JP6637479B2 - 電子回路基板 - Google Patents
電子回路基板 Download PDFInfo
- Publication number
- JP6637479B2 JP6637479B2 JP2017220795A JP2017220795A JP6637479B2 JP 6637479 B2 JP6637479 B2 JP 6637479B2 JP 2017220795 A JP2017220795 A JP 2017220795A JP 2017220795 A JP2017220795 A JP 2017220795A JP 6637479 B2 JP6637479 B2 JP 6637479B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- rigid
- contact relays
- flexible
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000012212 insulator Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 25
- 235000014676 Phragmites communis Nutrition 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 33
- 239000000463 material Substances 0.000 description 11
- 239000012792 core layer Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H45/00—Details of relays
- H01H45/02—Bases; Casings; Covers
- H01H45/04—Mounting complete relay or separate parts of relay on a base or inside a case
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
- H05K5/0013—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by resilient members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
本発明に係る電子回路基板の実施形態の1つを図1から図9に基づいて説明する。
10 リジッド基板部
11 絶縁体
12 回路パターン
20 フレキシブル基板部
21 絶縁体
22 回路パターン
30 電子部品
30A 有接点リレー
Claims (6)
- 実装対象の電子部品と、
絶縁性の絶縁体及び導電性の回路パターンを有し、かつ、実装した前記電子部品を前記回路パターンに対して電気的に接続させる硬質の複数のリジッド基板部と、
絶縁性の絶縁体を有すると共に、複数の前記リジッド基板部の内の少なくとも2つにおけるそれぞれの前記回路パターンに対して電気的に接続される導電性の回路パターンを有し、自らの前記回路パターンとの電気的な接続が成される前記リジッド基板部に対して一体化させた軟質の少なくとも1つのフレキシブル基板部と、
を備え、
前記フレキシブル基板部は、互いに隙間を空けて配置された少なくとも2つの前記リジッド基板部を連結させ、
前記電子部品としての複数の有接点リレーは、前記フレキシブル基板部が連結されているそれぞれの前記リジッド基板部に分散配置することを特徴とした電子回路基板。 - 実装対象の電子部品と、
絶縁性の絶縁体及び導電性の回路パターンを有し、かつ、実装した前記電子部品を前記回路パターンに対して電気的に接続させる硬質の複数のリジッド基板部と、
絶縁性の絶縁体を有すると共に、複数の前記リジッド基板部の内の少なくとも2つにおけるそれぞれの前記回路パターンに対して電気的に接続される導電性の回路パターンを有し、自らの前記回路パターンとの電気的な接続が成される前記リジッド基板部に対して一体化させた軟質の少なくとも1つのフレキシブル基板部と、
を備え、
前記電子部品としての複数の有接点リレーの間で共振が起こり易い場合には、前記有接点リレーをそれぞれの前記リジッド基板部に分散配置することを特徴とした電子回路基板。 - 実装対象となる前記有接点リレーの数量が前記リジッド基板部の数量と同じ場合には、それぞれの前記リジッド基板部に前記有接点リレーを1つずつ実装することを特徴とした請求項1又は2に記載の電子回路基板。
- 実装対象となる前記有接点リレーの数量が前記リジッド基板部の数量よりも少ない場合には、前記有接点リレーの数量と同数の前記リジッド基板部に前記有接点リレーを1つずつ実装することを特徴とした請求項1又は2に記載の電子回路基板。
- 実装対象となる前記有接点リレーの数量が前記リジッド基板部の数量よりも多い場合には、それぞれの前記リジッド基板部に前記有接点リレーを1つずつ実装し、かつ、それぞれの前記リジッド基板部の中から選択した残りの前記有接点リレーの数量と同数の前記リジッド基板部に前記有接点リレーを少なくとも1つずつ実装することを特徴とした請求項1又は2に記載の電子回路基板。
- 複数の前記リジッド基板部は、それぞれが互いに隙間を空けて配置され、かつ、それぞれが少なくとも1つの前記フレキシブル基板部で連結されることを特徴とした請求項1から5の内の何れか1つに記載の電子回路基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017220795A JP6637479B2 (ja) | 2017-11-16 | 2017-11-16 | 電子回路基板 |
US16/134,257 US10764998B2 (en) | 2017-11-16 | 2018-09-18 | Electronic circuit board |
DE102018219272.3A DE102018219272A1 (de) | 2017-11-16 | 2018-11-12 | Elektronische leiterplatte |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017220795A JP6637479B2 (ja) | 2017-11-16 | 2017-11-16 | 電子回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019091842A JP2019091842A (ja) | 2019-06-13 |
JP6637479B2 true JP6637479B2 (ja) | 2020-01-29 |
Family
