JP6614355B2 - 感光性導電ペースト、積層型電子部品の製造方法、及び、積層型電子部品 - Google Patents
感光性導電ペースト、積層型電子部品の製造方法、及び、積層型電子部品 Download PDFInfo
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- JP6614355B2 JP6614355B2 JP2018528549A JP2018528549A JP6614355B2 JP 6614355 B2 JP6614355 B2 JP 6614355B2 JP 2018528549 A JP2018528549 A JP 2018528549A JP 2018528549 A JP2018528549 A JP 2018528549A JP 6614355 B2 JP6614355 B2 JP 6614355B2
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- metal
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- powder
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- 238000010304 firing Methods 0.000 claims description 11
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- C—CHEMISTRY; METALLURGY
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Description
Ag及びCuは低抵抗であるため、積層型電子部品用途である場合に特に適している。
この場合、導体層と絶縁層との間のデラミネーションの発生をさらに抑制することができる。
この場合、導体層と絶縁層との間のデラミネーションの発生をさらに抑制することができる。
この場合、ライン幅が40μm以下の微細な導体パターンを形成することができる。
この場合、ライン幅が20μm以下の微細な導体パターンを形成することができる。
この場合、ライン幅が10μm以下の微細な導体パターンを形成することができる。
しかしながら、本発明は、以下の構成に限定されるものではなく、本発明の要旨を変更しない範囲において適宜変更して適用することができる。なお、以下において記載する本発明の個々の望ましい構成を2つ以上組み合わせたものもまた本発明である。
本発明の感光性導電ペーストは、金属粉末と、金属レジネートと、感光性有機成分と、を含有する。
金属粉末の平均粒径は、例えば、ベル・マイクロトラック社製の粒子径分布測定装置MT3300−EXを用いて、レーザー回折・散乱法で0.02μm以上1400μm以下の範囲の粒子径分布を測定して粒子径の個数平均を算出した値として得られる。後述するガラス粉末及びセラミック骨材の平均粒径も同様である。
M−X−R ・・・ (1)
一般式(1)において、Mは金属を示し、Xは酸素、窒素又は硫黄を示し、Rはアルキル基を示しており、上記一般式(1)で表される化合物を「金属Mを含む金属レジネート」と呼ぶ。金属レジネートに含まれる金属としては、例えば、Rh、Ni、Cu、Mn、Zr等が挙げられる。このような金属レジネートとしては、例えば、金属のオクチル酸塩、ナフテン酸塩、2−エチルヘキサン塩、スルホン酸塩、金属メルカプチド、アルコキシ金属化合物等が挙げられる。
感光性導電ペーストにおける、金属換算量で表される金属レジネートの含有量とは、感光性導電ペーストに含まれる、金属レジネートを構成する金属の量である。つまり、本発明の感光性導電ペーストにおいて、金属レジネートを構成する金属の量は、金属粉末に対し、0.0025重量%以上1.0重量%以下である。具体的には、Rh、Ni、Cu、Mn及びZrからなる群より選択される金属の量が、金属粉末に対し、0.0025重量%以上1.0重量%以下であることが好ましい。そして、導体層と絶縁層との間のデラミネーションの発生を抑制する観点からは、金属粉末に対する金属レジネートを構成する金属の量が0.005重量%以上であることが好ましく、微細な導体パターンを形成する観点からは、金属粉末に対する金属レジネートの含有量が金属換算量で0.5重量%以下であることが好ましく、0.1重量%以下であることがより好ましく、0.04重量%以下であることがさらに好ましい。
不飽和カルボン酸としては、アクリル酸、メタクリル酸、マレイン酸、フマル酸、ビニル酢酸及びこれらの無水物等が挙げられる。一方、エチレン性不飽和化合物としては、アクリル酸メチル、アクリル酸エチル等のアクリル酸エステル、メタクリル酸メチル、メタクリル酸エチル等のメタクリル酸エステル、フマル酸モノエチル等のフマル酸エステル等が挙げられる。
また、側鎖にカルボキシル基を有するアクリル系共重合体としては、以下のような形態の不飽和結合を導入したものを用いてもよい。
