JP6626781B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP6626781B2 JP6626781B2 JP2016105783A JP2016105783A JP6626781B2 JP 6626781 B2 JP6626781 B2 JP 6626781B2 JP 2016105783 A JP2016105783 A JP 2016105783A JP 2016105783 A JP2016105783 A JP 2016105783A JP 6626781 B2 JP6626781 B2 JP 6626781B2
- Authority
- JP
- Japan
- Prior art keywords
- build
- opening
- core
- outer peripheral
- solid pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
4,7 導体層
13 ベタ状パターン
13a ベタ状バターンの外周縁
13b ガス抜き用の開口部
20 配線基板
Claims (2)
- 上面および下面を有する絶縁層と、前記上面に配設された導体層から成り、外周縁が前記絶縁層の外周縁より内側に位置する上面側のベタ状パターンと、前記下面に配設された導体層から成り、前記上面側のベタ状パターンと上下に重なる位置に、外周縁が前記絶縁層の外周縁より内側に位置する下面側のベタ状パターンと、を具備して成る配線基板であって、上下の前記ベタ状パターンは、一方の前記外周縁が他方の前記外周縁よりも15〜25μmだけ内側に位置するように配置されていることを特徴とする配線基板。
- 上下の前記ベタ状パターンは、互いに上下に重なる位置にガス抜き用の開口部を備えるとともに、一方の前記開口部の開口縁が他方の前記開口部の開口縁よりも15〜25μmだけ該他方の開口部の中心寄りに位置することを特徴とする請求項1記載の配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016105783A JP6626781B2 (ja) | 2016-05-27 | 2016-05-27 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016105783A JP6626781B2 (ja) | 2016-05-27 | 2016-05-27 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017212380A JP2017212380A (ja) | 2017-11-30 |
JP6626781B2 true JP6626781B2 (ja) | 2019-12-25 |
Family
ID=60476318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016105783A Active JP6626781B2 (ja) | 2016-05-27 | 2016-05-27 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6626781B2 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4235092B2 (ja) * | 2003-11-27 | 2009-03-04 | 京セラ株式会社 | 配線基板およびこれを用いた半導体装置 |
JP2008078303A (ja) * | 2006-09-20 | 2008-04-03 | Renesas Technology Corp | Lga用搭載基板と半導体集積回路装置 |
JP2009088173A (ja) * | 2007-09-28 | 2009-04-23 | Fujitsu Ltd | 配線基板 |
JP6258805B2 (ja) * | 2014-07-25 | 2018-01-10 | 京セラ株式会社 | 配線基板 |
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2016
- 2016-05-27 JP JP2016105783A patent/JP6626781B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017212380A (ja) | 2017-11-30 |
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