JP6619159B2 - グラフェン及び量子点を含む電子素子 - Google Patents
グラフェン及び量子点を含む電子素子 Download PDFInfo
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- JP6619159B2 JP6619159B2 JP2015111228A JP2015111228A JP6619159B2 JP 6619159 B2 JP6619159 B2 JP 6619159B2 JP 2015111228 A JP2015111228 A JP 2015111228A JP 2015111228 A JP2015111228 A JP 2015111228A JP 6619159 B2 JP6619159 B2 JP 6619159B2
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- graphene layer
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- 239000002096 quantum dot Substances 0.000 title claims description 378
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 228
- 229910021389 graphene Inorganic materials 0.000 title claims description 228
- 239000000758 substrate Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 28
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000000295 complement effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 397
- 238000000034 method Methods 0.000 description 32
- 230000008569 process Effects 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- 239000004205 dimethyl polysiloxane Substances 0.000 description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 10
- 230000005693 optoelectronics Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 239000007772 electrode material Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910004129 HfSiO Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Description
100B 第3電子素子
100G 第2電子素子
100R 第1電子素子
101,201 基板
102,202 ゲート電極
103,203 ゲート絶縁膜
104,204 グラフェン層
104a 第1グラフェン層
104b 第2グラフェン層
104c 第3グラフェン層
105,115,205 量子点層
105a 第1’量子点層
105b 第2’量子点層
105B 第3量子点層
105G 第2量子点層
105R 第1量子点層
106,206 第1輸送層
107,207 第2輸送層
108,208 ドレイン電極
109,209 ソース電極
115a n型量子点
115b p型量子点
119a 第1電極
119b 第2電極
119c 第3電極
155 トレンチ
180 第2ゲート絶縁膜
210 絶縁層
300 電子素子アレイ
Claims (27)
- 多数の量子点を具備する量子点層と、前記量子点層に電気的に接触するグラフェン層とを含むチャネル層と、
前記チャネル層にそれぞれ電気的に接触する第1電極及び第2電極と、
前記チャネル層を介して、前記第1電極及び第2電極の間に流れる電流を制御するように構成されたゲート電極と、
前記ゲート電極と前記チャネル層との間に配置されたゲート絶縁膜と、を含み、
前記量子点層は、前記グラフェン層の一部領域に配置されており、
前記第1電極は、前記量子点層に接触するように配置され、前記第2電極は、前記グラフェン層に接触するように配置され、前記第2電極は、前記量子点層から離れて配置され、
前記量子点層は、積層方向に少なくとも部分的に前記グラフェン層と前記第1電極との間に配置される、電子素子。 - 前記グラフェン層と前記量子点層との間に配置された第1輸送層、及び前記量子点層と前記第1電極との間に配置された第2輸送層のうち少なくとも1層をさらに含むことを特徴とする請求項1に記載の電子素子。
- 前記量子点層は、多数の第1量子点、及び前記第1量子点と異なる多数の第2量子点を含むことを特徴とする請求項2に記載の電子素子。