1)アクリル系共重合体の側鎖のカルボキシル基に、これと反応可能な、例えばエポキシ基等の官能基を有するアクリル系モノマーを付加する。
2)側鎖のカルボキシル基の代わりにエポキシ基が導入されてなる上記アクリル系共重合体に、不飽和モノカルボン酸を反応させた後、さらに飽和又は不飽和多価カルボン酸無水物を導入する。
また、側鎖にカルボキシル基を有するアクリル系共重合体としては、重量平均分子量(Mw)が50000以下、かつ酸価が30以上150以下のものが好ましい。
本発明の積層型電子部品の製造方法は、本発明の感光性導電ペーストを用いて形成した導体層と、絶縁性無機成分及び感光性有機成分を含有する感光性絶縁ペーストを用いて形成した絶縁層と、を備える積層体を一体焼成する工程を備えることを特徴とする。
図1は、本発明の積層型電子部品の製造方法の一例を模式的に示す斜視図であり、図2は、図1に示す製造方法により製造された積層型電子部品の外観構成を模式的に示す斜視図である。
本発明の積層型電子部品は、本発明の感光性導電ペーストの焼成物からなる導体層が、絶縁性無機成分及び感光性有機成分を含有する感光性絶縁ペーストの焼成物からなる絶縁層を介して積層されていることを特徴とする。
表1に示す各原料を下記の割合で配合し、充分に混合することにより、感光性有機成分としての感光性樹脂を得た。
表2に示す各原料を下記の割合で配合し、これを3本ロールで充分に混合することにより、絶縁層形成用の感光性ガラスペーストを得た。
上述のように作製した感光性導電ペースト及び感光性ガラスペーストを用いて、以下の方法により多層配線回路チップ(積層型電子部品)を作製した。
(1)デラミネーション発生率
上記の各感光性導電ペーストを用いて作製した多層配線回路チップ100個について、チップ中央の断面をマイクロスコープ(キーエンス社製、VHX−900)によって観察した。そして、多層配線回路チップ内のコイルパターンと絶縁層との間に厚みが10μmの隙間が確認されたものを、デラミネーションが発生したチップとして計数した。
デラミネーション発生率(%)=(デラミネーションが発生したチップの個数/100個)×100
上記の各感光性導電ペーストを用いてコイルパターンを形成する際の解像度を、以下の方法により評価した。各感光性導電ペーストについて、上述の感光性ガラスペーストを用いて形成した絶縁層(感光性ガラス硬化膜)上にスクリーン印刷した後、60℃で30分間の乾燥を行い、膜厚5〜8μmの感光性導電ペースト膜を形成した。次いで、ライン幅/スペース幅が2/2〜50/50μmで描画されたマスクを通して、超高圧水銀灯の光線を600mJ/cm2の条件で照射することによって、感光性導電ペースト膜に露光処理を行った。その後、トリエタノールアミン水溶液にて現像処理を行い、導体パターンを得た。
1b 絶縁層(ガラス層)
2 導体層(コイルパターン)
3 ビアホール
4 積層体
5 コイル
5a,5b コイルの端部
6a,6b 外部電極
7 方向性マークパターン
10 多層配線回路チップ(積層型電子部品)
Claims (9)
- 金属粉末と、前記金属粉末の融点よりも高い融点を有する金属を含む金属レジネートと、感光性有機成分と、を含有し、
前記金属粉末に対する前記金属レジネートの含有量が金属換算量で0.0025重量%以上1.0重量%以下であり、
感光性導電ペースト中の前記金属粉末の含有量が68重量%以上88重量%以下であり、
前記金属レジネートに含まれる金属は、Rh、Ni、Cu及びMnからなる群より選択される少なくとも1種であることを特徴とする感光性導電ペースト。 - 前記金属粉末がAg粉末又はCu粉末である請求項1に記載の感光性導電ペースト。
- 前記金属レジネートに含まれる金属の融点と前記金属粉末の融点との差が121℃以上である請求項1又は2に記載の感光性導電ペースト。
- 前記感光性導電ペースト中の前記金属粉末の含有量が80重量%以上88重量%以下である請求項1〜3のいずれか1項に記載の感光性導電ペースト。
- 前記金属粉末に対する前記金属レジネートの含有量が金属換算量で0.005重量%以上である請求項1〜4のいずれか1項に記載の感光性導電ペースト。
- 前記金属粉末に対する前記金属レジネートの含有量が金属換算量で0.5重量%以下である請求項1〜5のいずれか1項に記載の感光性導電ペースト。
- 前記金属粉末に対する前記金属レジネートの含有量が金属換算量で0.1重量%以下である請求項1〜6のいずれか1項に記載の感光性導電ペースト。
- 前記金属粉末に対する前記金属レジネートの含有量が金属換算量で0.04重量%以下である請求項1〜7のいずれか1項に記載の感光性導電ペースト。
- 請求項1〜8のいずれか1項に記載の感光性導電ペーストを用いて形成した導体層と、絶縁性無機成分及び感光性有機成分を含有する感光性絶縁ペーストを用いて形成した絶縁層と、を備える積層体を一体焼成する工程を備えることを特徴とする積層型電子部品の製造方法。
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