JP6608104B1 - レーザ装置およびレーザ加工機 - Google Patents
レーザ装置およびレーザ加工機 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
- H01S3/0811—Construction or shape of optical resonators or components thereof comprising three or more reflectors incorporating a dispersive element, e.g. a prism for wavelength selection
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- H01S5/00—Semiconductor lasers
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- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
- H01S5/02385—Positioning of the laser chips using laser light as reference
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
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- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
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- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
- H01S3/0811—Construction or shape of optical resonators or components thereof comprising three or more reflectors incorporating a dispersive element, e.g. a prism for wavelength selection
- H01S3/0812—Construction or shape of optical resonators or components thereof comprising three or more reflectors incorporating a dispersive element, e.g. a prism for wavelength selection using a diffraction grating
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
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- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
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- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
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Abstract
Description
図1は、本発明の実施の形態1にかかるレーザ装置の構成を示す図である。実施の形態1にかかるレーザ装置100は、DDLである。図1には、レーザ装置100の筐体内に配置されている構成要素を示している。レーザ装置100は、互いに異なる波長のレーザビームを出射する複数のレーザダイオード(Laser Diode:LD)1と、複数のLD1により出射された複数のレーザビームを共振させるミラーである部分反射ミラー12とを有する。LD1は、出射端4からレーザビームを出射する。部分反射ミラー12は、複数のレーザビームの各々について、入射したレーザビームのうちの一部を反射するとともに入射したレーザビームの一部を透過する。
図3は、本発明の実施の形態2にかかるレーザ装置の要部を示す図である。図4は、図3に示す構成を図3とは異なる方向から見た状態を示す図である。実施の形態2では、基材10のうち調整用部品3が設置されている設置面21から配管7までの高さH2が、設置面21からレーザビームの光軸22までの高さH1よりも低い。実施の形態2では、上記の実施の形態1と同一の構成要素には同一の符号を付し、実施の形態1とは異なる構成について主に説明する。図3には、レーザ装置101の筐体内に配置されている構成要素を側方から見た様子を示している。また、図3では基材10を破線により表している。
図6は、本発明の実施の形態3にかかるレーザ装置の構成を示す図である。実施の形態3にかかるレーザ装置102では、調整用部品3によるLD1の向きの調整のほかに、レーザビームの光路に配置されている各光学素子のうちの少なくとも1つについて向きの調整が可能とされている。実施の形態3では、上記の実施の形態1および2と同一の構成要素には同一の符号を付し、実施の形態1および2とは異なる構成について主に説明する。
図7は、本発明の実施の形態4にかかるレーザ加工機の構成を示す図である。実施の形態4にかかるレーザ加工機200は、上記の実施の形態1にかかるレーザ装置100を有する。レーザ加工機200は、レーザ装置100から出射されたレーザビームを被加工物45へ照射することによって被加工物45を加工する。実施の形態4では、上記の実施の形態1から3と同一の構成要素には同一の符号を付し、実施の形態1から3とは異なる構成について主に説明する。
Claims (7)
- 互いに異なる波長のレーザビームを出射する複数のレーザダイオードと、
前記複数のレーザダイオードにより出射された複数のレーザビームを共振させるミラーと、
レーザビームの光軸の向きが互いに異なる状態で前記複数のレーザダイオードの各々から入射する前記複数のレーザビームを、互いに光軸を一致させて前記ミラーへ進行させる波長分散素子と、
を備え、
前記複数のレーザダイオードの各々は、レーザダイオードの出射端を中心に回転可能な調整用部品と一体に形成されていることを特徴とするレーザ装置。 - 前記出射端の直下には、前記調整用部品の回転中心となる調整用軸を備え、
前記調整用軸は、前記調整用部品が設置される基材と前記調整用部品とに埋め込まれていることを特徴とする請求項1に記載のレーザ装置。 - 前記複数のレーザダイオードの各々は、前記レーザダイオードを冷却するヒートシンクと一体とされており、
前記ヒートシンクには、前記ヒートシンクへの冷媒の流入および前記ヒートシンクからの前記冷媒の流出のための配管が接続されており、
前記配管は、柔軟性を有する樹脂製のホースであることを特徴とする請求項1または2に記載のレーザ装置。 - 前記調整用部品が設置されている設置面から前記配管までの高さが、前記設置面から前記レーザビームの光軸までの高さよりも低いことを特徴とする請求項3に記載のレーザ装置。
- 前記配管を覆う被覆材を備え、
前記被覆材は、前記設置面から前記配管までの高さよりも高い位置であってかつ前記設置面から前記レーザビームの光軸までの高さよりも低い位置に設けられていることを特徴とする請求項4に記載のレーザ装置。 - 前記配管は、前記調整用部品が設置されている設置面よりも前記調整用部品の側とは逆側の位置に設けられていることを特徴とする請求項3に記載のレーザ装置。
- 請求項1から6のいずれか1つに記載のレーザ装置を備え、
前記レーザ装置から出射されたレーザビームを被加工物へ照射することによって前記被加工物を加工することを特徴とするレーザ加工機。
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PCT/JP2019/010682 WO2020183729A1 (ja) | 2019-03-14 | 2019-03-14 | レーザ装置およびレーザ加工機 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20210367408A1 (en) * | 2018-05-24 | 2021-11-25 | Panasonic Intellectual Property Management Co. Ltd | Exchangeable laser resonator modules with angular adjustment |
WO2022003858A1 (ja) * | 2020-07-01 | 2022-01-06 | 日本電信電話株式会社 | レーザ加工装置 |
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JP7387077B1 (ja) * | 2023-04-24 | 2023-11-27 | 三菱電機株式会社 | レーザ装置およびレーザ加工機 |
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JPWO2020183729A1 (ja) | 2021-03-18 |
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US11389895B2 (en) | 2022-07-19 |
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