- 前記多数の第1量子点は、第1導電型であり、前記多数の第2量子点は、第1導電型と電気的に相反する第2導電型であり、
前記多数の第1量子点の伝導帯の値は、前記グラフェン層のフェルミエネルギー値より小さく、前記多数の第2量子点の価電子帯の値は、前記グラフェン層のフェルミエネルギー値より大きいことを特徴とする請求項3に記載の電子素子。 - 前記多数の第1量子点は、第1領域において、前記グラフェン層と接触するように分布し、前記多数の第2量子点は、前記第1領域と異なる第2領域において、前記グラフェン層と接触するように分布することを特徴とする請求項3に記載の電子素子。
- 前記第1領域の一部が、前記第2領域上に配置されるように、前記第1領域と前記第2領域との一部が互いに重畳することを特徴とする請求項5に記載の電子素子。
- 前記多数の第1量子点及び第2量子点が無秩序に互いに混じっており、前記多数の第1量子点及び第2量子点のそれぞれが、前記グラフェン層と接触することを特徴とする請求項3に記載の電子素子。
- 前記多数の第1量子点が、前記グラフェン層と前記第1電極との間において、複数層に積層されており、前記多数の第2量子点が、前記グラフェン層と前記第1電極との間において、複数層に積層されていることを特徴とする請求項3に記載の電子素子。
- 前記量子点層は、前記グラフェン層と前記第1電極とを連結するように、前記多数の第1量子点を積層して形成された多数の第1柱、及び前記グラフェン層と前記第1電極とを連結するように、前記多数の第2量子点を積層して形成された多数の第2柱を含み、前記多数の第1柱及び多数の第2柱が、前記グラフェン層と前記第1電極との表面方向に沿って交互に配置されていることを特徴とする請求項8に記載の電子素子。
- 前記量子点層は、前記グラフェン層と前記第1電極とを連結するように、前記多数の第1量子点を積層して形成された多数の第1ピラミッド構造、及び前記グラフェン層と前記第1電極とを連結するように、前記多数の第2量子点を積層して形成された多数の第2ピラミッド構造を含み、前記多数の第1ピラミッド構造は、前記多数の第2ピラミッド構造と相補的な形態に配列されていることを特徴とする請求項8に記載の電子素子。
- 基板をさらに含み、
前記ゲート電極は、前記基板上に配置され、前記ゲート絶縁膜は、前記ゲート電極上に配置され、前記グラフェン層は、前記ゲート絶縁膜上に配置されることを特徴とする請求項1に記載の電子素子。 - 前記量子点層は、前記グラフェン層の第1領域上に配置された第1量子点層、及び前記グラフェン層の第1領域と異なる第2領域上に配置された第2量子点層を含み、
前記第1電極は、前記第1量子点層上に配置され、前記第2電極は、前記第2量子点層上に配置されることを特徴とする請求項1に記載の電子素子。 - 基板をさらに含み、
前記第1電極は、前記基板の第1表面領域上に配置されており、前記第1電極上に、前記量子点層が配置されており、前記グラフェン層は、前記量子点層の上部表面、及び前記基板の第2表面領域にかけて配置されており、
前記第2電極は、前記基板の第2表面領域上のグラフェン層上に配置されており、
前記ゲート絶縁膜は、前記量子点層の上部表面上のグラフェン層上に配置されており、前記ゲート電極は、前記ゲート絶縁膜上に配置されていることを特徴とする請求項1に記載の電子素子。 - 前記量子点層は、バンドギャップが互いに異なる多数の量子点を含むことを特徴とする請求項1に記載の電子素子。
- 前記量子点層は、前記グラフェン層と前記第1電極との間に配置されており、
前記量子点層は、前記グラフェン層に接する多数の第1導電型量子点、及び前記第1電極に接する多数の第2導電型量子点を含み、前記第2導電型は、前記第1導電型に電気的に相反し、
前記第2導電型量子点は、前記第1導電型量子点上に積層されていることを特徴とする請求項1に記載の電子素子。 - 光を感知する多数のセンサ画素のアレイを含み、
それぞれのセンサ画素は、
多数の量子点を具備する量子点層と、前記量子点層に電気的に接触するグラフェン層と、を含むチャネル層と、
前記チャネル層にそれぞれ電気的に接触する第1電極及び第2電極と、
前記チャネル層を介して、前記第1電極及び前記第2電極の間に流れる電流を制御するように構成されたゲート電極と、
前記ゲート電極と前記チャネル層との間に配置されたゲート絶縁膜と、を含み、
前記多数のセンサ画素は、吸収波長が互いに異なる第1センサ画素及び第2センサ画素を含み、
前記量子点層は、積層方向において、少なくとも部分的に前記グラフェン層と前記第1電極との間に配置される、イメージセンサ。 - 光を放出する多数のディスプレイ画素のアレイを含み、
それぞれのディスプレイ画素は、
多数の量子点を具備する量子点層と、前記量子点層に電気的に接触するグラフェン層と、を含むチャネル層と、
前記チャネル層にそれぞれ電気的に接触する第1電極及び第2電極と、
前記チャネル層を介して、前記第1電極及び前記第2電極の間に流れる電流を制御するように構成されたゲート電極と、
前記ゲート電極と前記チャネル層との間に配置されたゲート絶縁膜と、を含み、
前記多数のディスプレイ画素は、発光波長が互いに異なる第1ディスプレイ画素及び第2ディスプレイ画素を含むディスプレイ装置。 - 光エネルギーを電気エネルギーに転換するための電池セルを含み、
