JP6258805B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP6258805B2 JP6258805B2 JP2014151296A JP2014151296A JP6258805B2 JP 6258805 B2 JP6258805 B2 JP 6258805B2 JP 2014151296 A JP2014151296 A JP 2014151296A JP 2014151296 A JP2014151296 A JP 2014151296A JP 6258805 B2 JP6258805 B2 JP 6258805B2
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- JP
- Japan
- Prior art keywords
- core
- wiring
- conductor
- build
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
1A・・・貫通孔
2・・・・コア配線導体
3・・・・コア基板
4・・・・ビルドアップ絶縁層
5・・・・ビルドアップ配線導体
6・・・・ビルドアップ部
7・・・・貫通導体
9・・・・半導体素子接続パッド
100・・・・配線基板
Claims (1)
- 熱硬化性樹脂成分を含有しており、上面から下面にかけて複数の貫通孔を有するとともに該貫通孔内に、前記熱硬化性樹脂成分の一部を取り込んで熱硬化する導体ペーストが充填された未硬化のプリプレグと、該プリプレグの表面に前記導体ペーストと接続するように埋入された銅箔から成るコア配線導体とを交互に複数層積層するとともに前記プリプレグおよび前記導体ペーストを熱硬化させて形成したコア基板の上下面に、熱硬化性樹脂から成るビルドアップ絶縁層とめっき導体から成るビルドアップ配線導体とを交互に積層したビルドアップ部を形成して成り、上面側の前記ビルドアップ部の上面中央部に半導体素子が搭載される搭載部を有するとともに、該搭載部に前記半導体素子の電極と半田バンプを介して接続される多数の半導体素子接続パッドが配列されており、前記貫通孔が、前記コア基板における前記搭載部に対応する中央領域において、その外側の領域よりも高密度で形成されて成る配線基板であって、前記コア配線導体は、その面積占有率が前記コア基板の上面側で大きく、下面側で小さくなっていることを特徴とする配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014151296A JP6258805B2 (ja) | 2014-07-25 | 2014-07-25 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014151296A JP6258805B2 (ja) | 2014-07-25 | 2014-07-25 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016025337A JP2016025337A (ja) | 2016-02-08 |
JP6258805B2 true JP6258805B2 (ja) | 2018-01-10 |
Family
ID=55271812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014151296A Active JP6258805B2 (ja) | 2014-07-25 | 2014-07-25 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6258805B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6626781B2 (ja) * | 2016-05-27 | 2019-12-25 | 京セラ株式会社 | 配線基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3940617B2 (ja) * | 2002-02-26 | 2007-07-04 | 京セラ株式会社 | 配線基板およびその製造方法 |
JP4349882B2 (ja) * | 2003-10-30 | 2009-10-21 | 京セラ株式会社 | 配線基板および半導体装置 |
JP4423023B2 (ja) * | 2003-12-18 | 2010-03-03 | 京セラ株式会社 | 配線基板 |
JP5625250B2 (ja) * | 2009-03-30 | 2014-11-19 | 凸版印刷株式会社 | 半導体装置 |
JP5730152B2 (ja) * | 2011-07-26 | 2015-06-03 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
-
2014
- 2014-07-25 JP JP2014151296A patent/JP6258805B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2016025337A (ja) | 2016-02-08 |
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