材料、銀、銅のいずれかであることを特徴とする電歪素子の製造方法。 - 請求項1〜請求項9のいずれか1項記載の電歪素子の製造方法において、
前記枠型フレームは、ABS(アクリロニトリル?ブタジエン?スチレン共重合体)、ポリアセタール、ポリエーテルケトン、ガラス強化樹脂からなる群から選択される1種の樹脂材料、又は、表面に圧縮層を有する強化ガラス、セラミックスからなる群から選択される1種の無機材料からなることを特徴とする電歪素子の製造方法。
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US14/724,171 | 2015-05-28 | ||
US14/724,171 US9773969B2 (en) | 2015-05-28 | 2015-05-28 | Electrostrictive element manufacturing method |
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JP2016226256A JP2016226256A (ja) | 2016-12-28 |
JP6647091B2 true JP6647091B2 (ja) | 2020-02-14 |
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US (1) | US9773969B2 (ja) |
JP (1) | JP6647091B2 (ja) |
DE (1) | DE102016208986B4 (ja) |
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US10020439B2 (en) * | 2015-05-28 | 2018-07-10 | Honda Motor Co., Ltd. | Electrostrictive element |
US10870202B2 (en) | 2017-08-23 | 2020-12-22 | Board Of Regents, The University Of Texas System | Variable stiffness actuator with electrically modulated stiffness |
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US5014614A (en) | 1989-06-30 | 1991-05-14 | Thieme Gaylord G | Cap printing device and method |
US6812624B1 (en) * | 1999-07-20 | 2004-11-02 | Sri International | Electroactive polymers |
US6376971B1 (en) * | 1997-02-07 | 2002-04-23 | Sri International | Electroactive polymer electrodes |
US7034432B1 (en) | 1997-02-07 | 2006-04-25 | Sri International | Electroactive polymer generators |
US6543110B1 (en) * | 1997-02-07 | 2003-04-08 | Sri International | Electroactive polymer fabrication |
JP3909387B2 (ja) * | 1998-01-21 | 2007-04-25 | 谷電機工業株式会社 | ペーストのスクリーン印刷方法及び装置 |
DK1221180T3 (da) * | 1999-07-20 | 2010-12-20 | Stanford Res Inst Int | Elektroaktive polymerer |
JP2003174205A (ja) | 2001-12-05 | 2003-06-20 | National Institute Of Advanced Industrial & Technology | 誘電体利用駆動装置 |
JP2007502671A (ja) * | 2003-08-20 | 2007-02-15 | ネオガイド システムズ, インコーポレイテッド | 活性ポリマー関節運動器具及び挿入方法 |
JP2005347364A (ja) * | 2004-06-01 | 2005-12-15 | National Institute Of Advanced Industrial & Technology | 伸縮可能な圧電素子 |
JP2007158276A (ja) * | 2005-12-08 | 2007-06-21 | Ngk Insulators Ltd | 圧電/電歪デバイス及び圧電/電歪デバイスの駆動方法 |
JP5024812B2 (ja) | 2006-06-20 | 2012-09-12 | 独立行政法人産業技術総合研究所 | 誘電体構造及びその製造方法 |
US7804227B2 (en) * | 2007-03-16 | 2010-09-28 | Sri International | Tear resistant electroactive polymer transducers |
WO2012118916A2 (en) | 2011-03-01 | 2012-09-07 | Bayer Materialscience Ag | Automated manufacturing processes for producing deformable polymer devices and films |
US9876160B2 (en) * | 2012-03-21 | 2018-01-23 | Parker-Hannifin Corporation | Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices |
JP2014118481A (ja) * | 2012-12-17 | 2014-06-30 | Tokai Rubber Ind Ltd | 導電材料およびそれを用いたトランスデューサ |
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- 2015-05-28 US US14/724,171 patent/US9773969B2/en active Active
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- 2016-05-24 DE DE102016208986.2A patent/DE102016208986B4/de active Active
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DE102016208986A1 (de) | 2016-12-01 |
US9773969B2 (en) | 2017-09-26 |
US20160351790A1 (en) | 2016-12-01 |
DE102016208986B4 (de) | 2018-12-20 |
JP2016226256A (ja) | 2016-12-28 |
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