前記電池セルは、
バンドギャップが異なる多数の量子点を具備する量子点層と、前記量子点層に電気的に接触するグラフェン層と、を含むチャネル層と、
前記チャネル層にそれぞれ電気的に接触する第1電極及び第2電極と、を含み、
前記量子点層は、前記グラフェン層の一部領域に配置されており、
前記第1電極は、前記量子点層に接触するように配置され、前記第2電極は、前記グラフェン層に接触するように配置され、前記第2電極は、前記量子点層から離れて配置される、光電池素子。 - 前記量子点層は、前記グラフェン層の第1領域上に配置された第1量子点層、及び前記グラフェン層の第1領域と異なる第2領域上に配置された第2量子点層を含み、
前記第1電極は、前記第1量子点層上に配置され、前記第2電極は、前記第2量子点層上に配置されることを特徴とする請求項18に記載の光電池素子。 - ゲート電極と、
前記ゲート電極上に配置されたゲート絶縁膜と、
前記ゲート絶縁膜上に互いに分離して配置された第1チャネル層及び第2チャネル層と、
前記第1チャネル層に電気的に接触する第1電極と、
前記第2チャネル層に電気的に接触する第2電極と、
前記第1チャネル層及び第2チャネル層いずれにも電気的に接触する第3電極と、を含み、
前記第1チャネル層は、前記ゲート絶縁膜上に配置された第1グラフェン層、及び多数の量子点を具備し、前記第1グラフェン層の一部領域に配置された第1量子点層を含み、
前記第2チャネル層は、前記ゲート絶縁膜上に、前記第1グラフェン層と分離されて配置された第2グラフェン層、及び多数の量子点を具備し、前記第2グラフェン層の一部領域に配置された第2量子点層を含むインバータ素子。 - 前記第1電極は、前記第1グラフェン層に接触するように配置され、前記第2電極は、前記第2グラフェン層に接触するように配置され、前記第3電極は、前記第1量子点層及び第2量子点層にいずれも接触するように配置されることを特徴とする請求項20に記載のインバータ素子。
- 前記第1電極に電気的に連結される接地ラインと、
前記第2電極に電気的に連結される駆動電圧ラインと、
前記ゲート電極に電気的に連結される入力信号ラインと、
前記第3電極に電気的に連結される出力信号ラインと、をさらに含むことを特徴とする請求項21に記載のインバータ素子。 - グラフェン層と、
前記グラフェン層の一側端部上に配置され、多数の量子点を含む量子点層と、
前記量子点層上に配置された第1電極と、
前記グラフェン層の他側端部上に配置され、前記第1電極、及び前記量子点層と離隔されている第2電極と、を含み、
前記第1電極及び前記第2電極は、前記グラフェン層の同じ片面側に配置されている電子素子。 - ゲート電極と、
前記ゲート電極とグラフェン層との間に配置されたゲート絶縁膜をさらに含み、
前記グラフェン層と量子点層は、チャネル層を定義し、
前記チャネル層は、前記ゲート絶縁膜と接触し、
前記ゲート絶縁膜は、前記ゲート電極と接触し、
前記ゲート電極は、前記チャネル層を介して、前記第1電極及び第2電極の間に流れる電流を制御するように構成されたことを特徴とする請求項23に記載の電子素子。 - 前記多数の量子点は、多数の第1量子点及び多数の第2量子点を含み、
前記多数の第1量子点のバンドギャップ及び材料のうち少なくとも一つは、前記第2量子点のバンドギャップ及び材料と異なることを特徴とする請求項23に記載の電子素子。 - 第1輸送層及び第2輸送層のうち少なくとも1層をさらに含み、
前記第1輸送層は、前記第1電極と量子点層との間のグラフェン層上に配置され、前記第2輸送層は、前記量子点層上に配置されることを特徴とする請求項23に記載の電子素子。 - 前記グラフェン層は、第1グラフェン層であり、前記量子点層は、第1量子点層であり、
前記電子素子は、
前記第1グラフェン層と離隔された第2グラフェン層と、
前記第1電極と第2グラフェン層との間に配置され、前記第1量子点層と離隔された第2量子点層と、
前記第2量子点層上に配置され、前記第1電極、及び前記第2量子点層と離隔された第3電極をさらに含むことを特徴とする請求項23に記載の電子素子。
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-
2014
- 2014-06-17 KR KR1020140073680A patent/KR102214833B1/ko active IP Right Grant
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2015
- 2015-01-20 US US14/600,888 patent/US9691853B2/en active Active
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Also Published As
Publication number | Publication date |
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US20150364545A1 (en) | 2015-12-17 |
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