JP6586394B2 - 静電容量を表すデータを取得する方法 - Google Patents

静電容量を表すデータを取得する方法 Download PDF

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Publication number
JP6586394B2
JP6586394B2 JP2016110095A JP2016110095A JP6586394B2 JP 6586394 B2 JP6586394 B2 JP 6586394B2 JP 2016110095 A JP2016110095 A JP 2016110095A JP 2016110095 A JP2016110095 A JP 2016110095A JP 6586394 B2 JP6586394 B2 JP 6586394B2
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Japan
Prior art keywords
data sets
electrode
processor
sensor
measuring instrument
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JP2016110095A
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Japanese (ja)
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JP2017183683A (ja
Inventor
吉平 杉田
吉平 杉田
朋秀 南
朋秀 南
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to US15/465,056 priority Critical patent/US10074549B2/en
Priority to TW106109865A priority patent/TWI714743B/zh
Priority to KR1020170038184A priority patent/KR102299122B1/ko
Publication of JP2017183683A publication Critical patent/JP2017183683A/ja
Application granted granted Critical
Publication of JP6586394B2 publication Critical patent/JP6586394B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP2016110095A 2016-03-28 2016-06-01 静電容量を表すデータを取得する方法 Active JP6586394B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US15/465,056 US10074549B2 (en) 2016-03-28 2017-03-21 Method for acquiring data indicating electrostatic capacitance
TW106109865A TWI714743B (zh) 2016-03-28 2017-03-24 取得表示靜電電容之數據的方法
KR1020170038184A KR102299122B1 (ko) 2016-03-28 2017-03-27 정전 용량을 나타내는 데이터를 취득하는 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016063649 2016-03-28
JP2016063649 2016-03-28

Publications (2)

Publication Number Publication Date
JP2017183683A JP2017183683A (ja) 2017-10-05
JP6586394B2 true JP6586394B2 (ja) 2019-10-02

Family

ID=60006526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016110095A Active JP6586394B2 (ja) 2016-03-28 2016-06-01 静電容量を表すデータを取得する方法

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JP (1) JP6586394B2 (ko)
KR (1) KR102299122B1 (ko)
TW (1) TWI714743B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102253018B1 (ko) * 2017-10-25 2021-05-17 어플라이드 머티어리얼스, 인코포레이티드 진공 챔버 내에서 사용하기 위한 캐리어, 진공 챔버 내의 이송 어레인지먼트를 테스트하기 위한 시스템, 진공 프로세싱 시스템, 및 진공 챔버 내의 이송 어레인지먼트를 테스트하기 위한 방법
JP7037964B2 (ja) * 2018-03-09 2022-03-17 東京エレクトロン株式会社 測定器、及びフォーカスリングを検査するためのシステムの動作方法
JP7029983B2 (ja) * 2018-03-09 2022-03-04 東京エレクトロン株式会社 測定器及び測定器のずれ量を求める方法
JP7126466B2 (ja) 2018-12-12 2022-08-26 東京エレクトロン株式会社 基板処理システム、搬送方法、および搬送プログラム
US11581206B2 (en) 2020-03-06 2023-02-14 Applied Materials, Inc. Capacitive sensor for chamber condition monitoring
JP7530779B2 (ja) 2020-09-10 2024-08-08 東京エレクトロン株式会社 実行装置及び実行方法
WO2024166743A1 (ja) * 2023-02-06 2024-08-15 東京エレクトロン株式会社 測定器及び測定方法
US11899516B1 (en) 2023-07-13 2024-02-13 T-Mobile Usa, Inc. Creation of a digital twin for auto-discovery of hierarchy in power monitoring

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2878913B2 (ja) * 1992-09-14 1999-04-05 株式会社ミツトヨ 変位測定装置
JP4524011B2 (ja) * 1999-09-24 2010-08-11 株式会社フォトニクス 距離測定装置
NL1017593C2 (nl) * 2001-03-14 2002-09-17 Asm Int Inspectiesysteem ten behoeve van procesapparaten voor het behandelen van substraten, alsmede een sensor bestemd voor een dergelijk inspectiesysteem en een werkwijze voor het inspecteren van procesapparaten.
JP3913026B2 (ja) * 2001-10-18 2007-05-09 サムタク株式会社 リニアスケールの信号処理装置及び方法
US6813543B2 (en) * 2002-10-08 2004-11-02 Brooks-Pri Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
JP2004319857A (ja) * 2003-04-18 2004-11-11 Matsushita Electric Ind Co Ltd 半導体製造装置のモニタリングシステム
TWI488236B (zh) * 2003-09-05 2015-06-11 Tokyo Electron Ltd Focusing ring and plasma processing device
JP4782990B2 (ja) * 2004-05-31 2011-09-28 株式会社ミツトヨ 表面倣い測定装置、表面倣い測定方法、表面倣い測定プログラムおよび記録媒体
JP4006004B2 (ja) * 2004-12-28 2007-11-14 株式会社東芝 半導体製造装置及び半導体装置の製造方法
JP4562551B2 (ja) * 2005-03-02 2010-10-13 北斗電子工業株式会社 インピーダンス検出装置
JP5105399B2 (ja) * 2006-08-08 2012-12-26 東京エレクトロン株式会社 データ収集方法，基板処理装置，基板処理システム
JP5102500B2 (ja) * 2007-01-22 2012-12-19 東京エレクトロン株式会社 基板処理装置
JP2009054993A (ja) * 2007-08-02 2009-03-12 Tokyo Electron Ltd 位置検出用治具
JP4956328B2 (ja) * 2007-08-24 2012-06-20 東京エレクトロン株式会社 搬送アームの移動位置の調整方法及び位置検出用治具
JP5009870B2 (ja) * 2008-07-22 2012-08-22 日本特殊陶業株式会社 静電容量式センサの異常検出装置
JP5582823B2 (ja) * 2010-02-26 2014-09-03 東京エレクトロン株式会社 自動整合装置及びプラズマ処理装置

Also Published As

Publication number Publication date
TWI714743B (zh) 2021-01-01
KR102299122B1 (ko) 2021-09-06
KR20170113262A (ko) 2017-10-12
JP2017183683A (ja) 2017-10-05
TW201809689A (zh) 2018-03-16

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