JP6576899B2 - 加飾層/樹脂積層構造ハウジング及びその製造装置 - Google Patents
加飾層/樹脂積層構造ハウジング及びその製造装置 Download PDFInfo
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- JP6576899B2 JP6576899B2 JP2016218427A JP2016218427A JP6576899B2 JP 6576899 B2 JP6576899 B2 JP 6576899B2 JP 2016218427 A JP2016218427 A JP 2016218427A JP 2016218427 A JP2016218427 A JP 2016218427A JP 6576899 B2 JP6576899 B2 JP 6576899B2
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Description
41 加飾層
42 接着樹脂層
43 不織布層
44 有色塗膜
45 基盤樹脂層
46 窓
47 文字
48 記号
Claims (11)
- 加飾層と、前記加飾層に接着樹脂塗布層を介して接着された不織布層と、前記不織布層の各繊維の隙間に浸潤しつつ前記加飾層に固着された基盤樹脂層とを備え、前記不織布層は、表面又は両面に切り欠きパターンを有する有色塗膜が形成された、加飾層/樹脂積層構造ハウジング。
- 前記切り欠きパターンは、前記不織布層の表面に形成された、請求項1に記載の加飾層/樹脂積層構造ハウジング。
- 前記切り欠きパターンは、前記不織布層の両面に形成された、請求項1に記載の加飾層/樹脂積層構造ハウジング。
- 前記加飾層は、本杢層及びテキスタイル層の少なくとも一方からなる、請求項1から請求項3のいずれか1項に記載の加飾層/樹脂積層構造ハウジング。
- 前記切り欠きパターンは、文字、記号、又は模様からなる、請求項1から請求項4のいずれか1項に記載の加飾層/樹脂積層構造ハウジング。
- 前記ハウジングは、前記切り欠きパターンの部分がスイッチを構成するように適宜な配線を内蔵する、請求項1から請求項5のいずれか1項に記載の加飾層/樹脂積層構造ハウジング。
- 前記基盤樹脂層は、光透過性熱可塑性樹脂からなる、請求項1から請求項6のいずれか1項に記載の加飾層/樹脂積層構造ハウジング。
- 前記光透過性熱可塑性樹脂は、射出成形用合成樹脂からなる、請求項7に記載の加飾層/樹脂積層構造ハウジング。
- 前記射出成形用合成樹脂は、PMMA、透明ABS、PC、及びPC+ABSの群から選択された1つの素材からなる、請求項8に記載の加飾層/樹脂積層構造ハウジング。
- 加飾層と、前記加飾層に接着樹脂塗布層を介して接着された不織布層とを備え、前記不織布層の表面又は両面に、切り欠きパターンを有する有色塗膜が形成された積層体を、前記不織布層を表にして固定金型に配置する工程と、
前記積層体を前記固定金型の中に押し込むように、可動金型を前記固定金型に向けて移動させることで前記積層体を成形する工程と、
成形された前記積層体を、前記不織布層を表にして他の固定金型に配置する工程と、
前記積層体に向けて射出成形金型を移動させ、前記積層体と前記射出成形金型とで規定される空間に樹脂溶融液を射出する工程と、
前記樹脂溶融液を冷却し固化することで、前記積層体に固着された基盤樹脂層を形成する工程と、を備えた加飾層/樹脂積層構造ハウジングの製造方法。 - 加飾層と、前記加飾層に接着樹脂塗布層を介して接着された不織布層とを備え、前記不織布層の表面又は両面に、切り欠きパターンを有する有色塗膜が形成された積層体を、前記不織布層を表にして固定金型に配置する工程と、
前記積層体を前記固定金型の中に押し込むように、可動金型を前記固定金型に向けて移動させることで前記積層体を成形する工程と、
前記積層体に向けて射出成形金型を移動させ、前記積層体と前記射出成形金型とで規定される空間に樹脂溶融液を射出する工程と、
前記樹脂溶融液を冷却し固化することで、前記積層体に固着された基盤樹脂層を形成する工程と、を備えた加飾層/樹脂積層構造ハウジングの製造方法。
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