ID=66335880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017220795A Active JP6637479B2 (ja) | 2017-11-16 | 2017-11-16 | 電子回路基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10764998B2 (ja) |
JP (1) | JP6637479B2 (ja) |
DE (1) | DE102018219272A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019169654A (ja) * | 2018-03-26 | 2019-10-03 | 矢崎総業株式会社 | 電子部品モジュール、電気接続箱及び電気接続箱 |
US10925166B1 (en) * | 2019-08-07 | 2021-02-16 | Quanta Computer Inc. | Protection fixture |
CN117292979A (zh) * | 2019-12-02 | 2023-12-26 | 富士电机机器制御株式会社 | 电气装置 |
JP7314807B2 (ja) * | 2020-01-21 | 2023-07-26 | 富士電機機器制御株式会社 | 電磁接触器 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994029145A1 (en) * | 1993-06-09 | 1994-12-22 | United Technologies Automotive, Inc. | Hybrid junction box |
US5805402A (en) * | 1993-06-09 | 1998-09-08 | Ut Automotive Dearborn, Inc. | Integrated interior trim and electrical assembly for an automotive vehicle |
US5995380A (en) * | 1998-05-12 | 1999-11-30 | Lear Automotive Dearborn, Inc. | Electric junction box for an automotive vehicle |
JP2003152286A (ja) * | 2001-11-12 | 2003-05-23 | Yazaki Corp | 実装基板の静音構造 |
JP3954915B2 (ja) * | 2002-05-29 | 2007-08-08 | 矢崎総業株式会社 | 電気接続箱とその製造方法 |
WO2004066697A1 (ja) * | 2003-01-20 | 2004-08-05 | Fujikura Ltd. | 多層配線板およびその製造方法 |
JP2006332247A (ja) | 2005-05-25 | 2006-12-07 | Sansha Electric Mfg Co Ltd | 電源装置および電気装置の放熱構造 |
JP2007053248A (ja) * | 2005-08-18 | 2007-03-01 | Tdk Corp | フレキシブル基板、実装構造、表示ユニット、及び携帯用電子機器 |
JP2009071138A (ja) | 2007-09-14 | 2009-04-02 | Yazaki Corp | 実装基板 |
US9559513B2 (en) * | 2012-11-02 | 2017-01-31 | Rockwell Automation Technologies, Inc. | Voltage sensor contact for an electronic device |
US9230765B2 (en) * | 2012-11-02 | 2016-01-05 | Rockwell Automation Technologies, Inc. | Modular overload relay assembly with mechanically isolated connector |
US20140124262A1 (en) * | 2012-11-02 | 2014-05-08 | William H. Martin | Modular overload relay assembly with preformed coil interface |
US9622355B2 (en) * | 2013-07-08 | 2017-04-11 | Delphi Technologies, Inc. | Environmentally sealed electrical housing assembly with integrated connector |
US20150135016A1 (en) * | 2013-11-11 | 2015-05-14 | William T. Glaser | Modular Overload Relay Assembly With A Modular Communication And Human Interface Module |
JP2016167544A (ja) * | 2015-03-10 | 2016-09-15 | ソニー株式会社 | 電子部品、電子部品実装基板及び電子部品の実装方法 |
JP2017022184A (ja) | 2015-07-07 | 2017-01-26 | 矢崎総業株式会社 | 電子部品ユニット用基板、及び、電子部品ユニット |
JP2017022809A (ja) | 2015-07-07 | 2017-01-26 | 矢崎総業株式会社 | 電子部品ユニット、及び、ワイヤハーネス |
JP6626382B2 (ja) * | 2016-03-18 | 2019-12-25 | 株式会社Subaru | 電源装置 |
-
2017
- 2017-11-16 JP JP2017220795A patent/JP6637479B2/ja active Active
-
2018
- 2018-09-18 US US16/134,257 patent/US10764998B2/en active Active
- 2018-11-12 DE DE102018219272.3A patent/DE102018219272A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
US20190150276A1 (en) | 2019-05-16 |
DE102018219272A1 (de) | 2019-05-16 |
US10764998B2 (en) | 2020-09-01 |
JP2019091842A (ja) | 2019-06-13 |
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