JP6594694B2 - 無電解ニッケルめっき浴 - Google Patents

無電解ニッケルめっき浴 Download PDF

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Publication number
JP6594694B2
JP6594694B2 JP2015148881A JP2015148881A JP6594694B2 JP 6594694 B2 JP6594694 B2 JP 6594694B2 JP 2015148881 A JP2015148881 A JP 2015148881A JP 2015148881 A JP2015148881 A JP 2015148881A JP 6594694 B2 JP6594694 B2 JP 6594694B2
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JP
Japan
Prior art keywords
nickel plating
electroless nickel
plating bath
present
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015148881A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017031436A (ja
Inventor
剛志 前田
文徳 柴山
克久 田邉
真輔 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C.UYEMURA&CO.,LTD.
Original Assignee
C.UYEMURA&CO.,LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C.UYEMURA&CO.,LTD. filed Critical C.UYEMURA&CO.,LTD.
Priority to JP2015148881A priority Critical patent/JP6594694B2/ja
Priority to TW105119316A priority patent/TWI690618B/zh
Priority to CN201610584716.XA priority patent/CN106399981B/zh
Priority to KR1020160094121A priority patent/KR102502533B1/ko
Publication of JP2017031436A publication Critical patent/JP2017031436A/ja
Application granted granted Critical
Publication of JP6594694B2 publication Critical patent/JP6594694B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D277/00—Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings
    • C07D277/60—Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings condensed with carbocyclic rings or ring systems
    • C07D277/62—Benzothiazoles
    • C07D277/68—Benzothiazoles with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached in position 2
    • C07D277/70—Sulfur atoms
    • C07D277/74—Sulfur atoms substituted by carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
JP2015148881A 2015-07-28 2015-07-28 無電解ニッケルめっき浴 Active JP6594694B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015148881A JP6594694B2 (ja) 2015-07-28 2015-07-28 無電解ニッケルめっき浴
TW105119316A TWI690618B (zh) 2015-07-28 2016-06-20 無電解鎳鍍敷浴
CN201610584716.XA CN106399981B (zh) 2015-07-28 2016-07-22 化学镀镍浴
KR1020160094121A KR102502533B1 (ko) 2015-07-28 2016-07-25 무전해 니켈 도금욕

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015148881A JP6594694B2 (ja) 2015-07-28 2015-07-28 無電解ニッケルめっき浴

Publications (2)

Publication Number Publication Date
JP2017031436A JP2017031436A (ja) 2017-02-09
JP6594694B2 true JP6594694B2 (ja) 2019-10-23

Family

ID=57987773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015148881A Active JP6594694B2 (ja) 2015-07-28 2015-07-28 無電解ニッケルめっき浴

Country Status (4)

Country Link
JP (1) JP6594694B2 (zh)
KR (1) KR102502533B1 (zh)
CN (1) CN106399981B (zh)
TW (1) TWI690618B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108998779B (zh) * 2018-10-13 2020-03-10 绵阳高新区天力机械有限责任公司 一种化学镀液以及环保型合金表面自催化处理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256866A (ja) * 1999-03-10 2000-09-19 Hideo Honma 無電解ニッケルめっき浴
JP2013028866A (ja) * 2006-03-09 2013-02-07 Okuno Chemical Industries Co Ltd 無電解ニッケルめっき液
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法

Also Published As

Publication number Publication date
TWI690618B (zh) 2020-04-11
CN106399981B (zh) 2020-11-06
JP2017031436A (ja) 2017-02-09
CN106399981A (zh) 2017-02-15
TW201710550A (zh) 2017-03-16
KR102502533B1 (ko) 2023-02-21
KR20170013827A (ko) 2017-02-07

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